Products

E5S Embedded Industrial PC

E5S Embedded Industrial PC

Features:

  • Utilizes the Intel® Celeron® J6412 low-power quad-core processor

  • Integrates dual Intel® Gigabit network cards
  • Onboard 8GB LPDDR4 high-speed memory
  • Two onboard display interfaces
  • Support for dual hard drive storage
  • Supports 12~28V DC wide voltage power supply
  • Supports WiFi/4G wireless expansion
  • Ultra-compact body, fanless design, with optional aDoor module

  • Remote management

    Remote management

  • Condition monitoring

    Condition monitoring

  • Remote operation and maintenance

    Remote operation and maintenance

  • Safety Control

    Safety Control

Product Description

The APQ Embedded Industrial PC E5S Series J6412 platform is an ultra-compact industrial computer designed specifically for industrial automation and edge computing applications. It utilizes the Intel Celeron J6412 low-power quad-core processor, which is efficient and stable, ensuring smooth operation of various applications. Dual Gigabit network cards provide a stable channel for large data transmission, meeting real-time communication needs. The 8GB LPDDR4 memory ensures smooth multitasking, offering efficient computing capabilities. Additionally, two onboard display interfaces facilitate real-time monitoring, and the dual hard drive storage design meets data storage requirements. This series also supports WiFi/4G wireless expansion, making wireless connections and control convenient, further expanding its application scenarios. Adapted to 12~28V DC wide voltage power supply, it ensures stability in various environments. The ultra-compact body design and fanless cooling system make the E5S Series suitable for more embedded scenarios. Whether in confined spaces or harsh environments, the E5S Series provides stable and efficient computing support.

In summary, with its powerful performance and rich interfaces, the APQ E5S Series J6412 platform Embedded Industrial PC provides a solid backbone for industrial automation and edge computing, meeting the needs of various complex application scenarios.

 

INTRODUCTION

Engineering Drawing

File Download

Model

E5M

 Processor System

CPU Intel® Celeron® Processor J1900, FCBGA1170
TDP 10W
Chipset SOC
BIOS AMI UEFI BIOS

Memory

Socket 1 * DDR3L-1333MHz SO-DIMM Slot
Max Capacity 8GB

Graphics

Controller Intel® HD Graphics

Ethernet

Controller 2 * Intel® i210-AT (10/100/1000 Mbps, RJ45)

Storage

SATA 1 * SATA2.0 Connector (2.5-inch hard disk with 15 + 7pin)
M.2 1 * M.2 Key-M Slot (support SATA SSD, 2280)

Expansion Slots

MXM/aDoor 1 * MXM Slot (LPC + GPIO, support COM/GPIO MXM card)
Mini PCIe 1 * Mini PCIe Slot (PCIe2.0 + USB2.0, with 1 * Nano SIM Card)

Front I/O

USB 1 * USB3.0 (Type-A)
3 * USB2.0 (Type-A)
Ethernet 2 * RJ45
Display 1 * VGA: max resolution up to 1920*1280 @ 60Hz
1 * HDMI: max resolution up to 1920*1280 @ 60Hz
Audio 1 * 3.5mm Line-out Jack
1 * 3.5mm MIC Jack
Serial 2 * RS232/485 (COM1/2, DB9/M)
4 * RS232 (COM3/4/5/6, DB9/M)
Power 1 * 2Pin Power Input Connector (12~28V, P= 5.08mm)

Rear I/O

USB 4 * USB2.0 (Type-A)
SIM 1 * Nano SIM Card slot
Button 1 * Power Button with LED

Internal I/O

Front Panel 1 * TFront Panel (3 * USB2.0 + Front Panel, wafer)
1 * Front Panel (wafer)
FAN 1 * SYS FAN (wafer)
LPC 1 * LPC (wafer)
PS/2 1 * PS/2 (PS/2 keyboard + mouse, wafer)
USB 2 * USB2.0 (wafer)
Power 1 * DCIN (Power input, wafer)
Display 1 * LVDS/eDP (Default LVDS, wafer)
GPIO 1 * 16bits DIO (8xDI and 8xDO, wafer)
Audio 1 * Front Audio (Line-Out + MIC, header)
1 * Speaker (2-W (per channel)/8-Ω Loads, wafer)

Power Supply

Type DC
Power Input Voltage 12~28VDC
Connector 1 * 2Pin Power Input Connector (12~28V, P= 5.08mm)
RTC Battery CR2032 Coin Cell

OS Support

Windows Windows 7/8.1/10
Linux Linux

Watchdog

Output System Reset
Interval Programmable 1 ~ 255 sec

Mechanical

Enclosure Material Radiator: Aluminum alloy, Box: SGCC
Dimensions 293.5mm(L) * 149.5mm(W) * 54.5mm(H)
Weight Net: 2.1Kg

Total: 3.1Kg (include packaging)

Mounting VESA, Wall mounted, Desk mounting

Environment

Heat Dissipation System Passive heat dissipation
Operating Temperature -20~60℃ 
Storage Temperature -40~80℃
Relative Humidity 5 to 95% RH (non-condensing)
Vibration During Operation With SSD: IEC 60068-2-64 (3Grms@5~500Hz, random, 1hr/axis)
Shock During Operation With SSD: IEC 60068-2-27 (30G, half sine, 11ms)
Certification CE/FCC, RoHS

E5M_SpecSheet(APQ)_CN_20231222 (11)

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