E7 Pro Series Q170, Q670 Edge systema AI
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Series APQ E7 Pro vires suggestuum E7 Pro-Q670 et E7 Pro-Q170 coniungit, solutiones provectas pro computatione marginali et systematibus collaborationis inter vehicula et vias offerens. Suggestus E7 Pro-Q670 ad applicationes computationis marginalis summae efficacitatis designatus est, processoribus Intel® LGA1700 duodecimae/tredecimae generationis instructus. Hoc suggestum ideale est ad algorithmos intellegentiae artificialis complexos tractandos et magnas copias datorum efficaciter tractandas, sustentatum a robusto apparatu interfacierum expansionis, ut PCIe, mini PCIe, et soccos M.2, pro necessitatibus applicationum configurabilibus. Designatio refrigerationis passivae sine ventilatore operationem quietam et efficaciam fidam per longiora tempora praestat, idque aptum reddit ad ambitus computationis marginalis exigentes.
Ex altera parte, suggestus E7 Pro-Q170 ad collaborationem inter vehicula et vias specialiter designatus est, processoribus Intel® LGA1511 sextae ad nonam generationis una cum chipset Intel® Q170 utens, ut vim computationalem exceptionalem ad notitias in tempore reali tractandas et decisiones capiendas in systematibus transportationis modernis offerat. Cum suis facultatibus communicationis amplis, inter quas sunt multae interfacies retiales celerrimae et portus seriales, E7 Pro-Q170 conectivitatem continuam cum ampla varietate machinarum facilitat. Praeterea, facultas eius functiones sine filo amplificandi, inter quas 4G/5G, WIFI, et Bluetooth, monitorium et administrationem remotam permittit, efficientiam administrationis negotiationis intelligentis et applicationum gubernationis autonomae augens. Una, suggestus seriei E7 Pro fundamentum versatile et validum pro ampla varietate applicationum industrialium praebent, demonstrantes dedicationem APQ ad innovationem et qualitatem in foro computatrorum personalium industrialium.
| Modellum | E7 Pro | |
| CPU | CPU | CPU Intel® sextae/septimae/octavae/nonae generationis Core / Pentium/Celeron pro computatris personalibus |
| TDP | 65W | |
| Socket | LGA1151 | |
| Microprocessus | Q170 | |
| BIOS | AMI UEFI BIOS (Sustentatio Temporis Custodis) | |
| Memoria | Socket | Duo foramina U-DIMM non-ECC, DDR4 duplex canalis usque ad 2133MHz |
| Capacitas Maxima | 64GB, Singulum Maximum 32GB | |
| Graphica | Moderator | Intel® HD Graphics |
| Aethernet | Moderator | 1 * Intel i210-AT GbE LAN Microprocessus (10/100/1000 Mbps)1 * Intel i219-LM/V GbE LAN Chip (10/100/1000 Mbps) |
| Repositorium | SATA | 3 * 2.5" SATA, spatia discorum rigidorum celeriter liberanda (T≤7mm)), RAID 0, 1, 5 sustinent |
| M.2 | 1 * M.2 Key-M (PCIe x4 Gen 3 + SATA3.0, NVMe/SATA SSD Auto Detect, 2242/2260/2280) | |
| Areae Expansionis | Solium PCIe | Schedae moduli PCIe sustinentur (1 * PCIe x 16 + 1 * PCIe x4 / 1 * PCIe x16 + 3 * PCI / 2 * PCIe x8 + 2 * PCI)PS: Longitudo chartae expansionis limitata 320mm, TDP limitatum 450W |
| Ianua/MXM | 2* APQ MXM /aDoor Bus (Facultativa MXM 4 * LAN/4 * POE/6 * COM/16 * GPIO charta expansionis) | |
| Mini PCIe | 1 * Mini PCIe (PCIe2.0 x1 + USB 2.0, cum 1 * spatio pro scheda Nano SIM) | |
| M.2 | 1 * Clavis M.2-B (PCIe2.0 x1 + USB3.0, cum 1 * Schedula SIM, 3042/3052) | |
| I/O anterior | Aethernet | Duo * RJ45 |
| USB | 6 * USB 3.0 (Typus-A, 5Gbps) | |
| Ostendere | 1 * DVI-D: resolutio maxima usque ad 1920*1200 @ 60Hz1 * VGA (DB15/F): resolutio maxima usque ad 1920*1200 @ 60Hz 1 * DP: resolutio maxima usque ad 4096*2160 @ 60Hz | |
| Audio | 2 * Jack 3.5mm (Exitus Linearis + Microphonum) | |
| Serialis | 2 * RS232/422/485 (COM1/2, DB9/M, Viae Plenae, Commutator BIOS)Duo RS232 (COM3/4, DB9/M) | |
| Globulus | 1 * Globulus Potestatis + LED Potestatis1 * Globulus Systematis Restituendi (Preme 0.2 ad 1s ad memoriam denuo incipiendam, et preme 3s ad CMOS purgandum) | |
| I/O posterior | Antenna | 6 * Foramen antennae |
| Ingressus/Egressus Internus | USB | 2 * USB 2.0 (lamella, interna I/O) |
| LCD | 1 * LVDS (lamella): resolutio maxima usque ad 1920 * 1200 @ 60Hz | |
| Tabula anterior | 1 * Tabula TF (3 * USB 2.0 + Tabula F, crustulum) | |
| Tabula Frontalis | 1 * Tabula Frontalis (lamella) | |
| Orator | 1 * Orator (2-W (per canalem)/8-Ω Onera, crustulum) | |
| Serialis | 2 * RS232 (COM5/6, crustulum, 8x2pin, PHD2.0) | |
| GPIO | 1 * GPIO 16-bit (lamella) | |
| LPC | 1 * LPC (oblectum) | |
| SATA | 3 * Connectores SATA3.0 7P | |
| Potentia SATA | 3 * SATA Potentia (SATA_PWR1/2/3, crustulum) | |
| SIM | Duae * Nano SIM | |
| VENTILATOR | 2 * VENTILATOR SYSTEM (lamella) | |
| Fons Potentiae | Typus | DC, AT/ATX |
| Tensio Potentiae Ingressae | 18~62VDC, P=600/800/1000W | |
| Coniunctor | 1 * Coniunctor trium clavorum, P=10.16 | |
| Accumulator RTC | Cellula Nummaria CR2032 | |
| Auxilium Systematis Operativi | Fenestrae | Nucleus 6/7™: Fenestrae 7/10/11Nucleus 8/9™: Fenestrae 10/11 |
| Linux | Linux | |
| Custos | Exitus | Restitutio Systematis |
| Intervallum | Programmabile 1 ~ 255 sec | |
| Mechanica | Materia clausurae | Radiator: Aluminium, Arca: SGCC |
| Dimensiones | 363mm (L) * 270mm (L) * 169mm (A) | |
| Pondus | Nettum: 10.48 kg, Summa: 11.38 kg (involucro incluso) | |
| Montatio | VESA, Muralis affixus, Mensae affixus | |
| Ambitus | Systema Dissiptionis Caloris | Sine ventilatore (CPU)Ventilator PWM 2*9cm (Internus) |
| Temperatura Operativa | -20~60℃ (SSD vel M.2 repositione) | |
| Temperatura Reponendi | -40~80℃ | |
| Humiditas Relativa | 5 ad 95% RH (non condensans) | |
| Vibratio Inter Operationem | Cum SSD: IEC 60068-2-64 (3Grms@5~500Hz, fortuitum, 1hr/axe) | |
| Impetus Inter Operationem | Cum SSD: IEC 60068-2-27 (30G, dimidia sinus, 11ms) | |
| Certificatio | CCC, CE/FCC, RoHS | |
| Modellum | E7 Pro | |
| CPU | CPU | Processorius Intel® Core/Pentium/Celeron duodecimae/tredecimae generationis pro computatris personalibus |
| TDP | 65W | |
| Socket | LGA1700 | |
| Microprocessus | Q670 | |
| BIOS | AMI 256 Mbit SPI | |
| Memoria | Socket | Duo fissurae SO-DIMM non-ECC, DDR4 canalis duplicis usque ad 3200MHz |
| Capacitas Maxima | 64GB, Singulum Max. 32GB | |
| Graphica | Moderator | Intel® UHD Graphica |
| Aethernet | Moderator | 1 * Intel i219-LM 1GbE LAN Microprocessus (LAN1, 10/100/1000 Mbps, RJ45)1 * Intel i225-V 2.5GbE LAN Microprocessus (LAN2, 10/100/1000/2500 Mbps, RJ45) |
| Repositorium | SATA | 3 * SATA3.0, spatia discorum rigidorum celeriter liberabilia (T≤7mm), RAID 0, 1, 5 sustinent |
| M.2 | 1 * M.2 Key-M (PCIe x4 Gen 4 + SATA3.0, NVMe/SATA SSD Auto Detect, 2242/2260/2280) | |
| Areae Expansionis | Solium PCIe | Schedae moduli PCIe sustinentur (1 * PCIe x 16 + 1 * PCIe x4 / 1 * PCIe x16 + 3 * PCI / 2 * PCIe x8 + 2 * PCI)PS: Longitudo chartae expansionis limitata 320mm, TDP limitatum 450W |
| Ianua | Ianua 1 ad functionem serialem expansivam (exempli gratia: COM / CAN)aDoor2 ad expansionem APQ aDoor moduli expansionis seriei AR | |
| Mini PCIe | 1 * Mini PCI-E Slot (PCIe x1 + USB, Wifi/3G/4G sustinetur, cum 1 * Nano SIM Slot)1 * Mini PCI-E Slot (PCIe x1 + USB, Wifi/3G/4G sustinetur, cum 1 * Nano SIM Slot) | |
| M.2 | 1 * M.2 Key-E spatium (PCIe+USB, Wifi+BT,2230) | |
| I/O anterior | Aethernet | Duo * RJ45 |
| USB | 2 * USB3.2 Gen 2x1 (Typus-A, 10Gbps)6 * USB3.2 Gen 1x1 (Typus-A, 5Gbps) | |
| Ostendere | 1 * HDMI 1.4b: resolutio maxima usque ad 4096 * 2160 @ 30Hz1 * DP1.4a: resolutio maxima usque ad 4096*2160@60Hz | |
| Audio | Codec HDA Realtek ALC269Q-VB6 5.1 Canalium1 * Line-Out + Microphonum 3.5mm Jack | |
| Serialis | 2 * RS232/485/422 (COM1/2, DB9/M, Viae Plenae, Commutator BIOS)2 * RS232 (COM3/4, DB9/M, Viae Plenae) | |
| Globulus | 1 * Globulus/LED Potestatis1 * AT/ATX Bulla 1 * Systema Operandi Recuperandi Bulla 1 * Bulla Restitutionis Systematis | |
| I/O posterior | Antenna | 6 * Foramen antennae |
| Ingressus/Egressus Internus | USB | 6 * USB 2.0 (lamella, interna I/O) |
| LCD | 1 * LVDS (lamella): Resolutio LVDS usque ad 1920 * 1200 @ 60Hz | |
| Tabula Frontalis | 1 * FPanel (FPANEL, PWR + RST + LED, crustulum, 5 x 2pin, P = 2.0) | |
| Audio | 1 * Audio (Caput, 5x2pin, 2.54mm)1 * Orator (2W 8Ω, lamella, 4x1pin, PH2.0) | |
| Serialis | 2 * RS232 (COM5/6, crustulum, 8x2pin, PHD2.0) | |
| GPIO | 1 * 16 bit DIO (8xDI et 8xDO, crustulum, 10x2pin, PHD2.0) | |
| LPC | 1 * LPC (lamella, 8x2Pin, PHD2.0) | |
| SATA | Connectores 3 SATA3.0 7P, usque ad 600MB/s | |
| Potentia SATA | 3 * SATA Potentia (lamella, 4x1Pin, PH2.0) | |
| SIM | Duae * Nano SIM | |
| VENTILATOR | 2 * SYS FAN (4x1Pin, KF2510-4A) | |
| Fons Potentiae | Typus | DC, AT/ATX |
| Tensio Potentiae Ingressae | 18~62VDC, P=600/800/1000W | |
| Coniunctor | 1 * Coniunctor trium clavorum, P=10.16 | |
| Accumulator RTC | Cellula Nummaria CR2032 | |
| Auxilium Systematis Operativi | Fenestrae | Fenestrae 10/11 |
| Linux | Linux | |
| Custos | Exitus | Restitutio Systematis |
| Intervallum | Programmabile 1 ~ 255 sec | |
| Mechanica | Materia clausurae | Radiator: Aluminium, Arca: SGCC |
| Dimensiones | 363mm (L) * 270mm (L) * 169mm (A) | |
| Pondus | Nettum: 10.48 kg, Summa: 11.38 kg (involucro incluso) | |
| Montatio | VESA, Muralis affixus, Mensae affixus | |
| Ambitus | Systema Dissiptionis Caloris | Sine ventilatore (CPU)Ventilator PWM 2*9cm (Internus) |
| Temperatura Operativa | -20~60℃ (SSD vel M.2 repositione) | |
| Temperatura Reponendi | -40~80℃ | |
| Humiditas Relativa | 5 ad 95% RH (non condensans) | |
| Vibratio Inter Operationem | Cum SSD: IEC 60068-2-64 (3Grms@5~500Hz, fortuitum, 1hr/axe) | |
| Impetus Inter Operationem | Cum SSD: IEC 60068-2-27 (30G, dimidia sinus, 11ms) | |
EXEMPLA ACQUIRE
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