PC ea LEBOKOSE | TAC-3000 Pro
Tsamaiso ea hole
Tlhokomelo ea maemo
Ts'ebetso le tlhokomelo e hole
Taolo ea Polokeho
ITEANYE LE RONABOX PC APQ TAC-3000 Pro ke lemati la indasteri la APQ le hahiloeng bakeng sa boiketsetso ba indasteri, taolo ea mochini, HMI, khomphutha ea moeli, le merero ea lisebelisoa tse bohlale. Sistimi ena e thehiloe holim'a khomphutha ea nvidia ai, e fang baenjiniere sethala se tšepahalang sa lisebelisoa bakeng sa lifeme, mela ea tlhahiso, litsamaiso tsa tlhahlobo, likhabinete tsa taolo tse kentsoeng, le ho kenngoa ha tlhahiso e bohlale ha ka nako e ts'oanang ho boloka mohlala o nepahetseng oa sehlahisoa oa BOX PC APQ TAC-3000 Pro o hlakile bakeng sa ho batla le ho reka sehlahisoa. Likarolo tsa bohlokoa li kenyelletsa NVIDIA® JetsonTM Orin Series SO-DIMM; Mokhoa o motle, ho fihlela ho 157TOPS; 3*GbE、4*USB 5Gbps; 16bit GPIO、4*RS232/RS485; 5G/4G, WiFi +BT katoloso; Ho kenya matla a DC 12~28V ka bophara. Bokhoni bona bo thusa BOX PC APQ TAC-3000 PRO ho ts'ehetsa ts'ebetso e tsoelang pele libakeng tse hlokang thuso moo kaho e tšoarellang, kopanyo e sebetsang hantle, I/O e tsitsitseng, le botsitso ba potoloho ea bophelo bo leng bohlokoa. E loketse baetsi ba lisebelisoa tsa OEM, ba kopanyang litsamaiso, bafani ba litharollo tsa othomathike, merero ea pono ea mochini, li-terminal tsa ho fumana data, litsamaiso tsa taolo ea liroboto, le li-node tsa komporo ea liindasteri. Kakaretso ea litlhaloso: processor/platform: komporo ea nvidia ai; marang-rang: 1 * GBE LAN Chip (letšoao la LAN ho tsoa ho System-on-Module), 10/100/1000 Mbps; ponts'o: 1 * GBE LAN Chip (letšoao la LAN ho tsoa ho System-on-Module), 10/100/1000 Mbps; I/O le katoloso: 1 * Mini PCIe Slot (PCIe x1 + USB 2.0, e nang le 1 * Nano SIM Card Slot); ho kenya matla: 1 * Power Input (2P, P=5.00/5.08, Terminal Block). Bakeng sa bareki ba batlang apq tac-3000 pro, industrial box pc, apq, nvidia ai computing, wide-voltage dc input, dual gigabit lan, BOX PC APQ TAC-3000 Pro e fana ka tekano e sebetsang ea ts'ebetso, katoloso, moralo o thata, le ho tenyetseha ha ho kenngoa bakeng sa lits'ebetso tsa sejoale-joale tsa khomphutha ea indasteri.
| Mohlala | TAC-3000 Pro | ||||
| Sistimi ea Processor | SOM | Orin Nano 4GB | Orin Nano 8GB | Orin NX 8GB | Orin NX 16GB |
| Tshebetso ea AI | LITLHOHO TSE 20 / LITLHOHO TSE 34 (Tse Ntle) | LITLHOHO TSE 40 / LITLHOHO TSE 67 (Tse Ntle) | LITLHORO TSE 70 / LITLHORO TSE 117 (Tse Ntle) | LITLHOHO TSE 100 / LITLHOHO TSE 157 (Tse Ntle) | |
| Ethernet | Molaoli | 1 * GBE LAN Chip (letšoao la LAN ho tsoa ho System-on-Module), 10/100/1000 Mbps | |||
| 2 * Intel®i210-AT, 10/100/1000 Mbps | |||||
| Polokelo | M.2 | Sebaka sa 1 * M.2 Key-M (NVMe SSD, 2280) | |||
| Katoloso Li-slot | PCIe e nyane | Sebaka sa 1 * Mini PCIe (PCIe x1 + USB 2.0, se nang le Sebaka sa 1 * Nano SIM Card) | |||
| M.2 | Sebaka sa 1 * M.2 Key-E (PCIe x1 + USB 2.0, 2230) | ||||
| M.2 | Sebaka sa 1 * M.2 Key-B (USB 5Gbps + USB 2.0, 3052, ka Sebaka sa 1 * Nano SIM Card) | ||||
| I/O e ka pele | Ethernet | 3 * GbE (RJ45) | |||
| USB | 2 * USB 10Gbps (Mofuta oa A) | ||||
| 2 * USB 5Gbps (Mofuta oa A) | |||||
| Pontšo | 1 * HDMI, Qeto e phahameng ho fihlela ho 4096*2304@30Hz (Mofuta oa A) | ||||
| Konopo | Konopo ea Matla e le 1 * + LED ea Matla | ||||
| 1 * Konopo ea ho Seta Sistimi Bocha | |||||
| 1 * Konopo ea ho Pholosa Sistimi | |||||
| LED | 1 * LED ea Boemo ba Sistimi | ||||
| Kenyelletso ea Matla | 1 * Kenyelletso ea Matla (2P, P=5.00/5.08, Bolo ea Terminal) | ||||
| Lehlakore la I/O | OTG | 1 * USB 2.0 (Mofuta oa C, Kou e Khanyang) | |||
| Tokiso ea phoso | 1 * USB 2.0 (Mofuta oa C, Kou ea ho Lokisa Mathata) | ||||
| SIM | 2 * Nano SIM | ||||
| I/O ea ka hare | Letoto | 4 * RS232/RS485 (wafer, Sefetola sa Jumper) | |||
| 1 * TTL (wafer) | |||||
| KENYA | KHANNE E 2 (wafer) | ||||
| GPIO | 16bit DIO (OS Configurable DI/DO le H/L, wafer) | ||||
| Molumo | 1 * Audio (Mola-Out + MIC, wafer) | ||||
| 1 * Amplifier, 5-W (ka kanale) ka hara 8-Ω Loads (wafer) | |||||
| USB | 2 * USB 2.0 (sejana sa ho hlapela) | ||||
| FAN | 1 * Fene ea Sistimi (wafer) | ||||
| BAT | 1 * BAT (wafer) | ||||
| Phanele e ka Pele | 1 * Phanele e ka Pele (Matla + Ho Seta Botjha + Ho Hlasimolla, wafer) | ||||
| Phepelo ea motlakase | Mofuta | AT/ATX | |||
| Motlakase oa ho Kena oa Matla | 12~28V DC | ||||
| Sehokelo | Sehokelo sa ho Kena sa Matla se le 1 (2P, P=5.08mm, Boloko ba Terminal) | ||||
| Betri ea RTC | Sele ea Chelete ea CR2032 | ||||
| Tšehetso ea OS | Linux | Jetpack 6.2 (Ubuntu 22.04) | |||
| Mekaniki | Lisebelisoa tsa ho kenya ka hare | Radiator: Aluminium alloy | |||
| Litekanyo | 150.7mm(L) * 114.5mm(W) * 45mm(H) (Hardware ea ho Hlomamisa ha e kenyelelitsoe) | ||||
| Ho hloma | Ho Kenya Tsebe, Ho Kenya Terene ea DIN (Khetho ea ho Romela) | ||||
| Tikoloho | Sistimi ea ho Pholisa | Ho Pholisa Fan ho Sebetsang | |||
| Mocheso o sebetsang | -20~50℃ (SSD ea indasteri) | ||||
| Mocheso oa Polokelo | -40~80℃ (SSD ea indasteri) | ||||
| Mongobo o Lekanyelitsoeng | 10 ho isa ho 95% (ha e kolobise) | ||||
| Ho thothomela | 3Grms@5~500Hz, ka mokhoa o sa reroang, hora e le 1/axis | ||||
| Tšabo | 15G, halofo ea sine, 11ms, ±X/Y/Z, li-shock/axis tse 3 | ||||
FUMANA DISAMPELE
E sebetsa hantle, e bolokehile ebile e ka tšeptjoa. Lisebelisoa tsa rona li tiisa tharollo e nepahetseng bakeng sa tlhoko efe kapa efe. Rua molemo ho tsebo ea rona ea indasteri 'me u hlahise boleng bo eketsehileng - letsatsi le leng le le leng.
Tobetsa Bakeng sa Dipotso
