Kusukela ngo-Ephreli 24-26,
Umbukiso wesithathu wezimboni iChengdu International Industrial Expo kanye neWestern Global Semiconductor Expo wenziwe ngesikhathi esisodwa eChengdu.
I-APQ ivele kahle kakhulu ngochungechunge lwayo lwe-AK kanye nohlu lwemikhiqizo yakudala, ikhombisa amandla ayo endaweni yokubonisana ekabili.
Umbukiso Wezimboni Wamazwe Ngamazwe waseChengdu
E-Chengdu Industrial Expo, uchungechunge lwe-AK oluhlakaniphile olusebenzisa isitayela se-cartridge, umkhiqizo oyinhloko we-APQ's E-Smart IPC, lwaba yinkanyezi yalo mcimbi, ludonsela ukunaka okukhulu embonini.
Uchungechunge lwe-AK lwethulwe ngenhlanganisela ehlukile ye-1+1+1—i-chassis eyinhloko, i-cartridge eyinhloko, i-cartridge esiza, kanye ne-cartridge yesofthiwe, enikeza inhlanganisela engaphezu kwenkulungwane engenzeka. Lokhu kuguquguquka kuvumela uchungechunge lwe-AK ukuthi luhlangabezane nezidingo ezahlukene zohlelo lokusebenza emikhakheni efana nokubona, ukulawula ukunyakaza, amarobhothi, kanye nokwenza kube yidijithali.
Ngaphezu kochungechunge lwe-AK, i-APQ iphinde yabonisa imikhiqizo yayo yakudala ehlonishwayo e-Expo, okuhlanganisa uchungechunge lwekhompyutha yezimboni oluhlanganisiwe lwe-E, umshini wezimboni wesitayela se-PL215CQ-E5 wesitayela se-backpack, kanye namabhodi omama ezimboni asebenza kahle kakhulu athuthukiswe ngaphakathi.
Ukuba khona kwe-APQ embukisweni kwakungewona nje i-hardware. Imiboniso yemikhiqizo yesofthiwe yabo yasekhaya, i-IPC SmartMate kanye ne-IPC SmartManager, ibonise ikhono le-APQ lokuletha izixazululo ezihlanganisiwe ze-hardware nesofthiwe ezithembekile. Le mikhiqizo imelela ubuchwepheshe be-APQ kwezobuchwepheshe ezenzakalelayo zezimboni futhi ibonisa ukuqonda okujulile kwenkampani ngezidingo zemakethe kanye namakhono okuphendula ngokushesha.
Umqondisi Wocwaningo Nokuthuthukiswa kwe-APQ wethule inkulumo eyinhloko ethi "Ukwakha I-Industrial AI Edge Computing nge-E-Smart IPC," exoxa ngokusetshenziswa kwe-E-Smart IPC product matrix ukudala izixazululo ze-AI edge computing zezimboni ezisebenza kahle nezizinzile, okuqhuba intuthuko ejulile yobuhlakani bezimboni.
Ukusungula Imboni Ye-Semiconductor YaseNtshonalanga YaseShayina
Ngesikhathi esifanayo, ukubamba iqhaza kwe-APQ kwi-2024 China Western Semiconductor Industry Innovation and Development Forum kanye ne-23rd Western Global Chip and Semiconductor Industry Expo kugqamise ikhono layo kwezobuchwepheshe emkhakheni we-semiconductor.
Unjiniyela Omkhulu wenkampani wethule inkulumo eyinhloko ethi "Ukusetshenziswa kwe-AI Edge Computing Embonini Ye-Semiconductor," ehlola ukuthi i-AI edge computing ingathuthukisa kanjani ukusebenza kahle kokukhiqiza, ithuthukise ukulawulwa kwekhwalithi, futhi iguquke ibe ukukhiqiza okuhlakaniphile.
Ukuqhubekela phambili, kuqondiswa imibono emikhulu ye-Industry 4.0 kanye ne-Made in China 2025, i-APQ isalokhu izibophezele ekuthuthukiseni ukukhiqizwa okuhlakaniphile kwezimboni. Ngokusungula ubuchwepheshe okuqhubekayo kanye nokuthuthukiswa kwezinsizakalo, i-APQ ikulungele ukufaka ukuhlakanipha namandla engeziwe enkathini ye-Industry 4.0.
Isikhathi sokuthunyelwe: Ephreli-28-2024