Mai ʻApelila 24-26,
Ua mālama ʻia ke kolu o ka Chengdu International Industrial Expo a me ka Western Global Semiconductor Expo i ka manawa like ma Chengdu.
Ua hōʻike nui ʻia ʻo APQ me kāna moʻo AK a me nā huahana kuʻuna, e hōʻike ana i kona ikaika i kahi hoʻonohonoho hōʻikeʻike pālua.
Hōʻikeʻike ʻOihana Honua o Chengdu
Ma ka Chengdu Industrial Expo, ua lilo ka mea hoʻokele akamai kaila cartridge AK series, kahi huahana koʻikoʻi o APQ's E-Smart IPC, i hōkū o ka hanana, e huki ana i ka manaʻo nui mai ka ʻoihana.
Ua hōʻike ʻia ka moʻo AK me kahi hui kūikawā 1+1+1—ʻo ke chassis nui, ka pahu nui, ka pahu kōkua, a me ka pahu polokalamu, e hāʻawi ana ma mua o hoʻokahi tausani mau hui pū ʻana. ʻO kēia versatility e hiki ai i ka moʻo AK ke hoʻokō i nā pono noi like ʻole ma nā kahua e like me ka ʻike, ka hoʻokele neʻe, ka robotics, a me ka digitization.
Ma waho aʻe o ka moʻo AK, ua hōʻike pū ʻo APQ i kāna mau huahana kahiko i mahalo nui ʻia ma ka Expo, me ka kamepiula ʻoihana i hoʻokomo ʻia ʻo E series, ka mīkini ʻoihana āpau-i-hoʻokahi kaila backpack PL215CQ-E5, a me nā motherboards ʻoihana hana kiʻekiʻe i hoʻomohala ʻia i loko o ka hale.
ʻAʻole wale nā lako paʻa i loaʻa i ka APQ ma ka expo. Ua hōʻike ʻia nā hōʻikeʻike o kā lākou huahana polokalamu homegrown, ʻo IPC SmartMate lāua ʻo IPC SmartManager, i ka hiki o APQ ke hāʻawi i nā hopena i hoʻohui ʻia me nā lako paʻa-polokalamu hilinaʻi. Hōʻike kēia mau huahana i ka ʻike loea o APQ i ka automation ʻoihana a hōʻike i ka ʻike hohonu o ka hui i nā koi o ka mākeke a me nā hiki ke pane wikiwiki.
Ua hāʻawi ka Luna Hoʻokele Noiʻi a me ka Hoʻomohala ʻo APQ i kahi haʻiʻōlelo koʻikoʻi ma "Ke Kūkulu ʻana i ka Industrial AI Edge Computing me E-Smart IPC," e kūkākūkā ana i ka hoʻohana ʻana o ka matrix huahana E-Smart IPC e hana i nā hoʻonā computing ʻoihana AI edge kūpono a paʻa hoʻi, e hoʻokele ana i ka hoʻomohala hohonu o ka naʻauao ʻoihana.
Hana Hou ʻOihana Semiconductor Komohana Kina
I ka manawa like, ua hōʻike ʻia ka komo ʻana o APQ i ka 2024 China Western Semiconductor Industry Innovation and Development Forum & ka 23rd Western Global Chip and Semiconductor Industry Expo i kona akamai ʻenehana i ke kahua semiconductor.
Ua hāʻawi ke ʻenekinia nui o ka hui i kahi ʻōlelo nui ma "The Application of AI Edge Computing in the Semiconductor Industry," e ʻimi ana pehea e hiki ai i ka AI edge computing ke hoʻonui i ka pono hana, hoʻomaikaʻi i ka kaohi maikaʻi, a hoʻololi i ka hana akamai.
Ke neʻe nei i mua, me ke alakaʻi ʻia e nā hihiʻo nui o ka ʻOihana 4.0 a me Made in China 2025, ua kūpaʻa ʻo APQ i ka hoʻolaha ʻana i ka hana akamai ʻoihana. Ma o ka hana hou ʻana o ka ʻenehana a me ka hoʻomaikaʻi ʻana i ka lawelawe, ua mākaukau ʻo APQ e hāʻawi i ka naʻauao a me ka ikaika i ka wā o ka ʻOihana 4.0.
Ka manawa hoʻouna: ʻApelila-28-2024