Producta

Computatrum Industriale E7S Incorporatus

Computatrum Industriale E7S Incorporatus

Proprietates:

  • Sustinet CPU Intel® sextae ad nonae generationis Core / Pentium / Celeron pro computatris personalibus, TDP 65W, LGA1151
  • Instructum cum chipset Intel® Q170
  • Duae interfacies Intel Gigabit Ethernet
  • Duo spatia DDR4 SO-DIMM, usque ad 64GB sustinentia
  • Quattuor portae seriales DB9 (COM1/2 RS232/RS422/RS485 sustinent)
  • Quattuor exitus monitorii: VGA, DVI-D, DP, et LVDS/eDP internus, resolutionem usque ad 4K@60Hz sustinens.
  • Sustinet expansionem functionum sine filo 4G/5G/WIFI/BT
  • Expansionem modulorum MXM et aDoor sustinet.
  • Sustentatio optionalis pro soculis expansionis normae PCIe/PCI
  • Fons potentiae 9~36V DC (12V ad libitum)
  • Refrigeratio activa ventilatoris intelligentis PWM

 


  • Administratio remota

    Administratio remota

  • Monitorium condicionis

    Monitorium condicionis

  • Operatio et sustentatio remota

    Operatio et sustentatio remota

  • Imperium Salutis

    Imperium Salutis

Descriptio Producti

Computatra Industrialia Integrata seriei APQ E7S, quae suggesta H81, H610, et Q670 comprehendunt, diligenter fabricata sunt ad automationem industrialem et applicationes computationis marginalis (edge ​​computing) sustinendas. Haec series destinata est ad exigentias rigorosas modernorum ambitus industrialis accommodandas, offerens seriem processorum ab Intel quarta/quinta ad recentissimas duodecimam/tredecimam generationem Core, Pentium, et Celeron. Versatilitas seriei E7S manifesta est in eius auxilio pro ampla varietate magnitudinum monitorum, resolutionibus altae definitionis usque ad 4K@60Hz, et optionibus connectivitatis robustis, inter quas interfaces retiales Intel Gigabit duplices et portas seriales multiplices ad facultates communicationis et processus datorum comprehensivas. Quaeque suggesta intra seriem, ab effectu certo H81 ad potentiam processus modernissimam Q670, instructa est amplis spatiis expansionis (PCIe, mini PCIe, M.2) et notis ut systemata refrigerationis ventilatorum intelligentium, quae operationem optimam in variis condicionibus industrialibus praestant.

Series E7S eminet propter adaptabilitatem et efficaciam, amplo spectro applicationum industrialium serviens, ab automatione officinarum ad perpolita officia computationis marginalis. Praesertim suggesta H610 et Q670 dedicationem seriei ad operationes industriales in futurum tuendas illustrant, cum auxilio nexuum interretialium celeritatis et exitus ostentationis provectos. Praeterea, philosophia designii modularis seriei facilem customizationem et scalabilitatem permittit, requisitis operationalibus specificis cum optionibus refrigerationis sine ventilatore vel cum ventilatore ad stabilitatem et firmitatem systematis conservandam occurrens. Sive in fabricatione, sive in monitorio remoto, sive ut spina computatralis systematum automatariorum adhibentur, computatra industrialia inclusa seriei APQ E7S solutionem fidam et versatilem offerunt, innovationem et efficaciam in corde oecosystematum industrialium promoventes.

INTRODUCTIO

Delineatio Ingeniaria

Demptio fasciculi

H81
Q170
H610
Q670
H81

Modellum

E7S

E7DS

CPU

CPU Intel®CPU computatralis quartae/quintae generationis Core / Pentium / Celeron
TDP 65W
Socket LGA1150

Microprocessus

Microprocessus Intel®H81

BIOS

BIOS AMI UEFI BIOS (Sustentatio Temporis Custodis)

Memoria

Socket Duo fissurae SO-DIMM non-ECC, DDR3 duplex usque ad 1600MHz
Capacitas Maxima 16GB, Singulum Maximum 8GB

Graphica

Moderator Intel®Graphicae Altae Definitionis (HD)

Aethernet

Moderator 1 * Intel i210-AT GbE LAN Microprocessus (10/100/1000 Mbps)1 * Intel i218-LM/V GbE LAN Chip (10/100/1000 Mbps)

Repositorium

SATA 1 * SATA3.0, spatia discorum rigidorum 2.5" celeriter liberanda (T≤7mm)

1 * SATA2.0, spatia interna pro disco duro 2.5" (T≤9mm, optionalia)

M.2 1 * Clavis M.2-M (SATA3.0, 2280)

Expansin Slots

PCIe/PCI N/A 1: 1 * PCIe x16 (x16)2: 2 * PCIPS: ①、②Una ex duabus, longitudo chartae expansionis ≤ 185mm, TDP ≤ 130W
MXM/aIanua 1 * APQ MXM /aDoor Bus (Facultativa MXM 4 * LAN/4 * POE/6 * COM/16 * GPIO charta expansionis)1 * Slot Expansionis Ianuae
Mini PCIe 1 * Mini PCIe (PCIe2.0 x1 (signum PCIe cum MXM communicat, si placet) + USB 2.0, cum 1 * Nano SIM Card)

I/O anterior

Aethernet Duo * RJ45
USB 2 * USB 3.0 (Typus-A, 5Gbps)4 * USB 2.0 (Typus-A)
Ostendere 1 * DVI-D: resolutio maxima usque ad 1920*1200 @ 60Hz1 * VGA (DB15/F): resolutio maxima usque ad 1920*1200 @ 60Hz1 * DP: resolutio maxima usque ad 4096*2160 @ 60Hz
Audio 2 * Jack 3.5mm (Exitus Linearis + Microphonum)
Serialis 2 * RS232/422/485 (COM1/2, DB9/M, Viae Plenae, Commutator BIOS)Duo RS232 (COM3/4, DB9/M)
Globulus 1 * Globulus Potestatis + LED Potestatis1 * Globulus Systematis Restituendi (Preme 0.2 ad 1s ad memoriam denuo incipiendam, et preme 3s ad CMOS purgandum)

I/O posterior

Antenna 4 * Foramen antennae
SIM 1 * Spatium pro scheda Nano SIM (SIM1)

Ingressus/Egressus Internus

USB 2 * USB2.0 (lamella)
LCD 1 * LVDS (lamella): resolutio maxima usque ad 1920 * 1200 @ 60Hz
Tabula anterior 1 * Tabula TF (3 * USB 2.0 + Tabula F, crustulum)
Tabula Frontalis 1 * Tabula Frontalis (lamella)
Orator 1 * Orator (2-W (per canalem)/8-Ω Onera, crustulum)
Serialis 2 * RS232 (COM5/6, crustulum)
GPIO 1 * 16 bitorum DIO (8xDI et 8xDO, crustulum)
LPC 1 * LPC (oblectum)
SATA 2 * Connectores SATA 7P
Potentia SATA 2 * SATA Power (SATA_PWR1/2, crustulum)
VENTILATOR 1 * Ventilator CPU (lamella)

2 * VENTILATOR SYSTEM (lamella)

Fons Potentiae

Typus DC, AT/ATX
Tensio Potentiae Ingressae 9 ~ 36VDC, P≤240W
Coniunctor 1 * Coniunctor quattuor aciculorum, P=5.00/5.08
Accumulator RTC Cellula Nummaria CR2032

Auxilium Systematis Operativi

Fenestrae Fenestrae 7/10/11
Linux Linux

Custos

Exitus Restitutio Systematis
Intervallum Programmabile per programmatum ab 1 ad 255 secundas

Mechanica

Materia clausurae Radiator: Mixtura aluminii, Arca: SGCC
Dimensiones 268mm (L) * 194.2mm (L) * 67.7mm (A) 268mm (L) * 194.2mm (L) * 118.5mm (A)
Pondus Pondus netum: 4.5 kgSumma: 6 kg (Involucro incluso) Pondus netum: 4.7 kgSumma: 6.2 kg (Involucro incluso)
Montatio VESA, Murale, Mensae

Ambitus

Systema Dissiptionis Caloris Refrigeratio Aeris PWM
Temperatura Operativa -20~60℃ (SSD Industrialis)
Temperatura Reponendi -40~80℃ (SSD Industrialis)
Humiditas Relativa 10 ad 90% RH (non condensans)
Vibratio Inter Operationem Cum SSD: IEC 60068-2-64 (3Grms@5~500Hz, fortuitum, 1hr/axe)
Impetus Inter Operationem Cum SSD: IEC 60068-2-27 (30G, dimidia sinus, 11ms)
Certificatio CCC, CE/FCC, RoHS
Q170

Modellum

E7S

E7DS

E7QS

CPU

CPU

Intel®Processores computatrales computatrales Core / Pentium / Celeron generationis sextae/septimae/octavae/nonae

TDP

65W

Socket

LGA1151

Microprocessus

Microprocessus

Q170

BIOS

BIOS

AMI UEFI BIOS (Sustentatio Temporis Custodis)

Memoria

Socket

Duo fissurae SO-DIMM non-ECC, DDR4 canalis duplicis usque ad 2133MHz

Capacitas Maxima

64GB, Singulum Maximum 32GB

Graphica

Moderator

Intel®Graphicae Altae Definitionis (HD)

Aethernet

Moderator

1 * Intel i210-AT GbE LAN Microprocessus (10/100/1000 Mbps)

1 * Intel i219-LM/V GbE LAN Chip (10/100/1000 Mbps)

Repositorium

SATA

1 * SATA3.0, spatia discorum rigidorum 2.5" celeriter liberanda (T≤7mm)

1 * SATA3.0, spatia interna pro disco duro 2.5" (T≤9mm, optionalia)

RAID 0, 1 sustinet

M.2

1 * M.2 Key-M (PCIe x4 Gen 3 + SATA3.0, NVMe/SATA SSD Auto Detect, 2280)

Expansin Slots

PCIe/PCI

N/A

1: 1 * PCIe x16 (x16) + 1 * PCIe x4 (x4)

2: 1 * PCIe x16 + 1 * PCI

3: 2 * PCI

PS: ①、②、③ Una ex tribus, Longitudo chartae expansionis ≤ 185mm, TDP ≤ 130W

1: 2 * PCIe x16 (x8/x8) + 2 * PCI

2: 1 * PCIe x16 (x16) + 1 * PCIe x4 (x4)

PS: ①、② Una ex duabus, Longitudo chartae expansionis ≤ 185mm, TDP ≤ 130W

MXM/aIanua

1 * APQ MXM (Facultativa MXM 4 * LAN/4 * POE/6 * COM/16 * charta expansionis GPIO)

Mini PCIe

1 * Mini PCIe (PCIe x1 Gen 2 + USB 2.0, cum 1 * Scheda SIM)

M.2

1 * Clavis M.2-B (PCIe x1 Gen 2 + USB3.0, cum 1 * Schedula SIM, 3052)

I/O anterior

Aethernet

Duo * RJ45

USB

6 * USB 3.0 (Typus-A, 5Gbps)

Ostendere

1 * DVI-D: resolutio maxima usque ad 1920*1200 @ 60Hz

1 * VGA (DB15/F): resolutio maxima usque ad 1920*1200 @ 60Hz

1 * DP: resolutio maxima usque ad 4096*2160 @ 60Hz

Audio

2 * Jack 3.5mm (Exitus Linearis + Microphonum)

Serialis

2 * RS232/422/485 (COM1/2, DB9/M, Viae Plenae, Commutator BIOS)

Duo RS232 (COM3/4, DB9/M)

Globulus

1 * Globulus Potestatis + LED Potestatis

1 * Globulus Systematis Restituendi (Preme 0.2 ad 1s ad memoriam denuo incipiendam, et preme 3s ad CMOS purgandum)

I/O posterior

Antenna

4 * Foramen antennae

SIM

Duo foramina pro chartis Nano SIM

Ingressus/Egressus Internus

USB

2 * USB2.0 (lamella)

LCD

1 * LVDS (lamella): resolutio maxima usque ad 1920 * 1200 @ 60Hz

Tabula anterior

1 * TF_Panel (3 * USB 2.0 + FPANEL, crustulum)

Tabula Frontalis

1 * Tabula Frontalis (PWR + RST + LED, lamella)

Orator

1 * Orator (2-W (per canalem)/8-Ω Onera, crustulum)

Serialis

2 * RS232 (COM5/6, crustulum)

GPIO

1 * 16 bitorum DIO (8xDI et 8xDO, crustulum)

LPC

1 * LPC (oblectum)

SATA

2 * Connectores SATA 7P

Potentia SATA

2 * SATA Potentia (lamella)

VENTILATOR

1 * Ventilator CPU (lamella)

2 * VENTILATOR SYSTEM (lamella)

Fons Potentiae

Typus

DC, AT/ATX

Tensio Potentiae Ingressae

9 ~ 36VDC, P≤240W

Coniunctor

1 * Coniunctor quattuor aciculorum, P=5.00/5.08

Accumulator RTC

Cellula Nummaria CR2032

Auxilium Systematis Operativi

Fenestrae

Nucleus 6/7™: Fenestrae 7/10/11

Nucleus 8/9™: Fenestrae 10/11

Linux

Linux

Custos

Exitus

Restitutio Systematis

Intervallum

Programmabile per programmatum ab 1 ad 255 secundas

Mechanica

Materia clausurae

Radiator: Mixtura aluminii, Arca: SGCC

Dimensiones

268mm (L) * 194.2mm (L) * 67.7mm (A)

268mm (L) * 194.2mm (L) * 118.5mm (A)

268mm (L) * 194.2mm (L) * 159.5mm (A)

Pondus

Pondus netum: 4.5 kg

Summa: 6 kg (Involucro incluso)

Pondus netum: 4.7 kg

Summa: 6.2 kg (Involucro incluso)

Pondus netum: 4.8 kg

Summa: 6.3 kg (Involucro incluso)

Montatio

VESA, Murale, Mensae

Ambitus

Systema Dissiptionis Caloris

Refrigeratio Ventilatoris PWM

Temperatura Operativa

-20~60℃ (SSD Industrialis)

Temperatura Reponendi

-40~80℃ (SSD Industrialis)

Humiditas Relativa

10 ad 90% RH (non condensans)

Vibratio Inter Operationem

Cum SSD: IEC 60068-2-64 (3Grms@5~500Hz, fortuitum, 1hr/axe)

Impetus Inter Operationem

Cum SSD: IEC 60068-2-27 (30G, dimidia sinus, 11ms)

Certificatio

CCC, CE/FCC, RoHS

H610

Modellum

E7S

E7DS

CPU

CPU Intel® 12/13tCPU computatralis generationis h Core / Pentium / Celeron
TDP 125W
Socket LGA1700
Microprocessus H610
BIOS AMI 256 Mbit SPI

Memoria

Socket Duo fissurae SO-DIMM non-ECC, DDR4 canalis duplicis usque ad 3200MHz
Capacitas Maxima 64GB, Singulum Maximum 32GB

Graphica

Moderator Intel®Graphica UHD

Aethernet

Moderator 1 * Intel i219-LM/V 1GbE LAN Microprocessus (LAN1, 10/100/1000 Mbps)

1 * Intel i225-V/LM 2.5GbE LAN Microprocessus (LAN2, 10/100/1000/2500 Mbps)

Repositorium

SATA 1 * SATA3.0, spatia discorum rigidorum 2.5" celeriter liberanda (T≤7mm)

1 * SATA3.0, spatia interna pro disco duro 2.5" (T≤9mm, optionalia)

M.2 1 * Clavis M.2-M (SATA3.0, 2280)

Areae Expansionis

Solium PCIe N/A 1: 1 * PCIe x16 (x16)2: 2 * PCIPS: 1...②Una ex duabus, longitudo chartae expansionis ≤ 185mm, TDP ≤ 130W
aIanua 1 * aDoor Bus (Optionalis 4 * LAN/4 * POE/6 * COM/16 * GPIO charta expansionis)
Mini PCIe 1 * Mini PCIe (PCIe3.0 x1 + USB 2.0, cum 1 * Nano SIM Card)

I/O anterior

Aethernet Duo * RJ45
USB 2 * USB3.2 Gen2x1 (Typus-A, 10Gbps)

2 * USB3.2 Gen1x1 (Typus-A, 5Gbps)

2 * USB 2.0 (Typus-A)

Ostendere 1 * HDMI 1.4b: resolutio maxima usque ad 4096 * 2160 @ 30Hz

1 * DP1.4a: resolutio maxima usque ad 4096*2160 @ 60Hz

Audio 2 * Jack 3.5mm (Exitus Linearis + Microphonum)
Serialis 2 * RS232/422/485 (COM1/2, DB9/M, Viae Plenae, Commutator BIOS)

2 * RS232 (COM3/4, DB9/M, Viae Plenae)

Globulus 1 * Globulus Potestatis + LED Potestatis

1 * AT/ATX Bulla

1 * Systema Operandi Recuperandi Bulla

1 * Bulla Restitutionis Systematis

I/O posterior

Antenna 4 * Foramen antennae
SIM 1* Spatium pro scheda Nano SIM (SIM1))

Ingressus/Egressus Internus

USB 6 * USB2.0 (lamellae)
LCD 1 * LVDS (lamella): resolutio maxima usque ad 1920 * 1200 @ 60Hz
Tabula Frontalis 1 * Tabula Frontalis (PWR + RST + LED, lamella)
Audio 1 * Audio (Caput)

1 * Orator (2-W (per canalem)/8-Ω Onera, crustulum)

Serialis 2 * RS232 (COM5/6, crustulum)
GPIO 1 * 16 bitorum DIO (8xDI et 8xDO, crustulum)
LPC 1 * LPC (oblectum)
SATA Connectores SATA 7P tres, usque ad 600MB/s
Potentia SATA 3 * SATA Potentia (lamella)
VENTILATOR 1 * Ventilator CPU (lamella)

2 * VENTILATOR SYSTEMATI (KF2510-4A)

Fons Potentiae

Typus DC, AT/ATX
Tensio Potentiae Ingressae 9~36VDC, P≤240W

18~60VDC, P≤400W

Coniunctor 1 * Coniunctor quattuor aciculorum, P=5.00/5.08
Accumulator RTC Cellula Nummaria CR2032

Auxilium Systematis Operativi

Fenestrae Fenestrae 10/11
Linux Linux

Custos

Exitus Restitutio Systematis
Intervallum Programmabile 1 ~ 255 sec

Mechanica

Materia clausurae Radiator: Mixtura aluminii, Arca: SGCC
Dimensiones 268mm (L) * 194.2mm (L) * 67.7mm (A) 268mm (L) * 194.2mm (L) * 118.5mm (A)
Pondus Pondus netum: 4.5 kgSumma: 6 kg (Involucro incluso) Pondus netum: 4.7 kgSumma: 6.2 kg (Involucro incluso)
Montatio VESA, Murale, Mensae

Ambitus

Systema Dissiptionis Caloris Refrigeratio Ventilatoris PWM
Temperatura Operativa -20 ~ 60℃ (SSD Industrialis)
Temperatura Reponendi -40 ~ 80℃ (SSD Industrialis)
Humiditas Relativa 10 ad 90% RH (non condensans)
Vibratio Inter Operationem Cum SSD: IEC 60068-2-64 (3Grms@5~500Hz, fortuitum, 1hr/axe)
Impetus Inter Operationem Cum SSD: IEC 60068-2-27 (30G, dimidia sinus, 11ms)
Certificatio CE/FCC, RoHS
Q670

Modellum

E7S

E7DS

E7QS

CPU

 

CPU

Intel®CPU computatralis duodecimae/tredecimae generationis Core / Pentium / Celeron

TDP

65W

Socket

LGA1700

Microprocessus

Q670

BIOS

AMI 256 Mbit SPI

Memoria

Socket

Duo fissurae SO-DIMM non-ECC, DDR4 canalis duplicis usque ad 3200MHz

Capacitas Maxima

64GB, Singulum Maximum 32GB

Graphica

Moderator

Intel®Graphica UHD

Aethernet

Moderator

1 * Intel i219-LM 1GbE LAN Microprocessus (LAN1, 10/100/1000 Mbps, RJ45)

1 * Intel i225-V 2.5GbE LAN Microprocessus (LAN2, 10/100/1000/2500 Mbps, RJ45)

Repositorium

SATA

1 * SATA3.0, spatia discorum rigidorum 2.5" celeriter liberanda (T≤7mm)

1 * SATA3.0, spatia interna pro disco duro 2.5" (T≤9mm, optionalia)

RAID 0, 1, 5 sustinet

M.2

1 * M.2 Key-M (PCIe x4 Gen 4 + SATA3.0, NVMe/SATA SSD Auto Detect, 2280)

Areae Expansionis

Solium PCIe

N/A

1: 1 * PCIe x16 (x16) + 1 * PCIe x4 (x4)

2: 1 * PCIe x16 + 1 * PCI

3: 2 * PCI

PS: ①、②、③ Una ex tribus, Longitudo chartae expansionis ≤ 185mm, TDP ≤ 130W

1: 2 * PCIe x16 (x8/x8) + 2 * PCI

2: 1 * PCIe x16 (x16) + 1 * PCIe x4 (x4)

PS: ①、② Una ex duabus, Longitudo chartae expansionis ≤ 185mm, TDP ≤ 130W

Ianua

1 * aDoor Bus (Optionalis 4 * LAN/4 * POE/6 * COM/16 * GPIO charta expansionis)

Mini PCIe

Duae Mini PCIe (PCIe x1 Gen 3 + USB 2.0, cum duabus chartis SIM)

M.2

1 * Clavis M.2-E (PCIe x1 Gen 3 + USB 2.0, 2230)

I/O anterior

Aethernet

Duo * RJ45

USB

2 * USB3.2 Gen2x1 (Typus-A, 10Gbps)

6 * USB3.2 Gen 1x1 (Typus-A, 5Gbps)

Ostendere

1 * HDMI 1.4b: resolutio maxima usque ad 4096 * 2160 @ 30Hz

1 * DP1.4a: resolutio maxima usque ad 4096*2160 @ 60Hz

Audio

2 * Jack 3.5mm (Exitus Linearis + Microphonum)

Serialis

2 * RS232/485/422 (COM1/2, DB9/M, Viae Plenae, Commutator BIOS)

2 * RS232 (COM3/4, DB9/M, Viae Plenae)

Globulus

1 * Globulus Potestatis + LED Potestatis

1 * AT/ATX Bulla

1 * Systema Operandi Recuperandi Bulla

1 * Bulla Restitutionis Systematis

I/O posterior

Antenna

4 * Foramen antennae

SIM

Duo foramina pro chartis Nano SIM

Ingressus/Egressus Internus

USB

6 * USB2.0 (lamellae)

LCD

1 * LVDS (lamella): Resolutio LVDS usque ad 1920 * 1200 @ 60Hz

Tabula Frontalis

1 * Tabula Frontalis (PWR + RST + LED, lamella)

Audio

1 * Audio (Caput)

1 * Orator (2-W (per canalem)/8-Ω Onera, crustulum)

Serialis

2 * RS232 (COM5/6, crustulum)

GPIO

1 * 16 bitorum DIO (8xDI et 8xDO, crustulum)

LPC

1 * LPC (oblectum)

SATA

Connectores SATA 7P tres, usque ad 600MB/s

Potentia SATA

3 * SATA Potentia (lamella)

VENTILATOR

1 * Ventilator CPU (lamella)

2 * VENTILATOR SYSTEMATI (KF2510-4A)

Fons Potentiae

Typus

DC, AT/ATX

Tensio Potentiae Ingressae

9~36VDC, P≤240W

18~60VDC, P≤400W

Coniunctor

1 * Coniunctor quattuor aciculorum, P=5.00/5.08

Accumulator RTC

Cellula Nummaria CR2032

Auxilium Systematis Operativi

Fenestrae

Fenestrae 10/11

Linux

Linux

Custos

Exitus

Restitutio Systematis

Intervallum

Programmabile 1 ~ 255 sec

Mechanica

Materia clausurae

Radiator: Mixtura aluminii, Arca: SGCC

Dimensiones

268mm (L) * 194.2mm (L) * 67.7mm (A)

268mm (L) * 194.2mm (L) * 118.5mm (A)

268mm (L) * 194.2mm (L) * 159.5mm (A)

Pondus

Pondus netum: 4.5 kg

Summa: 6 kg (Involucro incluso)

Pondus netum: 4.7 kg

Summa: 6.2 kg (Involucro incluso)

Pondus netum: 4.8 kg

Summa: 6.3 kg (Involucro incluso)

Montatio

VESA, Murale, Mensae

Ambitus

Systema Dissiptionis Caloris

Refrigeratio Ventilatoris PWM

Temperatura Operativa

-20~60℃ (SSD Industrialis)

Temperatura Reponendi

-40~80℃ (SSD Industrialis)

Humiditas Relativa

10 ad 90% RH (non condensans)

Vibratio Inter Operationem

Cum SSD: IEC 60068-2-64 (3Grms@5~500Hz, fortuitum, 1hr/axe)

Impetus Inter Operationem

Cum SSD: IEC 60068-2-27 (30G, dimidia sinus, 11ms)

Certificatio

CE/FCC, RoHS

Delineatio Ingeniaria (1) Delineatio Ingeniaria (2) Delineatio Ingeniaria (3) Delineatio Ingeniaria (4)

  • E7S-H81_SpecificationSheet_APQ
    E7S-H81_SpecificationSheet_APQ
    DEPRIME
  • E7S-Q170_SpecificationSheet_APQ
    E7S-Q170_SpecificationSheet_APQ
    DEPRIME
  • E7S-H610_SpecificationSheet_APQ
    E7S-H610_SpecificationSheet_APQ
    DEPRIME
  • E7S-Q670_SpecificationSheet_APQ
    E7S-Q670_SpecificationSheet_APQ
    DEPRIME
  • EXEMPLA ACQUIRE

    Efficax, tutus et fidus. Nostra instrumenta solutionem rectam cuilibet necessitati praestant. Fruere peritia nostra in industria et valorem additum crea - quotidie.

    Preme pro InquisitionePlura preme