Producta

Computatrum Industriale Incorporatus E7L

Computatrum Industriale Incorporatus E7L

Proprietates:

  • Sustinet CPU Intel® sextae ad nonae generationis Core / Pentium / Celeron pro computatris personalibus, TDP 35W, LGA1151
  • Instructum cum chipset Intel® Q170
  • Duae interfacies Intel Gigabit Ethernet
  • Duo spatia DDR4 SO-DIMM, usque ad 64GB sustinentia
  • Quattuor portae seriales DB9 (COM1/2 RS232/RS422/RS485 sustinent)
  • Quattuor exitus monitorii: VGA, DVI-D, DP, et LVDS/eDP internus, resolutionem usque ad 4K@60Hz sustinens.
  • Sustinet expansionem functionum sine filo 4G/5G/WIFI/BT
  • Expansionem modulorum MXM et aDoor sustinet.
  • Sustentatio optionalis pro soculis expansionis normae PCIe/PCI
  • Fons potentiae 9~36V DC (12V ad libitum)
  • Refrigeratio passiva sine ventilatore

 


  • Administratio remota

    Administratio remota

  • Monitorium condicionis

    Monitorium condicionis

  • Operatio et sustentatio remota

    Operatio et sustentatio remota

  • Imperium Salutis

    Imperium Salutis

Descriptio Producti

Computatra industrialia inclusa seriei APQ E7L, inter quae suggesta H610, Q670, et Q170, in prima acie solutionum automationis industrialis et computationis marginalis stant. Pro CPU Intel® 12/13 generationis Core / Pentium/Celeron Desktop accommodata, suggesta H610 et Q670 mixturam potentiae et efficaciae offerunt, aptam ad latam varietatem condicionum industrialium. Haec suggesta conexiones retiales celerrimas cum duplicibus interfaciebus Intel Gigabit faciliorem reddunt et exitus ostensionis altae definitionis usque ad 4K@60Hz sustinent, imagines vividas per varias applicationes praestantes. Cum amplis foraminibus expansionis USB, serialibus, et PCIe, una cum designo refrigerationis passivae sine ventilatore, firmitatem, operationem silentium, et adaptabilitatem ad requisita specifica applicationum praestant.

Ex altera parte, suggestus Q170 aptatus est ad processores Intel® sextae ad nonam generationem, vim computationalem et stabilitatem exceptionalem praebens ad opera data intensa in systematibus collaborationis viae-vehiculi aliisque applicationibus industrialibus. Facultates communicationis robustas, amplam memoriae copiam, et optiones memoriae expandibiles praebet ad computationes complexas et tractationem datorum tractandas. Praeterea, series expansionem functionum sine filo, inter quas 4G/5G, WIFI, et Bluetooth, offert, connectivitatem et facultates administrationis remotae amplificans. In omnibus suggestis, Series E7L dedicationem APQ ad innovationem incorporat, solutiones altae efficacitatis et configurabiles pro requisitis exigentibus automationis industrialis et ambitus computationis marginalis offerens.

INTRODUCTIO

Delineatio Ingeniaria

Demptio fasciculi

H81
H610
Q170
Q670
H81

Modellum

E7L

E7DL

CPU

CPU Intel®CPU computatralis quartae/quintae generationis Core / Pentium / Celeron
TDP 35W
Socket LGA1150

Microprocessus

Microprocessus Intel®H81

BIOS

BIOS AMI UEFI BIOS (Sustentatio Temporis Custodis)

Memoria

Socket Duo fissurae SO-DIMM non-ECC, DDR3 duplex usque ad 1600MHz
Capacitas Maxima 16GB, Singulum Maximum 8GB

Graphica

Moderator Intel®Graphicae Altae Definitionis (HD)

Aethernet

Moderator 1 * Intel i210-AT GbE LAN Microprocessus (10/100/1000 Mbps)

1 * Intel i218-LM/V GbE LAN Chip (10/100/1000 Mbps)

Repositorium

SATA 1 * SATA3.0, spatia discorum rigidorum 2.5" celeriter liberanda (T≤7mm)
1 * SATA2.0, spatia interna pro disco duro 2.5" (T≤9mm, optionalia)
M.2 1 * Clavis M.2-M (SATA3.0, 2280)

Expansin Slots

PCIe/PCI N/A 1: 1 * PCIe x16 (x16)

2: 2 * PCI

PS: ①、②Una ex duabus, longitudo chartae expansionis ≤ 185mm, TDP ≤ 130W

MXM/aIanua 1 * APQ MXM (Facultativa MXM 4 * LAN/4 * POE/6 * COM/16 * GPIO charta expansionis)

1 * Slot Expansionis Ianuae

Mini PCIe 1 * Mini PCIe (PCIe2.0 x1 (signum PCIe cum MXM communicat, si placet) + USB 2.0, cum 1 * Nano SIM Card)

I/O anterior

Aethernet Duo * RJ45
USB 2 * USB 3.0 (Typus-A, 5Gbps)

4 * USB 2.0 (Typus-A)

Ostendere 1 * DVI-D: resolutio maxima usque ad 1920*1200 @ 60Hz

1 * VGA (DB15/F): resolutio maxima usque ad 1920*1200 @ 60Hz

1 * DP: resolutio maxima usque ad 4096*2160 @ 60Hz

Audio 2 * Jack 3.5mm (Exitus Linearis + Microphonum)
Serialis 2 * RS232/422/485 (COM1/2, DB9/M, Viae Plenae, Commutator BIOS)

Duo RS232 (COM3/4, DB9/M)

Globulus 1 * Globulus Potestatis + LED Potestatis

1 * Globulus Systematis Restituendi (Preme 0.2 ad 1s ad memoriam denuo incipiendam, et preme 3s ad CMOS purgandum)

I/O posterior

Antenna 4 * Foramen antennae
SIM 1 * Spatium pro scheda Nano SIM (SIM1)

Ingressus/Egressus Internus

USB 2 * USB2.0 (lamella)
LCD 1 * LVDS (lamella): resolutio maxima usque ad 1920 * 1200 @ 60Hz
Tabula anterior 1 * TF_Panel (3 * USB 2.0 + FPANEL, crustulum)
Tabula Frontalis 1 * Tabula Frontalis (PWR + RST + LED, lamella)
Orator 1 * Orator (2-W (per canalem)/8-Ω Onera, crustulum)
Serialis 2 * RS232 (COM5/6, crustulum)
GPIO 1 * 16 bitorum DIO (8xDI et 8xDO, crustulum)
LPC 1 * LPC (oblectum)
SATA 2 * Connectores SATA 7P
Potentia SATA 2 * SATA Power (SATA_PWR1/2, crustulum)
VENTILATOR 1 * Ventilator CPU (lamella)
2 * VENTILATOR SYSTEM (lamella)

Fons Potentiae

Typus DC, AT/ATX
Tensio Potentiae Ingressae 9 ~ 36VDC, P≤240W
Coniunctor 1 * Coniunctor quattuor aciculorum, P=5.00/5.08
Accumulator RTC Cellula Nummaria CR2032

Auxilium Systematis Operativi

Fenestrae Fenestrae 7/10/11
Linux Linux

Custos

Exitus Restitutio Systematis
Intervallum Programmabile per programmatum ab 1 ad 255 secundas

Mechanica

Materia clausurae Radiator: Mixtura aluminii, Arca: SGCC
Dimensiones 268mm (L) * 194.2mm (L) * 67.7mm (A) 268mm (L) * 194.2mm (L) * 118.5mm (A)
Pondus Pondus netum: 4.5 kg

Summa: 6 kg (Involucro incluso)

Pondus netum: 4.7 kg

Summa: 6.2 kg (Involucro incluso)

Montatio VESA, Murale, Mensae

Ambitus

Systema Dissiptionis Caloris Refrigeratio Passiva Sine Ventilatore
Temperatura Operativa -20~60℃ (SSD Industrialis)
Temperatura Reponendi -40~80℃ (SSD Industrialis)
Humiditas Relativa 10 ad 90% RH (non condensans)
Vibratio Inter Operationem Cum SSD: IEC 60068-2-64 (3Grms@5~500Hz, fortuitum, 1hr/axe)
Impetus Inter Operationem Cum SSD: IEC 60068-2-27 (30G, dimidia sinus, 11ms)
Certificatio CCC, CE/FCC, RoHS
H610

Modellum

E7L

E7DL

CPU

CPU Intel® 12/13tCPU computatralis generationis h Core / Pentium / Celeron
TDP 35W
Socket LGA1700
Microprocessus H610
BIOS AMI 256 Mbit SPI

Memoria

Socket Duo fissurae SO-DIMM non-ECC, DDR4 canalis duplicis usque ad 3200MHz
Capacitas Maxima 64GB, Singulum Maximum 32GB

Graphica

Moderator Intel®Graphica UHD

Aethernet

Moderator 1 * Intel i219-LM/V 1GbE LAN Microprocessus (LAN1, 10/100/1000 Mbps)

1 * Intel i225-V/LM 2.5GbE LAN Microprocessus (LAN2, 10/100/1000/2500 Mbps)

Repositorium

SATA 1 * SATA3.0, spatia discorum rigidorum 2.5" celeriter liberanda (T≤7mm)

1 * SATA3.0, spatia interna pro disco duro 2.5" (T≤9mm, optionalia)

M.2 1 * Clavis M.2-M (SATA3.0, 2280)

Areae Expansionis

Solium PCIe N/A 1: 1 * PCIe x16 (x16)2: 2 * PCIPS: 1...②Una ex duabus, longitudo chartae expansionis ≤ 185mm, TDP ≤ 130W
aIanua 1 * aDoor Bus (Optionalis 4 * LAN/4 * POE/6 * COM/16 * GPIO charta expansionis)
Mini PCIe 1 * Mini PCIe (PCIe3.0 x1 + USB 2.0, cum 1 * Nano SIM Card)

I/O anterior

Aethernet Duo * RJ45
USB 2 * USB3.2 Gen2x1 (Typus-A, 10Gbps)

2 * USB3.2 Gen1x1 (Typus-A, 5Gbps)

2 * USB 2.0 (Typus-A)

Ostendere 1 * HDMI 1.4b: resolutio maxima usque ad 4096 * 2160 @ 30Hz

1 * DP1.4a: resolutio maxima usque ad 4096*2160 @ 60Hz

Audio 2 * Jack 3.5mm (Exitus Linearis + Microphonum)
Serialis 2 * RS232/422/485 (COM1/2, DB9/M, Viae Plenae, Commutator BIOS)

2 * RS232 (COM3/4, DB9/M, Viae Plenae)

Globulus 1 * Globulus Potestatis + LED Potestatis

1 * AT/ATX Bulla

1 * Systema Operandi Recuperandi Bulla

1 * Bulla Restitutionis Systematis

I/O posterior

Antenna 4 * Foramen antennae
SIM 1* Spatium pro scheda Nano SIM (SIM1))

Ingressus/Egressus Internus

USB 6 * USB2.0 (lamellae)
LCD 1 * LVDS (lamella): resolutio maxima usque ad 1920 * 1200 @ 60Hz
Tabula Frontalis 1 * Tabula Frontalis (PWR + RST + LED, lamella)
Audio 1 * Audio (Caput)

1 * Orator (2-W (per canalem)/8-Ω Onera, crustulum)

Serialis 2 * RS232 (COM5/6, crustulum)
GPIO 1 * 16 bitorum DIO (8xDI et 8xDO, crustulum)
LPC 1 * LPC (oblectum)
SATA Connectores SATA 7P tres, usque ad 600MB/s
Potentia SATA 3 * SATA Potentia (lamella)
VENTILATOR 1 * Ventilator CPU (lamella)

2 * VENTILATOR SYSTEMATI (KF2510-4A)

Fons Potentiae

Typus DC, AT/ATX
Tensio Potentiae Ingressae 9~36VDC, P≤240W

18~60VDC, P≤400W

Coniunctor 1 * Coniunctor quattuor aciculorum, P=5.00/5.08
Accumulator RTC Cellula Nummaria CR2032

Auxilium Systematis Operativi

Fenestrae Fenestrae 10/11
Linux Linux

Custos

Exitus Restitutio Systematis
Intervallum Programmabile 1 ~ 255 sec

Mechanica

Materia clausurae Radiator: Mixtura aluminii, Arca: SGCC
Dimensiones 268mm (L) * 194.2mm (L) * 67.7mm (A) 268mm (L) * 194.2mm (L) * 118.5mm (A)
Pondus Pondus netum: 4.5 kgSumma: 6 kg (Involucro incluso) Pondus netum: 4.7 kgSumma: 6.2 kg (Involucro incluso)
Montatio VESA, Murale, Mensae

Ambitus

Systema Dissiptionis Caloris Refrigeratio Passiva Sine Ventilatore
Temperatura Operativa -20 ~ 60℃ (SSD Industrialis)
Temperatura Reponendi -40 ~ 80℃ (SSD Industrialis)
Humiditas Relativa 10 ad 90% RH (non condensans)
Vibratio Inter Operationem Cum SSD: IEC 60068-2-64 (3Grms@5~500Hz, fortuitum, 1hr/axe)
Impetus Inter Operationem Cum SSD: IEC 60068-2-27 (30G, dimidia sinus, 11ms)
Certificatio CE/FCC, RoHS
Q170

Modellum

E7L

E7DL

E7QL

CPU

CPU Intel®Processores computatrales computatrales Core / Pentium / Celeron generationis sextae/septimae/octavae/nonae
TDP 35W
Socket LGA1151

Microprocessus

Microprocessus Q170

BIOS

BIOS AMI UEFI BIOS (Sustentatio Temporis Custodis)

Memoria

Socket Duo fissurae SO-DIMM non-ECC, DDR4 canalis duplicis usque ad 2133MHz
Capacitas Maxima 64GB, Singulum Maximum 32GB

Graphica

Moderator Intel®Graphicae Altae Definitionis (HD)

Aethernet

Moderator 1 * Intel i210-AT GbE LAN Microprocessus (10/100/1000 Mbps)

1 * Intel i219-LM/V GbE LAN Chip (10/100/1000 Mbps)

Repositorium

SATA 1 * SATA3.0, spatia discorum rigidorum 2.5" celeriter liberanda (T≤7mm)

1 * SATA3.0, spatia interna pro disco duro 2.5" (T≤9mm, optionalia)

RAID 0, 1 sustinet
M.2 1 * M.2 Key-M (PCIe x4 Gen 3 + SATA3.0, NVMe/SATA SSD Auto Detect, 2280)

Expansin Slots

PCIe/PCI N/A 1: 1 * PCIe x16 (x16) + 1 * PCIe x4 (x4)

2: 1 * PCIe x16 + 1 * PCI

3: 2 * PCI

PS: ①、②、③ Una ex tribus, Longitudo chartae expansionis ≤ 185mm, TDP ≤ 130W
1: 2 * PCIe x16 (x8/x8) + 2 * PCI

2: 1 * PCIe x16 (x16) + 1 * PCIe x4 (x4)

PS: ①、② Una ex duabus, Longitudo chartae expansionis ≤ 185mm, TDP ≤ 130W

MXM/aIanua 1 * APQ MXM (Facultativa MXM 4 * LAN/4 * POE/6 * COM/16 * charta expansionis GPIO)
Mini PCIe 1 * Mini PCIe (PCIe x1 Gen 2 + USB 2.0, cum 1 * Scheda SIM)
M.2 1 * Clavis M.2-B (PCIe x1 Gen 2 + USB3.0, cum 1 * Schedula SIM, 3052)

I/O anterior

Aethernet Duo * RJ45
USB 6 * USB 3.0 (Typus-A, 5Gbps)
Ostendere 1 * DVI-D: resolutio maxima usque ad 1920*1200 @ 60Hz

1 * VGA (DB15/F): resolutio maxima usque ad 1920*1200 @ 60Hz

1 * DP: resolutio maxima usque ad 4096*2160 @ 60Hz
Audio 2 * Jack 3.5mm (Exitus Linearis + Microphonum)
Serialis 2 * RS232/422/485 (COM1/2, DB9/M, Viae Plenae, Commutator BIOS)

Duo RS232 (COM3/4, DB9/M)
Globulus 1 * Globulus Potestatis + LED Potestatis

1 * Globulus Systematis Restituendi (Preme 0.2 ad 1s ad memoriam denuo incipiendam, et preme 3s ad CMOS purgandum)

I/O posterior

Antenna 4 * Foramen antennae
SIM Duo foramina pro chartis Nano SIM

Ingressus/Egressus Internus

USB 2 * USB2.0 (lamella)
LCD 1 * LVDS (lamella): resolutio maxima usque ad 1920 * 1200 @ 60Hz
Tabula anterior 1 * TF_Panel (3 * USB 2.0 + FPANEL, crustulum)
Tabula Frontalis 1 * Tabula Frontalis (PWR + RST + LED, lamella)
Orator 1 * Orator (2-W (per canalem)/8-Ω Onera, crustulum)
Serialis 2 * RS232 (COM5/6, crustulum)
GPIO 1 * 16 bitorum DIO (8xDI et 8xDO, crustulum)
LPC 1 * LPC (oblectum)
SATA 2 * Connectores SATA 7P
Potentia SATA 2 * SATA Potentia (lamella)
VENTILATOR 1 * Ventilator CPU (lamella)

2 * VENTILATOR SYSTEM (lamella)

Fons Potentiae

Typus DC, AT/ATX
Tensio Potentiae Ingressae 9 ~ 36VDC, P≤240W
Coniunctor 1 * Coniunctor quattuor aciculorum, P=5.00/5.08
Accumulator RTC Cellula Nummaria CR2032

Auxilium Systematis Operativi

Fenestrae Nucleus 6/7™: Fenestrae 7/10/11

Nucleus 8/9™: Fenestrae 10/11
Linux Linux

Custos

Exitus Restitutio Systematis
Intervallum Programmabile per programmatum ab 1 ad 255 secundas

Mechanica

Materia clausurae Radiator: Mixtura aluminii, Arca: SGCC
Dimensiones 268mm (L) * 194.2mm (L) * 67.7mm (A) 268mm (L) * 194.2mm (L) * 118.5mm (A) 268mm (L) * 194.2mm (L) * 159.5mm (A)
Pondus Pondus netum: 4.5 kg

Summa: 6 kg (Involucro incluso)
Pondus netum: 4.7 kg

Summa: 6.2 kg (Involucro incluso)
Pondus netum: 4.8 kg

Summa: 6.3 kg (Involucro incluso)
Montatio VESA, Murale, Mensae

Ambitus

Systema Dissiptionis Caloris Refrigeratio Passiva Sine Ventilatore
Temperatura Operativa -20~60℃ (SSD Industrialis)
Temperatura Reponendi -40~80℃ (SSD Industrialis)
Humiditas Relativa 10 ad 90% RH (non condensans)
Vibratio Inter Operationem Cum SSD: IEC 60068-2-64 (3Grms@5~500Hz, fortuitum, 1hr/axe)
Impetus Inter Operationem Cum SSD: IEC 60068-2-27 (30G, dimidia sinus, 11ms)
Certificatio CCC, CE/FCC, RoHS
Q670

Modellum

E7L

E7DL

E7QL

CPU

 

CPU

Intel®CPU computatralis duodecimae/tredecimae generationis Core / Pentium / Celeron

TDP

35W

Socket

LGA1700

Microprocessus

Q670

BIOS

AMI 256 Mbit SPI

Memoria

Socket

Duo fissurae SO-DIMM non-ECC, DDR4 canalis duplicis usque ad 3200MHz

Capacitas Maxima

64GB, Singulum Maximum 32GB

Graphica

Moderator

Intel®Graphica UHD

Aethernet

Moderator

1 * Intel i219-LM 1GbE LAN Microprocessus (LAN1, 10/100/1000 Mbps, RJ45)

1 * Intel i225-V 2.5GbE LAN Microprocessus (LAN2, 10/100/1000/2500 Mbps, RJ45)

Repositorium

SATA

1 * SATA3.0, spatia discorum rigidorum 2.5" celeriter liberanda (T≤7mm)

1 * SATA3.0, spatia interna pro disco duro 2.5" (T≤9mm, optionalia)

RAID 0, 1 sustinet

M.2

1 * M.2 Key-M (PCIe x4 Gen 4 + SATA3.0, NVMe/SATA SSD Auto Detect, 2280)

Areae Expansionis

Solium PCIe

N/A

1: 1 * PCIe x16 (x16) + 1 * PCIe x4 (x4)

2: 1 * PCIe x16 + 1 * PCI

3: 2 * PCI

PS: ①、②、③ Una ex tribus, Longitudo chartae expansionis ≤ 185mm, TDP ≤ 130W

1: 2 * PCIe x16 (x8/x8) + 2 * PCI

2: 1 * PCIe x16 (x16) + 1 * PCIe x4 (x4)

PS: ①、② Una ex duabus, Longitudo chartae expansionis ≤ 185mm, TDP ≤ 130W

Ianua

1 * aDoor Bus (Optionalis 4 * LAN/4 * POE/6 * COM/16 * GPIO charta expansionis)

Mini PCIe

Duae Mini PCIe (PCIe x1 Gen 3 + USB 2.0, cum una scheda SIM)

M.2

1 * Clavis M.2-E (PCIe x1 Gen 3 + USB 2.0, 2230)

I/O anterior

Aethernet

Duo * RJ45

USB

2 * USB3.2 Gen2x1 (Typus-A, 10Gbps)

6 * USB3.2 Gen 1x1 (Typus-A, 5Gbps)

Ostendere

1 * HDMI 1.4b: resolutio maxima usque ad 4096 * 2160 @ 30Hz

1 * DP1.4a: resolutio maxima usque ad 4096*2160 @ 60Hz

Audio

2 * Jack 3.5mm (Exitus Linearis + Microphonum)

Serialis

2 * RS232/485/422 (COM1/2, DB9/M, Viae Plenae, Commutator BIOS)

2 * RS232 (COM3/4, DB9/M, Viae Plenae)

Globulus

1 * Globulus Potestatis + LED Potestatis

1 * AT/ATX Bulla

1 * Systema Operandi Recuperandi Bulla

1 * Bulla Restitutionis Systematis

I/O posterior

Antenna

4 * Foramen antennae

SIM

Duo foramina pro chartis Nano SIM

Ingressus/Egressus Internus

USB

6 * USB2.0 (lamellae)

LCD

1 * LVDS (lamella): Resolutio LVDS usque ad 1920 * 1200 @ 60Hz

Tabula Frontalis

1 * Tabula Frontalis (PWR + RST + LED, lamella)

Audio

1 * Audio (Caput)

1 * Orator (2-W (per canalem)/8-Ω Onera, crustulum)

Serialis

2 * RS232 (COM5/6, crustulum)

GPIO

1 * 16 bitorum DIO (8xDI et 8xDO, crustulum)

LPC

1 * LPC (oblectum)

SATA

Connectores SATA 7P tres, usque ad 600MB/s

Potentia SATA

3 * SATA Potentia (lamella)

VENTILATOR

 

 

1 * Ventilator CPU (lamella)

2 * VENTILATOR SYSTEMATI (KF2510-4A)

Fons Potentiae

Typus

DC, AT/ATX

Tensio Potentiae Ingressae

9~36VDC, P≤240W

18~60VDC, P≤400W

Coniunctor

1 * Coniunctor quattuor aciculorum, P=5.00/5.08

Accumulator RTC

Cellula Nummaria CR2032

Auxilium Systematis Operativi

Fenestrae

Fenestrae 10/11

Linux

Linux

Custos

Exitus

Restitutio Systematis

Intervallum

Programmabile 1 ~ 255 sec

Mechanica

Materia clausurae

Radiator: Mixtura aluminii, Arca: SGCC

Dimensiones

268mm (L) * 194.2mm (L) * 67.7mm (A)

268mm (L) * 194.2mm (L) * 118.5mm (A)

268mm (L) * 194.2mm (L) * 159.5mm (A)

Pondus

Pondus netum: 4.5 kg

Summa: 6 kg (Involucro incluso)

Pondus netum: 4.7 kg

Summa: 6.2 kg (Involucro incluso)

Pondus netum: 4.8 kg

Summa: 6.3 kg (Involucro incluso)

Montatio

VESA, Murale, Mensae

Ambitus

Systema Dissiptionis Caloris

Refrigeratio Passiva Sine Ventilatore

Temperatura Operativa

-20~60℃ (SSD Industrialis)

Temperatura Reponendi

-40~80℃ (SSD Industrialis)

Humiditas Relativa

10 ad 90% RH (non condensans)

Vibratio Inter Operationem

Cum SSD: IEC 60068-2-64 (3Grms@5~500Hz, fortuitum, 1hr/axe)

Impetus Inter Operationem

Cum SSD: IEC 60068-2-27 (30G, dimidia sinus, 11ms)

Certificatio

CE/FCC, RoHS

Delineatio Ingeniaria1 Delineatio Ingeniaria2

  • E7L-H610_SpecificationSheet_APQ
    E7L-H610_SpecificationSheet_APQ
    DEPRIME
  • E7L-Q170_SpecificationSheet_APQ
    E7L-Q170_SpecificationSheet_APQ
    DEPRIME
  • E7L-Q670_SpecificationSheet_APQ
    E7L-Q670_SpecificationSheet_APQ
    DEPRIME
  • EXEMPLA ACQUIRE

    Efficax, tutus et fidus. Nostra instrumenta solutionem rectam cuilibet necessitati praestant. Fruere peritia nostra in industria et valorem additum crea - quotidie.

    Preme pro InquisitionePlura preme