TAC-3000
Tsamaiso ea hole
Tlhokomelo ea maemo
Ts'ebetso le tlhokomelo e hole
Taolo ea Polokeho
ITEANYE LE RONATLHALOSO EA SEHLAHISOA
Mehleng ena ea tlhahiso e bohlale, balaoli ba liroboto ke senotlolo sa ho fihlela taolo e sebetsang hantle le e nepahetseng. Re qalile letoto la taolo ea liroboto e matla le e tšepahalang - letoto la TAC, ho thusa likhoebo ho haha monyetla oa tlholisano tlhahisong e bohlale. Letoto la TAC le na le li-processor tsa mohala/desktop tsa Intel Core tsa moloko oa 6 ho isa ho oa 11, tse fihlelang litlhoko tse fapaneng tsa ts'ebetso. E na le ts'ebetso e matla ea k'homphieutha, tlhophiso e tenyetsehang ea AI, puisano e potlakileng ea liteishene tse ngata, boholo bo kopaneng, ho kenngoa ho tenyetsehang, bokhoni ba ho sebetsa ba mocheso o pharaletseng, le motsoako oa modular bakeng sa tlhokomelo le tsamaiso e bonolo. Molumo o monyenyane oa boholo ba palema o loketse haholoanyane lits'ebetsong libakeng tse moqotetsane, o fihlela litlhoko tsa li-AGV, ho khanna ka boikemelo, le lits'ebetso tse rarahaneng masimong a indasteri a tsamaeang joalo ka likou le libaka tse nyane tsa sebaka. Ka nako e ts'oanang, e na le sethala sa ts'ebetso le tlhokomelo se bohlale sa QDevEyes Qiwei - (IPC) se shebaneng le maemo a ts'ebeliso ea IPC, sethala se kopanya lits'ebetso tse ruileng tse sebetsang maemong a mane a taolo le tlhokomelo ea taolo, se fa IPC taolo ea sehlopha se hole, tlhokomelo ea lisebelisoa, le mesebetsi ea ts'ebetso le tlhokomelo e hole, se fihlela litlhoko tsa ts'ebetso le tlhokomelo maemong a fapaneng.
| Mohlala | TAC-3000 | ||||
| Sistimi ea Processor | SOM | Nano | TX2 NX | Xavier NX | Xavier NX 16GB |
| Tshebetso ea AI | 472 GFLOPS | 1.33 TFLOPS | LITLHORO TSE 21 | ||
| GPU | GPU ea meralo ea NVIDIA Maxwell™ ea mantlha ea 128 | GPU ea meralo ea NVIDIA Pascal™ ea mantlha ea 256 | GPU ea meralo ea NVIDIA Volta™ ea 384-core e nang le li-Tensor Cores tse 48 | ||
| Maqhubu a Maholo a GPU | 921MHz | 1.3 GHz | 1100 MHz | ||
| CPU | Prosesara ya ARM® Cortex®-A57 MPCore ya mantlha e nang le di-quad-core | Prosesara ya NVIDIA DenverTM 2 ya di-bit tse 64 ya CPU le ya di-core tse 4 ya Arm® Cortex®-A57 MPCore | NVIDIA Carmel ea mantlha e 6 Arm® v8.2 64-bit CPU 6MB L2 + 4MB L3 | ||
| Maqhubu a Maholo a CPU | 1.43GHz | Denver 2: 2 GHz Cortex-A57: 2 GHz | 1.9 GHz | ||
| Khopolo | 4GB 64-bit LPDDR4 25.6GB/s | 4GB 128-bit LPDDR4 51.2GB/s | 8GB 128-bit LPDDR4x 59.7GB/s | 16GB 128-bit LPDDR4x 59.7GB/s | |
| TDP | 5W-10W | 7.5W - 15W | 10W - 20W | ||
| Sistimi ea Processor | SOM | Orin Nano 4GB | Orin Nano 8GB | Orin NX 8GB | Orin NX 16GB |
| Tshebetso ea AI | LITLHOHO TSE 20 | LITLHOHO TSE 40 | LITLHOHO TSE 70 | LITLHORO TSE 100 | |
| GPU | Meralo ea NVIDIA Ampere ea mantlha ea 512 GPU e nang le li-Tensor Cores tse 16 | Ampere ea NVIDIA ea mantlha ea 1024 meaho ea GPU ka li-cores tse 32 tsa Tensor | Ampere ea NVIDIA ea mantlha ea 1024 meaho ea GPU ka li-cores tse 32 tsa Tensor | ||
| Maqhubu a Maholo a GPU | 625 MHz | 765 MHz | 918 MHz |
| |
| CPU | 6-core Arm® Cortex® A78AE v8.2 64-bit CPU 1.5MB L2 + 4MB L3 | Arm® ea mantlha e 6 Cortex® A78AE CPU ea v8.2 ea 64-bit 1.5MB L2 + 4MB L3 | Arm® ea mantlha e 8 Cortex® A78AE v8.2 64-bit CPU 2MB L2 + 4MB L3 | ||
| Maqhubu a Maholo a CPU | 1.5 GHz | 2 GHz | |||
| Khopolo | 4GB 64-bit LPDDR5 34 GB/s | 8GB 128-bit LPDDR5 68 GB/s | 8GB 128-bit LPDDR5 102.4 GB/s | 16GB 128-bit LPDDR5 102.4 GB/s | |
| TDP | 7W - 10W | 7W - 15W | 10W - 20W | 10W - 25W | |
| Ethernet | Molaoli | 1 * GBE LAN Chip (letšoao la LAN ho tsoa ho System-on-Module), 10/100/1000 Mbps2 * Intel®I210-AT, 10/100/1000 Mbps | |||
| Polokelo | eMMC | 16GB eMMC 5.1 (Orin Nano le Orin NX SOM ha li tšehetse eMMC) | |||
| M.2 | 1 * M.2 Key-M (NVMe SSD, 2280) (Orin Nano le Orin NX SOM ke lets'oao la PCIe x4, ha li-SOM tse ling e le lets'oao la PCIe x1) | ||||
| Sebaka sa TF | Sebaka sa Karete ea TF se le 1 * (Orin Nano le Orin NX SOM ha li tšehetse Karete ea TF) | ||||
| Katoloso Li-slot | PCIe e nyane | Sebaka se le seng sa 1 * Mini PCIe (PCIe x1+USB 2.0, se nang le 1 * Nano SIM Card) (Nano SOM ha e na lets'oao la PCIe x1) | |||
| M.2 | Sekotjana sa 1 * M.2 Key-B (USB 3.0, se nang le 1 * Nano SIM Card, 3052) | ||||
| I/O e ka pele | Ethernet | 2 * RJ45 | |||
| USB | 4 * USB3.0 (Mofuta oa A) | ||||
| Pontšo | 1 * HDMI: Qeto ho fihlela ho 4K @ 60Hz | ||||
| Konopo | Konopo ea Matla e le 1 * + LED ea Matla Konopo ea 1 * Seta Tsamaiso Bocha | ||||
| Lehlakore la I/O | USB | 1 * USB 2.0 (Micro USB, OTG) | |||
| Konopo | Konopo ea 1 * ea ho Pholosa | ||||
| Antena | Lesoba la antenna tse 4 * | ||||
| SIM | 2 * Nano SIM | ||||
| I/O ea ka hare | Letoto | 2 * RS232/RS485 (COM1/2, wafer, Jumper Switch)1 * RS232/TTL (COM3, wafer, Jumper Switch) | |||
| PWRBT | Konopo ea Matla e le 1 * (sejana) | ||||
| PWRLED | 1 * LED e Matla (wafer) | ||||
| Molumo | 1 * Molumo (Mola-Otloloha + MIC, wafer)1 * Amplifier, 3-W (ka kanale) ho 4-Ω Loads (wafer) | ||||
| GPIO | Di-bit tse 1 * 16 tsa DIO (8xDI le 8xDO, wafer) | ||||
| Bese ea CAN | K'HANTI e le 'ngoe (wafer) | ||||
| FAN | 1 * PHETLA EA CPU (sejana) | ||||
| Phepelo ea motlakase | Mofuta | DC, AT | |||
| Motlakase oa ho Kena oa Matla | 12~28V DC | ||||
| Sehokelo | Boloko ba Terminal, 2Pin, P=5.00/5.08 | ||||
| Betri ea RTC | Sele ea Chelete ea CR2032 | ||||
| Tšehetso ea OS | Linux | Nano/TX2 NX/Xavier NX: JetPack 4.6.3Orin Nano/Orin NX: JetPack 5.3.1 | |||
| Mekaniki | Lisebelisoa tsa ho kenya ka hare | Radiator: Aluminium alloy, Lebokose: SGCC | |||
| Litekanyo | 150.7mm(L) * 144.5mm(W) * 45mm(H) | ||||
| Ho hloma | Desktop, DIN-rail | ||||
| Tikoloho | Sistimi ea ho Hala ha Mocheso | Moralo o fokolang oa fan | |||
| Mocheso o sebetsang | -20~60℃ ka phallo ea moea ea 0.7 m/s | ||||
| Mocheso oa Polokelo | -40~80℃ | ||||
| Mongobo o Lekanyelitsoeng | 10 ho isa ho 95% (ha e kolobise) | ||||
| Ho thothomela | 3Grms@5~500Hz, ka mokhoa o sa reroang, 1hr/axis (IEC 60068-2-64) | ||||
| Tšabo | 10G, halofo ea sine, 11ms (IEC 60068-2-27) | ||||
Ho Tsepamisa Maikutlo Indastering
Kgwebo e atolohile ho ya indastering, e qala moralo wa "modular" bakeng sa dikhomphutha tsa diindasteri, e fihlella karolo e hodimo ya mmaraka karolong ya taolo ya locker ya kapele naheng ka bophara.
Mofani oa litšebeletso tse khethehileng tsa lisebelisoa tse bohlale
Khamphani ea pele ea lik'homphieutha tsa indasteri e thathamisitsoeng ho Boto e Ncha ea Boraro, e fuoe setifikeiti sa khoebo ea theknoloji e phahameng le setifikeiti sa kopanyo ea sesole le baahi, e fihletse tsamaiso ea 'maraka oa naha,' me ea atoloha ho ea khoebong ea mose ho maoatle.
Mofani oa litšebeletso tsa k'homphieutha ea AI ea indasteri
Ntlo-kholo e Chengdu e ile ea fallela setsing sa indasteri sa Suzhou, e shebane le kaho e tenyetsehang ea dijithale le ho kenngoa tšebetsong ha software ea ts'ebetso le tlhokomelo ea IPC+. E fuoe khau e le SME e "Khethehileng, e Lefisitsoeng, e Ikhethang, le e Ncha" 'me e behiloe har'a lik'hamphani tse 20 tse holimo tsa k'homphieutha tsa China.
Mofani oa litšebeletso tsa k'homphieutha ea AI ea indasteri
E-Smart IPC e etella pele mokhoa o mocha oa likhomphutha tsa indasteri ka theknoloji, e holisa libaka tsa ts'ebeliso ea indasteri ka botebo, 'me e sebetsana le mathata a indasteri ka litharollo tse kopaneng tsa software le hardware.
FUMANA DISAMPELE
E sebetsa hantle, e bolokehile ebile e ka tšeptjoa. Lisebelisoa tsa rona li tiisa tharollo e nepahetseng bakeng sa tlhoko efe kapa efe. Rua molemo ho tsebo ea rona ea indasteri 'me u hlahise boleng bo eketsehileng - letsatsi le leng le le leng.
Tobetsa Bakeng sa Dipotso
