Lihlahisoa

PC e kentsweng APQ C6-ADLP

PC e kentsweng APQ C6-ADLP

Likaroloana:

  • E tsamaisoa ke li-processor tsa selefouno tsa letoto la Intel® 12th Gen Core™ i3 / i5 / i7-U

  • Sebaka sa 1 × DDR4 SO-DIMM, se tšehetsa ho fihlela ho 32 GB
  • Likou tsa Ethernet tsa 2 × Intel® Gigabit
  • Likou tsa mofuta oa A tsa 6 × USB 5 Gbps
  • Liphetho tse peli tsa ponts'o: HDMI + DP
  • E tšehetsa katoloso ea waelese ea Wi-Fi / 4G / 5G
  • E tšehetsa ho kenngoa ha desktop, leboteng, le DIN-rail
  • Moralo o se nang fene o nang le pholiso e sa sebetseng
  • Chassis e nyane haholo

  • Tsamaiso ea hole

    Tsamaiso ea hole

  • Tlhokomelo ea maemo

    Tlhokomelo ea maemo

  • Ts'ebetso le tlhokomelo e hole

    Ts'ebetso le tlhokomelo e hole

  • Taolo ea Polokeho

    Taolo ea Polokeho

SELELEKELA

Setšoantšo sa Boenjiniere

Khoasolla Faele

Mohlala

C6

CPU

CPU

Prosesara ya letoto la Intel® Core™ la 12th Gen i3 / i5 / i7-U, TDP = 15 W

Chipset

SOC

BIOS

AMI UEFI BIOS

Khopolo

Sokete

Sebaka sa 1 × DDR4 SO-DIMM, 3200 MT/s

Bokgoni bo Hodimo

32GB

Pontšo

Litšoantšo

Litšoantšo tsa Intel®

Marang-rang

Taolo ea Marang-rang

Taolo ea marang-rang ea 1 × Intel® i219 (10/100/1000 Mbps)
Taolo ea marang-rang ea 1 × Intel® i226 (10/100/1000 Mbps)

Polokelo

M.2

Sebaka sa 1 × M.2 Key-M (letšoao la PCIe x4, le tšehetsa NVMe SSD, 2280)

Katoloso

M.2

Sebaka sa 1 × M.2 Key-E (letšoao la PCIe x1, le tšehetsa Wi-Fi, 2230)
Sebaka sa 1 × M.2 Key-B (PCIe x1 + USB 3.0 + matšoao a USB 2.0, e tšehetsa 4G / 5G, 3042 / 3052)

Kou ea Serial

4 × RS-232 (COM1–COM4, ​​DB9 e tona, boikgethelo) [1]
1 × RS-485 (COM6, DB9 e tona, boikhethelo) [1]

I/O ea Kantle

USB

6* USB 5Gbps (Mofuta oa A)

Ethernet

Likou tse 2 tsa RJ45

Pontšo

Kou ea HDMI e le 1 × (boholo ba qeto ho fihlela ho 2048 × 1080 @ 60 Hz)
Kou e le 1 × DP++ (boikemisetso bo phahameng ho fihlela ho 4096 × 2304 @ 60 Hz)

Molumo

Jacke ea molumo ea 2-in-1 ea 1 × 3.5 mm (Mola-Out + MIC, maemo a tloaelehileng a CTIA)

Phepelo ea motlakase

Mofuta

DC

Motlakase oa ho kenya

12V

Sehokelo

Sehokelo sa ho kenya motlakase se 1 × (DC 5.5 × 2.5 mm)

Betri ea RTC

Betri ea sele ea chelete ea tšepe ea CR2032

Tšehetso ea OS

Lifensetere

Windows 10/11

Linux

Linux (kernel 5.15 kapa hamorao)

Mohlokomeli

Sehlahisoa

Ho qala sistimi bocha

Nako ea karohano

Metsotsoana e 1–255, e ka hlophisoa

Mekaniki

Lisebelisoa tsa Chassis

Heatsink: Motsoako oa aluminium
Liphanele tse ka holimo/tlase: Tšepe e betliloeng ka galvanized
Sekoahelo se ka tlase: Tšepe e betliloeng

Litekanyo

150.7mm(L)*114.5mm(W)*45mm(H)

Ho hloma

Ho kenya leboteng, DIN-rail, komporo

Tikoloho

Sistimi ea ho Pholisa

Ho pholisa ho sa sebetseng ntle le fene

Mocheso o sebetsang

0 ho isa ho 60 °C (ka SSD ea indasteri)

Mocheso oa Polokelo

-40 ho isa ho 80 °C (ka SSD ea indasteri)

Mongobo

5 ho isa ho 90% RH (ha e kolobise)

Ho thothomela

IEC 60068-2-64 (3 Grms @ 5–500 Hz, ka mokhoa o sa reroang, hora e le 1/axis, ka SSD)

Tšabo

IEC 60068-2-27 (30 G, halofo-sine, 11 ms, ka SSD)

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  • FUMANA DISAMPELE

    E sebetsa hantle, e bolokehile ebile e ka tšeptjoa. Lisebelisoa tsa rona li tiisa tharollo e nepahetseng bakeng sa tlhoko efe kapa efe. Rua molemo ho tsebo ea rona ea indasteri 'me u hlahise boleng bo eketsehileng - letsatsi le leng le le leng.

    Tobetsa Bakeng sa DipotsoTobetsa ho feta