Mobile Platform

Mobile Platform

CPU:

  • Intel Atom Dynamic Platform
  • Intel Mobile Mobile Platform
  • Intel Desktop Desktop Platform
  • Intel Xeon Super Platform
  • Nvidia Jetson Platform
  • Rockchips Microelectronics

PCH:

  • B75
  • H81
  • Q170
  • H110
  • H310C
  • H470
  • Q470
  • H610
  • Q670

Screen Size:

  • 7"
  • 10.1"
  • 10.4"
  • 11.6"
  • 12.1"
  • 13.3"
  • 15"
  • 15.6"
  • 17"
  • 18.5"
  • 19"
  • 19.1"
  • 21.5"
  • 23.8"
  • 27"

Resolution:

  • 800*600
  • 1024*768
  • 1280*800
  • 1280*1024
  • 1366*768
  • 1440*900
  • 1920*1080

Touch Screen:

  • Capacitive/Resistive Touch Screen
  • Resistive Touch Screen
  • Capacitive Touch Screen
  • Tempered Glass

Product Features:

  • IP65
  • No Fan
  • PCIe
  • PCI
  • M.2
  • 5G
  • POE
  • Light Source
  • GPIO
  • CAN
  • Dual Hard Drive
  • RAID
  • E6 Embedded Industrial PC

    E6 Embedded Industrial PC

    Features:

    • Utilizes Intel® 11th-U mobile platform CPU

    • Integrates dual Intel® Gigabit network cards
    • Two onboard display interfaces
    • Supports dual hard drive storage, with 2.5” hard drive featuring a pull-out design
    • Supports APQ aDoor Bus module expansion
    • Supports WiFi/4G wireless expansion
    • Supports 12~28V DC wide voltage power supply
    • Compact body, fanless design, with detachable heatsink
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