PC e sa kenngoeng ntle le fan | Letoto la E7L
Tsamaiso ea hole
Tlhokomelo ea maemo
Ts'ebetso le tlhokomelo e hole
Taolo ea Polokeho
ITEANYE LE RONALetoto la PC le kentsweng la APQ ke PC ya indasteri e kentsweng ya APQ e hahetsweng bakeng sa boiketsetso ba diindasteri, taolo ya mochini, HMI, khomphutha ya moedi, le merero ya disebediswa tse bohlale. Sistimi ena e thehilwe hodima intel 12th/13th gen cpu, e fang baenjiniere sethala se tshepahalang sa di-hardware bakeng sa difeme, mela ya tlhahiso, ditsamaiso tsa tlhahlobo, dikhabote tsa taolo tse kentsweng, le ho kenngwa tshebetsong ha tlhahiso e bohlale ha ka nako e ts'oanang ho boloka mohlala o nepahetseng wa sehlahiswa Letoto la PC le kentsweng la APQ E7L le hlakile bakeng sa patlo ya sehlahiswa le theko. Dikarolo tsa bohlokwa di kenyeletsa E tshehetsa Intel® 6th ho isa ho 9th Gen Core / Pentium / Celeron Desktop CPU, TDP 35W, LGA1151; E na le chipset ya Intel® Q170; Di-interface tse 2 tsa Intel Gigabit Ethernet; Di-slots tse 2 tsa DDR4 SO-DIMM, tse tshehetsang ho fihlela ho 64GB; Di-port tse 4 tsa DB9 tse serial (tshehetso ya COM1/2 RS232/RS422/RS485); Di-output tse 4 tsa pontsho: VGA, DVI-D, DP, le LVDS/eDP ya kahare, tse tshehetsang qeto ya 4K@60Hz. Bokgoni bona bo thusa EMBEDDED PC APQ E7L SERIES ho tshehetsa tshebetso e tswelang pele dibakeng tse hlokang thuso moo kaho e tshwarellang, kopanyo e sebetsang hantle, I/O e tsitsitseng, le botsitso ba potoloho ya bophelo di leng bohlokwa. E loketse dihahi tsa disebediswa tsa OEM, di-integrators tsa sistimi, bafani ba ditharollo tsa othomathiki, diporojeke tsa pono ya mochini, di-terminal tsa ho fumana data, ditsamaiso tsa taolo ya roboto, le di-node tsa khomphutha ya moedi wa indasteri. Kakaretso ya ditlhaloso: processor/platform: intel 12th/13th gen cpu; memori: LGA1150; marangrang: 1 * Intel i210-AT GbE LAN Chip (10/100/1000 Mbps) 1 * Intel i218-LM/V GbE LAN Chip (10/100/1000 Mbps); pontsho: Intel® HD Graphics; I/O le katoloso: 2 * RJ45. Bakeng sa bareki ba batlang letoto la apq e7l, pc ea indasteri e kentsoeng, apq, intel 12th/13th gen cpu, intel core cpu, moralo o se nang fan, Embedded PC APQ E7L Series e fana ka tekano e sebetsang ea ts'ebetso, katoloso, moralo o thata, le ho tenyetseha ha ho kenngoa bakeng sa lits'ebetso tsa sejoale-joale tsa k'homphieutha ea indasteri.
| Mohlala | E7L | E7DL | |
| CPU | CPU | Intel®CPU ea Desktop ea 4/5 ea Moloko oa 4/5 | |
| TDP | 35W | ||
| Sokete | LGA1150 | ||
| Chipset | Chipset | Intel®H81 | |
| BIOS | BIOS | AMI UEFI BIOS (Sesebelisoa sa ho Lebela sa Tšehetso) | |
| Khopolo | Sokete | 2 * Sebaka sa SO-DIMM se seng sa ECC, Dual Channel DDR3 ho fihlela ho 1600MHz | |
| Bokgoni bo Phahameng | 16GB, Bongata bo le bong. 8GB | ||
| Litšoantšo | Molaoli | Intel®Litšoantšo tsa HD | |
| Ethernet | Molaoli | 1 * Chip ea Intel i210-AT GbE LAN (10/100/1000 Mbps) 1 * Intel i218-LM/V GbE LAN Chip (10/100/1000 Mbps) | |
| Polokelo | SATA | 1 * SATA3.0, Li-hard disk tse lokollotsoeng ka potlako tsa 2.5" (T≤7mm) 1 * SATA2.0, Li-hard disk tsa kahare tsa 2.5" (T≤9mm, Khetho) | |
| M.2 | 1 * M.2 Senotlolo-M (SATA3.0, 2280) | ||
| Libaka tsa Expansin | PCI/PCI | Ha e eo | ①: 1 * PCIe x16 (x16) ②: 2 * PCI PS: ①、②E le 'ngoe ho tse peli, Bolelele ba karete ea Katoloso ≤ 185mm, TDP ≤ 130W |
| MXM/aDoor | 1 * APQ MXM (Karete ea katoloso ea MXM 4 * LAN/4 * POE/6 * COM/16 * GPIO) 1 * Sebaka sa Katoloso sa aDoor | ||
| PCIe e nyane | 1 * Mini PCIe (PCIe2.0 x1 (Arolelana lets'oao la PCIe le MXM, boikhethelo) + USB 2.0, le 1 * Nano SIM Card) | ||
| I/O e ka pele | Ethernet | 2 * RJ45 | |
| USB | 2 * USB3.0 (Mofuta oa A, 5Gbps) 4 * USB2.0 (Mofuta oa A) | ||
| Pontšo | 1 * DVI-D: qeto e phahameng ka ho fetisisa ho fihlela ho 1920*1200 @ 60Hz 1 * VGA (DB15/F): qeto e phahameng ka ho fetisisa ho fihlela ho 1920*1200 @ 60Hz 1 * DP: qeto e phahameng ka ho fetisisa ho fihlela ho 4096 * 2160 @ 60Hz | ||
| Molumo | Jack ea 2 * 3.5mm (Mola o Tsoang + MIC) | ||
| Letoto | 2 * RS232/422/485 (COM1/2, DB9/M, Litsela tse Felletseng, BIOS Switch) 2 * RS232 (COM3/4, DB9/M) | ||
| Konopo | Konopo ea Matla e le 1 * + LED ea Matla Konopo e le 1 * ea ho Seta Sistimi Bocha (Tšoara 0.2 ho isa ho 1s ho qala bocha, 'me u tšoare 3s ho hlakola CMOS) | ||
| I/O ea morao | Antena | Lesoba la antenna tse 4 * | |
| SIM | Sekotjana sa karete ea Nano SIM e le 1 * (SIM1) | ||
| I/O ea ka hare | USB | 2 * USB2.0 (sejana sa ho hlapela) | |
| LCD | 1 * LVDS (wafer): qeto e phahameng ka ho fetisisa ho fihlela ho 1920*1200 @ 60Hz | ||
| Phanele ea TFront | 1 * TF_Panel (3 * USB 2.0 + FPANEL, wafer) | ||
| Phanele e ka Pele | 1 * Phanele e ka Pele (PWR + RST + LED, wafer) | ||
| Sebui | Sebui se le 1 * (2-W (ka kanale)/8-Ω Meroalo, wafer) | ||
| Letoto | 2 * RS232 (COM5/6, wafer) | ||
| GPIO | Di-bit tse 1 * 16 tsa DIO (8xDI le 8xDO, wafer) | ||
| LPC | 1 * LPC (wafer) | ||
| SATA | Sehokelo sa 2 * SATA 7P | ||
| Matla a SATA | Matla a 2 a SATA (SATA_PWR1/2, wafer) | ||
| FAN | 1 * FAN ea CPU (sejana) 2 * SYS FAN (wafer) | ||
| Phepelo ea motlakase | Mofuta | DC, AT/ATX | |
| Motlakase oa ho Kena oa Matla | 9 ~ 36VDC, P≤240W | ||
| Sehokelo | Sehokelo sa 1 * 4Pin, P=5.00/5.08 | ||
| Betri ea RTC | Sele ea Chelete ea CR2032 | ||
| Tšehetso ea OS | Lifensetere | Windows 7/10/11 | |
| Linux | Linux | ||
| Mohlokomeli | Sehlahisoa | Seta Tsamaiso Bocha | |
| Nako ea karohano | E ka hlophisoa ka Software ho tloha metsotsoana e 1 ho isa ho e 255 | ||
| Mekaniki | Lisebelisoa tsa ho kenya ka hare | Radiator: Aluminium alloy, Lebokose: SGCC | |
| Litekanyo | 268mm(L) * 194.2mm(W) * 67.7mm(H) | 268mm(L) * 194.2mm(W) * 118.5mm(H) | |
| Boima ba 'mele | Nete: 4.5 kg Kakaretso: 6 kg (E kenyeletsa sephutheloana) | Nete: 4.7kg Kakaretso: 6.2 kg (E kenyeletsa sephutheloana) | |
| Ho hloma | VESA, E kentsoe leboteng, Desktop | ||
| Tikoloho | Sistimi ea ho Hala ha Mocheso | Ho Pholisa ho sa Feleng ho se Nang Fene | |
| Mocheso o sebetsang | -20~60℃ (SSD ea indasteri) | ||
| Mocheso oa Polokelo | -40~80℃ (SSD ea indasteri) | ||
| Mongobo o Lekanyelitsoeng | 10 ho isa ho 90% RH (ha e kolobise) | ||
| Ho thothomela Nakong ea Ts'ebetso | Ka SSD: IEC 60068-2-64 (3Grms@5~500Hz, e sa reroang, 1hr/axis) | ||
| Tšabo Nakong ea Ts'ebetso | Ka SSD: IEC 60068-2-27 (30G, halofo ea sine, 11ms) | ||
| Setifikeiti | CCC, CE/FCC, RoHS | ||
| Mohlala | E7L | E7DL | |
| CPU
| CPU | Intel® 12/13tCPU ea Desktop ea H Generation Core / Pentium/ Celeron | |
| TDP | 35W | ||
| Sokete | LGA1700 | ||
| Chipset | H610 | ||
| BIOS | AMI 256 Mbit SPI | ||
| Khopolo | Sokete | 2 * Sebaka sa SO-DIMM se seng sa ECC, Dual Channel DDR4 ho fihlela ho 3200MHz | |
| Bokgoni bo Phahameng | 64GB, Bolelele bo le bong. 32GB | ||
| Litšoantšo | Molaoli | Intel®Litšoantšo tsa UHD | |
| Ethernet | Molaoli | 1 * Intel i219-LM/V 1GbE LAN Chip (LAN1, 10/100/1000 Mbps) 1 * Intel i225-V/LM 2.5GbE LAN Chip (LAN2, 10/100/1000/2500 Mbps) | |
| Polokelo | SATA | 1 * SATA3.0, Li-hard disk tse lokollotsoeng ka potlako tsa 2.5" (T≤7mm) 1 * SATA3.0, Li-hard disk tsa kahare tsa 2.5" (T≤9mm, Khetho) | |
| M.2 | 1 * M.2 Senotlolo-M (SATA3.0, 2280) | ||
| Libaka tsa Katoloso | Sebaka sa PCIe | Ha e eo | ①: 1 * PCIe x16 (x16)②: 2 * PCIPS: ①、②E le 'ngoe ho tse peli, Bolelele ba karete ea Katoloso ≤ 185mm, TDP ≤ 130W |
| aLemati | Bese e le 1 ea monyako (Karete ea katoloso ea 4 * LAN/4 * POE/6 * COM/16 * GPIO) | ||
| PCIe e nyane | 1 * Mini PCIe (PCIe3.0 x1 + USB 2.0, e nang le 1 * Nano SIM Card) | ||
| I/O e ka pele | Ethernet | 2 * RJ45 | |
| USB | 2 * USB3.2 Gen2x1 (Mofuta oa A, 10Gbps) 2 * USB3.2 Gen1x1 (Mofuta oa A, 5Gbps) 2 * USB2.0 (Mofuta oa A) | ||
| Pontšo | 1 * HDMI1.4b: qeto e phahameng ka ho fetisisa ho fihlela ho 4096*2160 @ 30Hz 1 * DP1.4a: qeto e phahameng ka ho fetisisa ho fihlela ho 4096*2160 @ 60Hz | ||
| Molumo | Jack ea 2 * 3.5mm (Mola o Tsoang + MIC) | ||
| Letoto | 2 * RS232/422/485 (COM1/2, DB9/M, Litsela tse Felletseng, BIOS Switch) 2 * RS232 (COM3/4, DB9/M, Litsela tse Felletseng) | ||
| Konopo | Konopo ea Matla e le 1 * + LED ea Matla Konopo e le 1 * ea AT/ATX Konopo ea 1 * ea ho Khutlisa OS Konopo ea 1 * Seta Tsamaiso Bocha | ||
| I/O ea morao | Antena | Lesoba la antenna tse 4 * | |
| SIM | Sekotjana sa karete ea Nano SIM e le 1* (SIM1)) | ||
| I/O ea ka hare | USB | 6 * USB2.0 (sejana sa ho hlapela) | |
| LCD | 1 * LVDS (wafer): qeto e phahameng ka ho fetisisa ho fihlela ho 1920*1200 @ 60Hz | ||
| Phanele e ka Pele | 1 * FPanel (PWR + RST + LED, wafer) | ||
| Molumo | 1 * Molumo (Sehlooho) Sebui se le 1 * (2-W (ka kanale)/8-Ω Meroalo, wafer) | ||
| Letoto | 2 * RS232 (COM5/6, wafer) | ||
| GPIO | Di-bit tse 1 * 16 tsa DIO (8xDI le 8xDO, wafer) | ||
| LPC | 1 * LPC (wafer) | ||
| SATA | Sehokelo sa SATA 7P se 3 *, ho fihlela ho 600MB/s | ||
| Matla a SATA | 3 * Matla a SATA (wafer) | ||
| FAN | 1 * FAN ea CPU (sejana) 2 * SYS FAN (KF2510-4A) | ||
| Phepelo ea motlakase | Mofuta | DC, AT/ATX | |
| Motlakase oa ho Kena oa Matla | 9~36VDC, P≤240W 18~60VDC, P≤400W | ||
| Sehokelo | Sehokelo sa 1 * 4Pin, P=5.00/5.08 | ||
| Betri ea RTC | Sele ea Chelete ea CR2032 | ||
| Tšehetso ea OS | Lifensetere | Windows 10/11 | |
| Linux | Linux | ||
| Mohlokomeli | Sehlahisoa | Seta Tsamaiso Bocha | |
| Nako ea karohano | E ka hlophisoa metsotsoana e 1 ~ 255 | ||
| Mekaniki | Lisebelisoa tsa ho kenya ka hare | Radiator: Aluminium alloy, Lebokose: SGCC | |
| Litekanyo | 268mm(L) * 194.2mm(W) * 67.7mm(H) | 268mm(L) * 194.2mm(W) * 118.5mm(H) | |
| Boima ba 'mele | Nete: 4.5 kgKakaretso: 6 kg (E kenyeletsa sephutheloana) | Nete: 4.7kgKakaretso: 6.2 kg (E kenyeletsa sephutheloana) | |
| Ho hloma | VESA, E kentsoe leboteng, Desktop | ||
| Tikoloho | Sistimi ea ho Hala ha Mocheso | Ho Pholisa ho sa Feleng ho se Nang Fene | |
| Mocheso o sebetsang | -20 ~ 60℃ (SSD ea indasteri) | ||
| Mocheso oa Polokelo | -40 ~ 80℃ (SSD ea indasteri) | ||
| Mongobo o Lekanyelitsoeng | 10 ho isa ho 90% RH (ha e kolobise) | ||
| Ho thothomela Nakong ea Ts'ebetso | Ka SSD: IEC 60068-2-64 (3Grms@5~500Hz, e sa reroang, 1hr/axis) | ||
| Tšabo Nakong ea Ts'ebetso | Ka SSD: IEC 60068-2-27 (30G, halofo ea sine, 11ms) | ||
| Setifikeiti | CE/FCC, RoHS | ||
| Mohlala | E7L | E7DL | E7QL | |
| CPU | CPU | Intel®CPU ea Desktop ea 6/7/8/9 ea Moloko oa 9 | ||
| TDP | 35W | |||
| Sokete | LGA1151 | |||
| Chipset | Chipset | Q170 | ||
| BIOS | BIOS | AMI UEFI BIOS (Sesebelisoa sa ho Lebela sa Tšehetso) | ||
| Khopolo | Sokete | 2 * Sebaka sa SO-DIMM se seng sa ECC, Dual Channel DDR4 ho fihlela ho 2133MHz | ||
| Bokgoni bo Phahameng | 64GB, Bolelele bo le bong. 32GB | |||
| Litšoantšo | Molaoli | Intel®Litšoantšo tsa HD | ||
| Ethernet | Molaoli | 1 * Chip ea Intel i210-AT GbE LAN (10/100/1000 Mbps) 1 * Intel i219-LM/V GbE LAN Chip (10/100/1000 Mbps) | ||
| Polokelo | SATA | 1 * SATA3.0, Li-hard disk tse lokollotsoeng ka potlako tsa 2.5" (T≤7mm) 1 * SATA3.0, Li-hard disk tsa kahare tsa 2.5" (T≤9mm, Khetho) Tšehetso ea RAID 0, 1 | ||
| M.2 | 1 * M.2 Key-M (PCIe x4 Gen 3 + SATA3.0, NVMe/SATA SSD Auto Detect, 2280) | |||
| Libaka tsa Expansin | PCI/PCI | Ha e eo | ①: 1 * PCIe x16 (x16) + 1 * PCIe x4 (x4) ②: 1 * PCIe x16 + 1 * PCI ③: 2 * PCI PS: ①、②、③ E le 'ngoe ho tse tharo, Bolelele ba karete ea Katoloso ≤ 185mm, TDP ≤ 130W | ①: 2 * PCIe x16 (x8/x8) + 2 * PCI ②:1 * PCIe x16 (x16) + 1 * PCIe x4 (x4) PS: ①、② E le 'ngoe ho tse peli, Bolelele ba karete ea Katoloso ≤ 185mm, TDP ≤ 130W |
| MXM/aDoor | 1 * APQ MXM (Karete ea katoloso ea MXM 4 * LAN/4 * POE/6 * COM/16 * GPIO) | |||
| PCIe e nyane | 1 * Mini PCIe (PCIe x1 Gen 2 + USB 2.0, e nang le 1 * SIM Card) | |||
| M.2 | 1 * M.2 Key-B (PCIe x1 Gen 2 + USB3.0, e nang le 1 * SIM Card, 3052) | |||
| I/O e ka pele | Ethernet | 2 * RJ45 | ||
| USB | 6 * USB3.0 (Mofuta oa A, 5Gbps) | |||
| Pontšo | 1 * DVI-D: qeto e phahameng ka ho fetisisa ho fihlela ho 1920*1200 @ 60Hz 1 * VGA (DB15/F): qeto e phahameng ka ho fetisisa ho fihlela ho 1920*1200 @ 60Hz 1 * DP: qeto e phahameng ka ho fetisisa ho fihlela ho 4096 * 2160 @ 60Hz | |||
| Molumo | Jack ea 2 * 3.5mm (Mola o Tsoang + MIC) | |||
| Letoto | 2 * RS232/422/485 (COM1/2, DB9/M, Litsela tse Felletseng, BIOS Switch) 2 * RS232 (COM3/4, DB9/M) | |||
| Konopo | Konopo ea Matla e le 1 * + LED ea Matla Konopo e le 1 * ea ho Seta Sistimi Bocha (Tšoara 0.2 ho isa ho 1s ho qala bocha, 'me u tšoare 3s ho hlakola CMOS) | |||
| I/O ea morao | Antena | Lesoba la antenna tse 4 * | ||
| SIM | Li-slots tse 2 tsa karete ea Nano SIM | |||
| I/O ea ka hare | USB | 2 * USB2.0 (sejana sa ho hlapela) | ||
| LCD | 1 * LVDS (wafer): qeto e phahameng ka ho fetisisa ho fihlela ho 1920*1200 @ 60Hz | |||
| Phanele ea TFront | 1 * TF_Panel (3 * USB 2.0 + FPANEL, wafer) | |||
| Phanele e ka Pele | 1 * FPanel (PWR + RST + LED, wafer) | |||
| Sebui | Sebui se le 1 * (2-W (ka kanale)/8-Ω Meroalo, wafer) | |||
| Letoto | 2 * RS232 (COM5/6, wafer) | |||
| GPIO | Di-bit tse 1 * 16 tsa DIO (8xDI le 8xDO, wafer) | |||
| LPC | 1 * LPC (wafer) | |||
| SATA | Sehokelo sa 2 * SATA 7P | |||
| Matla a SATA | 2 * Matla a SATA (wafer) | |||
| FAN | 1 * FAN ea CPU (sejana) 2 * SYS FAN (wafer) | |||
| Phepelo ea motlakase | Mofuta | DC, AT/ATX | ||
| Motlakase oa ho Kena oa Matla | 9 ~ 36VDC, P≤240W | |||
| Sehokelo | Sehokelo sa 1 * 4Pin, P=5.00/5.08 | |||
| Betri ea RTC | Sele ea Chelete ea CR2032 | |||
| Tšehetso ea OS | Lifensetere | Core ea 6/7™: Windows 7/10/11 Core ea 8/9™: Windows 10/11 | ||
| Linux | Linux | |||
| Mohlokomeli | Sehlahisoa | Seta Tsamaiso Bocha | ||
| Nako ea karohano | E ka hlophisoa ka Software ho tloha metsotsoana e 1 ho isa ho e 255 | |||
| Mekaniki | Lisebelisoa tsa ho kenya ka hare | Radiator: Aluminium alloy, Lebokose: SGCC | ||
| Litekanyo | 268mm(L) * 194.2mm(W) * 67.7mm(H) | 268mm(L) * 194.2mm(W) * 118.5mm(H) | 268mm(L) * 194.2mm(W) * 159.5mm(H) | |
| Boima ba 'mele | Nete: 4.5 kg Kakaretso: 6 kg (E kenyeletsa sephutheloana) | Nete: 4.7kg Kakaretso: 6.2 kg (E kenyeletsa sephutheloana) | Nete: 4.8 kg Kakaretso: 6.3 kg (E kenyeletsa sephutheloana) | |
| Ho hloma | VESA, E kentsoe leboteng, Desktop | |||
| Tikoloho | Sistimi ea ho Hala ha Mocheso | Ho Pholisa ho sa Feleng ho se Nang Fene | ||
| Mocheso o sebetsang | -20~60℃ (SSD ea indasteri) | |||
| Mocheso oa Polokelo | -40~80℃ (SSD ea indasteri) | |||
| Mongobo o Lekanyelitsoeng | 10 ho isa ho 90% RH (ha e kolobise) | |||
| Ho thothomela Nakong ea Ts'ebetso | Ka SSD: IEC 60068-2-64 (3Grms@5~500Hz, e sa reroang, 1hr/axis) | |||
| Tšabo Nakong ea Ts'ebetso | Ka SSD: IEC 60068-2-27 (30G, halofo ea sine, 11ms) | |||
| Setifikeiti | CCC, CE/FCC, RoHS | |||
| Mohlala | E7L | E7DL | E7QL | |
| CPU
| CPU | Intel®CPU ea Desktop ea 12/13 ea Moloko oa 12/13 | ||
| TDP | 35W | |||
| Sokete | LGA1700 | |||
| Chipset | Q670 | |||
| BIOS | AMI 256 Mbit SPI | |||
| Khopolo | Sokete | 2 * Sebaka sa SO-DIMM se seng sa ECC, Dual Channel DDR4 ho fihlela ho 3200MHz | ||
| Bokgoni bo Phahameng | 64GB, Bolelele bo le bong. 32GB | |||
| Litšoantšo | Molaoli | Intel®Litšoantšo tsa UHD | ||
| Ethernet | Molaoli | 1 * Chip ea LAN ea Intel i219-LM 1GbE (LAN1, 10/100/1000 Mbps, RJ45) | ||
| Polokelo | SATA | 1 * SATA3.0, Li-hard disk tse lokollotsoeng ka potlako tsa 2.5" (T≤7mm) Tšehetso ea RAID 0, 1 | ||
| M.2 | 1 * M.2 Key-M (PCIe x4 Gen 4 + SATA3.0, NVMe/SATA SSD Auto Detect, 2280) | |||
| Libaka tsa Katoloso | Sebaka sa PCIe | Ha e eo | ①: 1 * PCIe x16 (x16) + 1 * PCIe x4 (x4) ②: 1 * PCIe x16 + 1 * PCI ③: 2 * PCI PS: ①、②、③ E le 'ngoe ho tse tharo, Bolelele ba karete ea Katoloso ≤ 185mm, TDP ≤ 130W | ①: 2 * PCIe x16 (x8/x8) + 2 * PCI ②:1 * PCIe x16 (x16) + 1 * PCIe x4 (x4) PS: ①、② E le 'ngoe ho tse peli, Bolelele ba karete ea Katoloso ≤ 185mm, TDP ≤ 130W |
| monyako | Bese e le 1 ea monyako (Karete ea katoloso ea 4 * LAN/4 * POE/6 * COM/16 * GPIO) | |||
| PCIe e nyane | 2 * Mini PCIe (PCIe x1 Gen 3 + USB 2.0, e nang le 1 * SIM Card) | |||
| M.2 | 1 * M.2 Key-E (PCIe x1 Gen 3 + USB 2.0, 2230) | |||
| I/O e ka pele | Ethernet | 2 * RJ45 | ||
| USB | 2 * USB3.2 Gen2x1 (Mofuta oa A, 10Gbps) | |||
| Pontšo | 1 * HDMI1.4b: qeto e phahameng ka ho fetisisa ho fihlela ho 4096*2160 @ 30Hz | |||
| Molumo | Jack ea 2 * 3.5mm (Mola o Tsoang + MIC) | |||
| Letoto | 2 * RS232/485/422 (COM1/2, DB9/M, Litsela tse Felletseng, BIOS Switch) | |||
| Konopo | Konopo ea Matla e le 1 * + LED ea Matla | |||
| I/O ea morao | Antena | Lesoba la antenna tse 4 * | ||
| SIM | Li-slots tse 2 tsa karete ea Nano SIM | |||
| I/O ea ka hare | USB | 6 * USB2.0 (sejana sa ho hlapela) | ||
| LCD | 1 * LVDS (wafer): LVDS Resolution ho fihlela ho 1920*1200 @ 60Hz | |||
| Phanele e ka Pele | 1 * FPanel (PWR+RST+LED, wafer) | |||
| Molumo | 1 * Molumo (Sehlooho) | |||
| Letoto | 2 * RS232 (COM5/6, wafer) | |||
| GPIO | Di-bit tse 1 * 16 tsa DIO (8xDI le 8xDO, wafer) | |||
| LPC | 1 * LPC (wafer) | |||
| SATA | Sehokelo sa SATA 7P se 3 *, ho fihlela ho 600MB/s | |||
| Matla a SATA | 3 * Matla a SATA (wafer) | |||
| FAN
| 1 * FAN ea CPU (sejana) | |||
| Phepelo ea motlakase | Mofuta | DC, AT/ATX | ||
| Motlakase oa ho Kena oa Matla | 9~36VDC, P≤240W | |||
| Sehokelo | Sehokelo sa 1 * 4Pin, P=5.00/5.08 | |||
| Betri ea RTC | Sele ea Chelete ea CR2032 | |||
| Tšehetso ea OS | Lifensetere | Windows 10/11 | ||
| Linux | Linux | |||
| Mohlokomeli | Sehlahisoa | Seta Tsamaiso Bocha | ||
| Nako ea karohano | E ka hlophisoa metsotsoana e 1 ~ 255 | |||
| Mekaniki | Lisebelisoa tsa ho kenya ka hare | Radiator: Aluminium alloy, Lebokose: SGCC | ||
| Litekanyo | 268mm(L) * 194.2mm(W) * 67.7mm(H) | 268mm(L) * 194.2mm(W) * 118.5mm(H) | 268mm(L) * 194.2mm(W) * 159.5mm(H) | |
| Boima ba 'mele | Nete: 4.5 kg Kakaretso: 6 kg (E kenyeletsa sephutheloana) | Nete: 4.7kg Kakaretso: 6.2 kg (E kenyeletsa sephutheloana) | Nete: 4.8 kg Kakaretso: 6.3 kg (E kenyeletsa sephutheloana) | |
| Ho hloma | VESA, E kentsoe leboteng, Desktop | |||
| Tikoloho | Sistimi ea ho Hala ha Mocheso | Ho Pholisa ho sa Feleng ho se Nang Fene | ||
| Mocheso o sebetsang | -20~60℃ (SSD ea indasteri) | |||
| Mocheso oa Polokelo | -40~80℃ (SSD ea indasteri) | |||
| Mongobo o Lekanyelitsoeng | 10 ho isa ho 90% RH (ha e kolobise) | |||
| Ho thothomela Nakong ea Ts'ebetso | Ka SSD: IEC 60068-2-64 (3Grms@5~500Hz, e sa reroang, 1hr/axis) | |||
| Tšabo Nakong ea Ts'ebetso | Ka SSD: IEC 60068-2-27 (30G, halofo ea sine, 11ms) | |||
| Setifikeiti | CE/FCC, RoHS | |||
FUMANA DISAMPELE
E sebetsa hantle, e bolokehile ebile e ka tšeptjoa. Lisebelisoa tsa rona li tiisa tharollo e nepahetseng bakeng sa tlhoko efe kapa efe. Rua molemo ho tsebo ea rona ea indasteri 'me u hlahise boleng bo eketsehileng - letsatsi le leng le le leng.
Tobetsa Bakeng sa Dipotso
