BOX PC APQ TMV-6000/ 7000
Remote management
Condition monitoring
Remote operation and maintenance
Safety Control
CONTACT USBOX PC APQ TMV-6000/ 7000 is an APQ industrial display built for industrial automation, machine control, HMI, edge computing, and intelligent equipment projects. The system is based on intel core cpu, giving engineers a reliable hardware platform for factories, production lines, inspection systems, embedded control cabinets, and smart manufacturing deployments while keeping the exact product model BOX PC APQ TMV-6000/ 7000 clear for product search and procurement. Key features include Support Intel ® 6th to 9th Core ™ I7/i5/i3 Desktop CPU; Paired with Q170/C236 industrial grade chipset; DP+HDMI dual 4K display interface, supporting synchronous/asynchronous dual display; 4 USB 3.0 interfaces; Two DB9 serial ports; 6 Gigabit network interfaces, including 4 optional POEs. These capabilities help BOX PC APQ TMV-6000/ 7000 support continuous operation in demanding environments where durable construction, efficient integration, stable I/O, and lifecycle consistency matter. It is suitable for OEM equipment builders, system integrators, automation solution providers, machine vision projects, data acquisition terminals, robotic control systems, and industrial edge computing nodes. Specifications summary: processor/platform: intel core cpu; memory: SoC; networking: 2 * Intel i210-AT/i211-AT;I219-LM LAN Chip ( 10/100/1000 Mbps, RJ45)4 * Intel i210-AT LAN Chip ( 10/100/1000 Mbps, RJ45; support POE); display: Intel® HD Graphics; I/O and expansion: ①6 * COM（30pin Spring-loaded plug-in Phoenix terminals， RS232/422/485 optional (select by BOM），RS422/485 Optoelectronic isolation function optional）+16 * GPIO（3. For buyers searching for apq tmv-6000/ 7000, industrial box pc, apq, intel core cpu, wide-voltage dc input, dual gigabit lan, BOX PC APQ TMV-6000/ 7000 offers a practical balance of performance, expandability, rugged design, and deployment flexibility for modern industrial computing applications.
TMV-6000
TMV-7000
TMV-6000
| Model | TMV-6000 | |
| CPU | CPU | Intel® 6-8/11th Generation Core / Pentium/ Celeron mobile CPU |
| TDP | 35W | |
| Socket | SoC | |
| Chipset | Chipset | Intel® Q170/C236 |
| BIOS | BIOS | AMI UEFI BIOS (Support Watchdog Timer) |
| Memory | Socket | 1 * Non-ECC SO-DIMM Slot, Dual Channel DDR4 up to 2400MHz |
| Max Capacity | 16GB, Single Max. 16GB | |
| Graphics | Controller | Intel® HD Graphics |
| Ethernet | Controller | 2 * Intel i210-AT/i211-AT;I219-LM LAN Chip ( 10/100/1000 Mbps, RJ45)4 * Intel i210-AT LAN Chip ( 10/100/1000 Mbps, RJ45; support POE) |
| Storage | M.2 | 1 * M.2(Key-M，support 2242/2280 SATA or PCIe x4/x2 NVME SSD)1 * M.2(key-M，support 2242/2280 SATA SSD) |
| Expansin Slots | Expansion box | ①6 * COM（30pin Spring-loaded plug-in Phoenix terminals， RS232/422/485 optional (select by BOM），RS422/485 Optoelectronic isolation function optional）+16 * GPIO（36pin Spring-loaded plug-in Phoenix terminals，support 8* Optoelectronic isolation input，8* Optoelectronic isolation output (Optional relay/opto-isolated output)） |
| ②32 * GPIO（2*36pin Spring-loaded plug-in Phoenix terminals，support 16* Optoelectronic isolation input，16* Optoelectronic isolation output (Optional relay/opto-isolated output)） | ||
| ③4 * light source channels（RS232 control，Support external triggering, total output power 120W; The single channel supports a maximum of 24V 3A (72W) output, 0-255 stepless dimming, and the external trigger delay <10us）1 * Power input（4pin 5.08 Phoenix terminals with locked） | ||
| Notes: Expansion box ①② can be expand one of the two, Expansion box③ can be expanded up to three on one TMV-7000 | ||
| M.2 | 1 * M.2(Key-B, support 3042/3052 4G/5G module) | |
| Mini PCIe | 1 * Mini PCIe (support WIFI/3G/4G) | |
| Front I/O | Ethernet | 2 * Intel® GbE(10/100/1000Mbps,RJ45)4 * Intel® GbE(10/100/1000Mbps,RJ45，support POE function optional，support IEEE 802.3af/ IEEE 802.3at，single port MAX. to 30W，total P=MAX. to 50W) |
| USB | 4 * USB3.0 (Type-A, 5Gbps) | |
| Display | 1 *HDMI: max resolution up to 3840*2160 @ 60Hz1 * DP++: max resolution up to 4096*2304 @ 60Hz | |
| Audio | 2 * 3.5mm Jack (Line-Out + MIC) | |
| Serial | 2 * RS232 (DB9/M) | |
| SIM | 2 * Nano SIM card slot (SIM1) | |
| Rear I/O | Antenna | 4 * Antenna hole |
| Power Supply | Type | DC, |
| Power Input Voltage | 9 ~ 36VDC, P≤240W | |
| Connector | 1 * 4Pin Connector, P=5.00/5.08 | |
| RTC Battery | CR2032 Coin Cell | |
| OS Support | Windows | 6/7th：Windows 7/8.1/108/9th: Windows 10/11 |
| Linux | Linux | |
| Watchdog | Output | System Reset |
| Interval | Programmable via Software from 1 to 255 sec | |
| Mechanical | Enclosure Material | Radiator: Aluminum alloy, Box: SGCC |
| Dimensions | 235mm(L) * 156mm(W) * 66mm(H) without expansion box | |
| Weight | Net: 2.3 kgExpansion box Net: 1kg | |
| Mounting | DIN rail /Rack mount / Desktop | |
| Environment | Heat Dissipation System | Fanless Passive Cooling |
| Operating Temperature | -20~60℃ (Industrial SSD) | |
| Storage Temperature | -40~80℃ (Industrial SSD) | |
| Relative Humidity | 10 to 90% RH (non-condensing) | |
| Vibration During Operation | With SSD: IEC 60068-2-64 (3Grms@5~500Hz, random, 1hr/axis) | |
| Shock During Operation | With SSD: IEC 60068-2-27 (30G, half sine, 11ms) | |
TMV-7000
| Model | TMV-7000 | |
| CPU | CPU | Intel® 6-9th Generation Core / Pentium/ Celeron Desktop CPU |
| TDP | 65W | |
| Socket | LGA1151 | |
| Chipset | Chipset | Intel® Q170/C236 |
| BIOS | BIOS | AMI UEFI BIOS (Support Watchdog Timer) |
| Memory | Socket | 2 * Non-ECC SO-DIMM Slot, Dual Channel DDR4 up to 2400MHz |
| Max Capacity | 32GB, Single Max. 16GB | |
| Ethernet | Controller | 2 * Intel i210-AT/i211-AT;I219-LM LAN Chip ( 10/100/1000 Mbps, RJ45)4 * Intel i210-AT LAN Chip ( 10/100/1000 Mbps, RJ45; support POE) |
| Storage | M.2 | 1 * M.2(Key-M，support 2242/2280 SATA or PCIe x4/x2 NVME SSD)1 * M.2(key-M，support 2242/2280 SATA SSD) |
| Expansin Slots | Expansion box | ①6 * COM（30pin Spring-loaded plug-in Phoenix terminals， RS232/422/485 optional (select by BOM），RS422/485 Optoelectronic isolation function optional）+16 * GPIO（36pin Spring-loaded plug-in Phoenix terminals，support 8* Optoelectronic isolation input，8* Optoelectronic isolation output (Optional relay/opto-isolated output)） |
| ②32 * GPIO（2*36pin Spring-loaded plug-in Phoenix terminals，support 16* Optoelectronic isolation input，16* Optoelectronic isolation output (Optional relay/opto-isolated output)） | ||
| ③4 * light source channels（RS232 control，Support external triggering, total output power 120W; The single channel supports a maximum of 24V 3A (72W) output, 0-255 stepless dimming, and the external trigger delay <10us）1 * Power input（4pin 5.08 Phoenix terminals with locked） | ||
| Notes: Expansion box ①② can be expand one of the two, Expansion box③ can be expanded up to three on one TMV-7000 | ||
| M.2 | 1 * M.2(Key-B, support 3042/3052 4G/5G module) | |
| Mini PCIe | 1 * Mini PCIe (support WIFI/3G/4G) | |
| Front I/O | Ethernet | 2 * Intel® GbE(10/100/1000Mbps,RJ45)4 * Intel® GbE(10/100/1000Mbps,RJ45，support POE function optional，support IEEE 802.3af/ IEEE 802.3at，single port MAX. to 30W，total P=MAX. to 50W) |
| USB | 4 * USB3.0 (Type-A, 5Gbps) | |
| Display | 1 *HDMI: max resolution up to 3840*2160 @ 60Hz1 * DP++: max resolution up to 4096*2304 @ 60Hz | |
| Audio | 2 * 3.5mm Jack (Line-Out + MIC) | |
| Serial | 2 * RS232 (DB9/M) | |
| SIM | 2 * Nano SIM card slot (SIM1) | |
| Power Supply | Power Input Voltage | 9 ~ 36VDC, P≤240W |
| OS Support | Windows | 6/7th：Windows 7/8.1/108/9th: Windows 10/11 |
| Linux | Linux | |
| Mechanical | Dimensions | 235mm(L) * 156mm(W) * 66mm(H) without expansion box |
| Environment | Operating Temperature | -20~60℃ (Industrial SSD) |
| Storage Temperature | -40~80℃ (Industrial SSD) | |
| Relative Humidity | 10 to 90% RH (non-condensing) | |
| Vibration During Operation | With SSD: IEC 60068-2-64 (3Grms@5~500Hz, random, 1hr/axis) | |
| Shock During Operation | With SSD: IEC 60068-2-27 (30G, half sine, 11ms) | |
ATT-H31C
TMV-7000
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