Lihlahisoa

PC ea Edge AI APQ TER30J-B3

PC ea Edge AI APQ TER30J-B3

Likaroloana:

  • NVIDIA®Jetson AGX Orin, ho fihla ho 275TOPS

  • 2*GbE,1*10GbE RJ45
  • 3*USB 10Gbps, 5*USB 5Gbps Mofuta oa A
  • 2*RS232/RS485,2*K'HANENG FD,8*GPIO
  • Wi-Fi, BT, 4G/5G
  • Ho qhala ha mocheso o mafolofolo
  • 12~28V DC


  • Tsamaiso ea hole

    Tsamaiso ea hole

  • Tlhokomelo ea maemo

    Tlhokomelo ea maemo

  • Ts'ebetso le tlhokomelo e hole

    Ts'ebetso le tlhokomelo e hole

  • Taolo ea Polokeho

    Taolo ea Polokeho

SELELEKELA

Setšoantšo sa Boenjiniere

Khoasolla Faele

Mohlala

TER30J-B3

Li-module tsa mantlha

Jetson AGX Orin 32GB, 200 TOPS Jetson AGX Orin 64GB, 275 TOPS

Ethernet

Molaoli 1 * Marvell®AQR113C,10/100/1000/2500/5000/10000 Mbps
1 * Marvell®88E1512,10/100/1000 Mbps
2 * Intel®i226-V/LM,10/100/1000/2500 Mbps

Polokelo

M.2 Sebaka sa 1 * M.2 Key-M (NVMe SSD, 2280)
TF Sebaka sa Karete ea TF se le 1 *

Libaka tsa Katoloso

M.2 Sebaka sa 1 * M.2 Key-B (USB 5Gbps + USB 2.0, 3052, ka Sebaka sa 1 * Nano SIM Card)
Sebaka sa 1 * M.2 Key-E (PCIe x1 + USB 2.0)

I/O e ka pele

Ethernet 1 * 10GbE (RJ45)
2 * GbE (RJ45)
USB 3 * USB 10Gbps (Mofuta oa A)
5 * USB 5Gbps (Mofuta oa A)
Pontšo 1 * HDMI: Qeto ho fihlela ho 4096*2304@30Hz (Mofuta-A)
LED 1 * LED ea Boemo ba Sistimi
Konopo Konopo ea Matla e le 1 * + LED ea Matla
1 * Konopo ea ho Seta Sistimi Bocha
1 * Konopo ea ho Pholosa Sistimi
Kenyelletso ea Matla 1 * Kenyelletso ea Matla (2P, P=5.00/5.08, Bolo ea Terminal)

Lehlakore la I/O

OTG 1 * USB 2.0 (Mofuta oa C, Kou e benyang)
Tokiso ea phoso 1 * USB 2.0 (Mofuta oa C, koung ea ho lokisa liphoso)
TF Sebaka sa Karete ea TF se le 1 *
SIM 1 * Li-Slots tsa Karete ea Nano SIM

I/O ea ka hare

Phanele e ka Pele 1 * Phanele e ka Pele (Matla + Ho Seta Botjha + Ho Hlasimolla, wafer)
Ho emisa Ethernet (88E1512) + Debug (Uart) + OTG (USB 2.0) + GPIO
FAN 1 * Fene ea Sistimi (wafer)
GPIO 8bit GPIO (OS Configurable DI/DO le H/L, wafer)
Letoto 2 * RS232/485 (Sesebelisoa sa ho tjhesa ka jumper, wafer)
1 * TTL (wafer)
Molumo 1 * Audio (Mola_Out + Maekrofono) (wafer)

Phepelo ea motlakase

Mofuta AT/ATX
Motlakase oa ho Kena oa Matla 12 ~ 28V DC
Sehokelo Sehokelo sa ho Kena sa Matla se le 1 (2P, P=5.08mm, Boloko ba Terminal)
Betri ea RTC Sele ea Chelete ea CR2032

Tšehetso ea OS

Linux Jetpack6.2 (Ubuntu22.04)

Mekaniki

Lisebelisoa tsa ho kenya ka hare Motsoako oa aluminium
Litekanyo 118.2mm(L) * 130mm(W) * 57.6mm(H)
Ho hloma Ho Hloma ka Bracket

Tikoloho

Sistimi ea ho Hala ha Mocheso Ho Pholisa Fan ho Sebetsang
Mocheso o sebetsang -20~50℃ (SSD ea indasteri)
Mocheso oa Polokelo -40~80℃ (SSD ea indasteri)
Mongobo o Lekanyelitsoeng 10 ho isa ho 95% RH (ha e kolobise)
Ho thothomela Nakong ea Ts'ebetso 3Grms@5~500Hz, ka mokhoa o sa reroang, hora e le 1/axis
Tšabo Nakong ea Ts'ebetso 15G, halofo ea sine, 11ms, ±X/Y/Z, li-shock/axis tse 3

 

Boholo ba Sehlahisoa

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I/O ea Sehlahisoa

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  • FUMANA DISAMPELE

    E sebetsa hantle, e bolokehile ebile e ka tšeptjoa. Lisebelisoa tsa rona li tiisa tharollo e nepahetseng bakeng sa tlhoko efe kapa efe. Rua molemo ho tsebo ea rona ea indasteri 'me u hlahise boleng bo eketsehileng - letsatsi le leng le le leng.

    Tobetsa Bakeng sa DipotsoTobetsa ho feta