Lihlahisoa

Lebokose PC APQ TAC-3000 Pro

Lebokose PC APQ TAC-3000 Pro

Likaroloana:

  • NVIDIA®JetsonTMLetoto la Orin SO-DIMM

  • Mokhoa o motle, ho fihlela ho 157TOPS
  • 3*GbE、4*USB 5Gbps
  • 16bit GPIO, 4*RS232/RS485
  • Katoloso ea 5G/4G, WiFi + BT
  • Matla a motlakase a DC 12~28V a mefuta e mengata
  • Moralo o mokgutshwane haholo, tjhase e matla e tletseng tshepe
  • E tšehetsa ho kenya litsebe le ho kenya DIN-rail

  • Tsamaiso ea hole

    Tsamaiso ea hole

  • Tlhokomelo ea maemo

    Tlhokomelo ea maemo

  • Ts'ebetso le tlhokomelo e hole

    Ts'ebetso le tlhokomelo e hole

  • Taolo ea Polokeho

    Taolo ea Polokeho

SELELEKELA

Setšoantšo sa Boenjiniere

Khoasolla Faele

Mohlala

TAC-3000 Pro

Sistimi ea Processor

SOM

Orin Nano 4GB

Orin Nano 8GB

Orin NX 8GB

Orin NX 16GB

Tshebetso ea AI

LITLHOHO TSE 20 / LITLHOHO TSE 34 (Tse Ntle)

LITLHOHO TSE 40 / LITLHOHO TSE 67 (Tse Ntle)

LITLHORO TSE 70 / LITLHORO TSE 117 (Tse Ntle)

LITLHOHO TSE 100 / LITLHOHO TSE 157 (Tse Ntle)

Ethernet

Molaoli

1 * GBE LAN Chip (letšoao la LAN ho tsoa ho System-on-Module), 10/100/1000 Mbps

2 * Intel®i210-AT, 10/100/1000 Mbps

Polokelo

M.2

Sebaka sa 1 * M.2 Key-M (NVMe SSD, 2280)

Katoloso

Li-slot

PCIe e nyane

Sebaka sa 1 * Mini PCIe (PCIe x1 + USB 2.0, se nang le Sebaka sa 1 * Nano SIM Card)

M.2

Sebaka sa 1 * M.2 Key-E (PCIe x1 + USB 2.0, 2230)

M.2

Sebaka sa 1 * M.2 Key-B (USB 5Gbps + USB 2.0, 3052, ka Sebaka sa 1 * Nano SIM Card)

I/O e ka pele

Ethernet

3 * GbE (RJ45)

USB

2 * USB 10Gbps (Mofuta oa A)

2 * USB 5Gbps (Mofuta oa A)

Pontšo

1 * HDMI, Qeto e phahameng ho fihlela ho 4096*2304@30Hz (Mofuta oa A)

Konopo

Konopo ea Matla e le 1 * + LED ea Matla

1 * Konopo ea ho Seta Sistimi Bocha

1 * Konopo ea ho Pholosa Sistimi

LED

1 * LED ea Boemo ba Sistimi

Kenyelletso ea Matla

1 * Kenyelletso ea Matla (2P, P=5.00/5.08, Bolo ea Terminal)

Lehlakore la I/O

OTG

1 * USB 2.0 (Mofuta oa C, Kou e Khanyang)

Tokiso ea phoso

1 * USB 2.0 (Mofuta oa C, Kou ea ho Lokisa Mathata)

SIM

2 * Nano SIM

I/O ea ka hare

Letoto

4 * RS232/RS485 (wafer, Sefetola sa Jumper)

1 * TTL (wafer)

KENYA

KHANNE E 2 (wafer)

GPIO

16bit DIO (OS Configurable DI/DO le H/L, wafer)

Molumo

1 * Audio (Mola-Out + MIC, wafer)

1 * Amplifier, 5-W (ka kanale) ka hara 8-Ω Loads (wafer)

USB

2 * USB 2.0 (sejana sa ho hlapela)

FAN

1 * Fene ea Sistimi (wafer)

BAT

1 * BAT (wafer)

Phanele e ka Pele

1 * Phanele e ka Pele (Matla + Ho Seta Botjha + Ho Hlasimolla, wafer)

Phepelo ea motlakase

Mofuta

AT/ATX

Motlakase oa ho Kena oa Matla

12~28V DC

Sehokelo

Sehokelo sa ho Kena sa Matla se le 1 (2P, P=5.08mm, Boloko ba Terminal)

Betri ea RTC

Sele ea Chelete ea CR2032

Tšehetso ea OS

Linux

Jetpack 6.2 (Ubuntu 22.04)

Mekaniki

Lisebelisoa tsa ho kenya ka hare

Radiator: Aluminium alloy

Litekanyo

150.7mm(L) * 114.5mm(W) * 45mm(H) (Hardware ea ho Hlomamisa ha e kenyelelitsoe)

Ho hloma

Ho Kenya Tsebe, Ho Kenya Terene ea DIN (Khetho ea ho Romela)

Tikoloho

Sistimi ea ho Pholisa

Ho Pholisa Fan ho Sebetsang

Mocheso o sebetsang

-20~50℃ (SSD ea indasteri)

Mocheso oa Polokelo

-40~80℃ (SSD ea indasteri)

Mongobo o Lekanyelitsoeng

10 ho isa ho 95% (ha e kolobise)

Ho thothomela

3Grms@5~500Hz, ka mokhoa o sa reroang, hora e le 1/axis

Tšabo

15G, halofo ea sine, 11ms, ±X/Y/Z, li-shock/axis tse 3

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  • TAC-3000 Pro_SpecSheet_APQ
    TAC-3000 Pro_SpecSheet_APQ
    Jarolla
  • FUMANA DISAMPELE

    E sebetsa hantle, e bolokehile ebile e ka tšeptjoa. Lisebelisoa tsa rona li tiisa tharollo e nepahetseng bakeng sa tlhoko efe kapa efe. Rua molemo ho tsebo ea rona ea indasteri 'me u hlahise boleng bo eketsehileng - letsatsi le leng le le leng.

    Tobetsa Bakeng sa DipotsoTobetsa ho feta