PC ea Edge AI APQ TER30J-C3
Tsamaiso ea hole
Tlhokomelo ea maemo
Ts'ebetso le tlhokomelo e hole
Taolo ea Polokeho
ITEANYE LE RONAEDGE AI PC APQ TER30J-C3 ke lemati la indasteri la APQ le hahiloeng bakeng sa boiketsetso ba indasteri, taolo ea mochini, HMI, khomphutha ea moeli, le merero ea lisebelisoa tse bohlale. Sistimi ena e thehiloe ho khomphutha ea nvidia ai, e fang baenjiniere sethala se tšepahalang sa lisebelisoa bakeng sa lifeme, mela ea tlhahiso, litsamaiso tsa tlhahlobo, likhabinete tsa taolo tse kentsoeng, le ho kenngoa ha tlhahiso e bohlale ha ka nako e ntse e boloka mohlala o nepahetseng oa sehlahisoa EDGE AI PC APQ TER30J-C3 e hlakile bakeng sa lipatlisiso tsa sehlahisoa le theko. Likarolo tsa bohlokoa li kenyelletsa NVIDIA® Jetson AGX Orin, ho fihlela ho 275TOPS; 2*GbE,1*10GbE RJ45; likou tsa khamera tsa 8*GMSL2 , e tšehetsa ho hokahanya nako ea GNSS; 3*USB 10Gbps,1*USB 5Gbps Type-A; 2*RS232/RS485,2*CAN FD,8*GPIO; Wi-Fi、BT、4G/5G. Bokgoni bona bo thusa EDGE AI PC APQ TER30J-C3 ho tshehetsa tshebetso e tswelang pele dibakeng tse hlokang thuso moo kaho e tshwarellang, kopanyo e sebetsang hantle, I/O e tsitsitseng, le botsitso ba potoloho ya bophelo di leng bohlokwa. E loketse dihahi tsa disebediswa tsa OEM, di-integrators tsa sistimi, bafani ba ditharollo tsa othomathike, diporojeke tsa pono ya mochini, di-terminal tsa ho fumana data, ditsamaiso tsa taolo ya robotiki, le di-node tsa khomphutha ya moedi wa indasteri. Kakaretso ya ditlhaloso: processor/platform: nvidia ai computing; marangrang: 1 * Marvell® AQR113C,10/100/1000/2500/5000/10000 Mbps; pontsho: 1 * Marvell® AQR113C,10/100/1000/2500/5000/10000 Mbps; I/O le katoloso: 1 * M.2 Key-B Slot (USB 5Gbps + USB 2.0, 3052, e nang le 1 * Nano SIM Card Slot); ho kenya motlakase: 1 * Ho kenya motlakase (2P, P=5.00/5.08, Terminal Block). Bakeng sa bareki ba batlang apq ter30j-c3, edge ai industrial pc, apq, nvidia ai computing, dual gigabit lan, expansion ya waelese, EDGE AI PC APQ TER30J-C3 e fana ka tekano e sebetsang ya tshebetso, katoloso, moralo o thata, le ho tenyetseha ha ho kenngwa tshebetsong bakeng sa ditshebediso tsa sejwalejwale tsa dikhomphutha tsa diindasteri.
| Mohlala | TER30J-C3 | ||
| Li-module tsa mantlha | Jetson AGX Orin 32GB, 200 TOPS | Jetson AGX Orin 64GB, 275 TOPS | |
| Ethernet | Molaoli | 1 * Marvell®AQR113C,10/100/1000/2500/5000/10000 Mbps | |
| 3 * Intel®i210AT,10/100/1000 Mbps | |||
| Polokelo | M.2 | Sebaka sa 1 * M.2 Key-M (NVMe SSD, 2280) | |
| Libaka tsa Katoloso | M.2 | Sebaka sa 1 * M.2 Key-B (USB 5Gbps + USB 2.0, 3052, ka Sebaka sa 1 * Nano SIM Card) | |
| Sebaka sa 1 * M.2 Key-E (PCIe x1 + USB 2.0) | |||
| I/O e ka pele | Ethernet | 1 * 10GbE (RJ45) | |
| 2 * GbE (RJ45) | |||
| USB | 3 * USB 10Gbps (Mofuta oa A) | ||
| 1 * USB 5Gbps (Mofuta oa A) | |||
| Pontšo | 1 * HDMI: Qeto ho fihlela ho 4096*2304@30Hz (Mofuta-A) | ||
| GMSL | 8 * GMSL2 (FAKRA Mini Quad, E tona) | ||
| LED | 1 * LED ea Boemo ba Sistimi | ||
| Konopo | Konopo ea Matla e le 1 * | ||
| 1 * Konopo ea ho Seta Sistimi Bocha | |||
| 1 * Konopo ea ho Pholosa Sistimi | |||
| Kenyelletso ea Matla | 1 * Kenyelletso ea Matla (2P, P=5.00/5.08, Bolo ea Terminal) | ||
| Lehlakore la I/O | OTG | 1 * USB 2.0 (Mofuta oa C, Kou e benyang) | |
| Tokiso ea phoso | 1 * USB 2.0 (Mofuta oa C, koung ea ho lokisa liphoso) | ||
| SIM | 1 * Li-Slots tsa Karete ea Nano SIM | ||
| I/O ea ka hare | Phanele e ka Pele | 1 * Phanele e ka Pele (Matla + Ho Seta Botjha + Ho Hlasimolla, wafer) | |
| Ho emisa | Ethernet (i210-AT) + Debug (Uart) + OTG (USB 2.0) + GPIO | ||
| FAN | 1 * Fene ea Sistimi (wafer) | ||
| GPIO | 8bit GPIO (OS Configurable DI/DO le H/L, wafer) | ||
| Letoto | 2 * RS232/485 (E ka hlophisoang ke OS, wafer) | ||
| 1 * TTL (wafer) | |||
| PPS | 1 * PPS KA HARE (wafer) | ||
| Molumo | 1 * Audio (Mola_Out + Maekrofono) (wafer) | ||
| Phepelo ea motlakase | Mofuta | AT/ATX | |
| Motlakase oa ho Kena oa Matla | 12 ~ 28V DC | ||
| Sehokelo | Sehokelo sa ho Kena sa Matla se le 1 (2P, P=5.08mm, Boloko ba Terminal) | ||
| Betri ea RTC | Sele ea Chelete ea CR2032 | ||
| Tšehetso ea OS | Linux | Jetpack6.2 (Ubuntu22.04) | |
| Mekaniki | Lisebelisoa tsa ho kenya ka hare | Motsoako oa aluminium | |
| Litekanyo | 118.2mm(L) * 130mm(W) * 57.6mm(H) | ||
| Ho hloma | Ho Hloma ka Bracket | ||
| Tikoloho | Sistimi ea ho Hala ha Mocheso | Ho Pholisa Fan ho Sebetsang | |
| Mocheso o sebetsang | -20~50℃ (SSD ea indasteri) | ||
| Mocheso oa Polokelo | -40~80℃ (SSD ea indasteri) | ||
| Mongobo o Lekanyelitsoeng | 10 ho isa ho 95% RH (ha e kolobise) | ||
| Ho thothomela Nakong ea Ts'ebetso | 3Grms@5~500Hz, ka mokhoa o sa reroang, hora e le 1/axis | ||
| Tšabo Nakong ea Ts'ebetso | 15G, halofo ea sine, 11ms, ±X/Y/Z, li-shock/axis tse 3 | ||
Boholo ba Sehlahisoa
I/O ea Sehlahisoa
FUMANA DISAMPELE
E sebetsa hantle, e bolokehile ebile e ka tšeptjoa. Lisebelisoa tsa rona li tiisa tharollo e nepahetseng bakeng sa tlhoko efe kapa efe. Rua molemo ho tsebo ea rona ea indasteri 'me u hlahise boleng bo eketsehileng - letsatsi le leng le le leng.
Tobetsa Bakeng sa Dipotso
