Producta

Arca Computatralis | TMV-6000/7000

Arca Computatralis | TMV-6000/7000

Proprietates:

  • CPU Intel® Core™ I7/i5/i3 computatralium a sexto ad nonum systema sustinet.
  • Coniunctum cum chipset Q170/C236 gradus industrialis
  • Interfacies ostentationis dualis 4K DP+HDMI, ostentationem dualem synchronam/asynchronam sustinens
  • Quattuor interfacies USB 3.0
  • Duo portus seriales DB9
  • Sex interfacies retiales Gigabiticae, quattuor POE optionales inclusis
  • Sustentans potentiam ingressus tensionis latae 9V~36V
  • Methodi dissipationis caloris activae/passivae optionales

  • Administratio remota

    Administratio remota

  • Monitorium condicionis

    Monitorium condicionis

  • Operatio et sustentatio remota

    Operatio et sustentatio remota

  • Imperium Salutis

    Imperium Salutis

BOX PC APQ TMV-6000/7000 est monitor industrialis APQ constructum ad automationem industrialem, gubernationem machinarum, HMI (Interfaciem Machinae Computandae), computationem marginalem (edge ​​computing), et proiecta apparatuum intelligentium. Systema innititur CPU Intel Core, praebens ingeniariis suggestum ferramenta fidum pro fabricis, lineis productionis, systematibus inspectionis, armariis moderationis inclusis, et dispositionibus fabricationis intelligentis, dum exemplar producti exactum BOX PC APQ TMV-6000/7000 clarum servat ad investigationem et acquisitionem productorum. Inter proprietates praecipuas sunt: ​​Supportatio CPU Intel® Core™ I7/i5/i3 Desktop a sexto ad nonum systema; Coniunctio cum chipset Q170/C236 gradus industrialis; Interfacies monitoris dualis 4K DP+HDMI, sustinens monitores duales synchronos/asynchronos; 4 interfacies USB 3.0; Duo portus seriales DB9; 6 interfacies retiales Gigabit, inclusis 4 POE optional. Hae facultates adiuvant BOX PC APQ TMV-6000/7000 ut operationem continuam in ambitus difficilibus sustineat ubi constructio durabilis, integratio efficax, I/O stabilis, et constantia cycli vitae valent. Idoneum est fabricatoribus apparatuum OEM, integratoribus systematum, praebitoribus solutionum automationis, proiectis visionis machinalis, terminalibus acquisitionis datorum, systematibus moderationis roboticae, et nodis computationis industrialis marginalis. Summarium specificationum: processor/suggestus: Intel Core CPU; memoria: SoC; retiacula: 2 * Intel i210-AT/i211-AT; I219-LM LAN Chip (10/100/1000 Mbps, RJ45) 4 * Intel i210-AT LAN Chip (10/100/1000 Mbps, RJ45; sustinet POE); ostentatio: Intel® HD Graphics; I/O et expansio: ①6 * COM (terminales Phoenix 30-pin verriformes inserti), RS232/422/485 (optionales) (per BOM selecti), functio isolationis optoelectronicae RS422/485 (optionales) +16 * GPIO (3. Emptoribus qui apq tmv-6000/7000, computatrum industriale, apq, processorem Intel Core, ingressum DC latae tensionis, LAN gigabit dualem quaerunt, BOX PC APQ TMV-6000/7000 aequilibrium practicum inter efficaciam, expansionem, designum robustum, et flexibilitatem dispositionis pro hodiernis applicationibus computationis industrialis offert.

INTRODUCTIO

Delineatio Ingeniaria

Demptio fasciculi

TMV-6000
TMV-7000
TMV-6000
Modellum TMV-6000
CPU CPU Processores mobiles Intel® sextae octavae/undecimae generationis Core / Pentium / Celeron
TDP 35W
Socket SoC
Microprocessus Microprocessus Intel® Q170/C236
BIOS BIOS AMI UEFI BIOS (Sustentatio Temporis Custodis)
Memoria Socket 1 * Slot SO-DIMM non-ECC, DDR4 canalis dualis usque ad 2400MHz
Capacitas Maxima 16GB, Singulum Maximum 16GB
Graphica Moderator Intel® HD Graphics
Ethernet Moderator Duo microprocessores Intel i210-AT/i211-AT; I219-LM LAN (10/100/1000 Mbps, RJ45)4 * Intel i210-AT LAN Microprocessores (10/100/1000 Mbps, RJ45; POE sustinent)
Repositorium M.2 1 * M.2 (Key-M, sustinet 2242/2280 SATA vel PCIe x4/x2 NVME SSD)1 * M.2 (clavis-M, sustinet 2242/2280 SATA SSD)
Expansin Slots Arca expansionis ①6 * COM (terminales Phoenix insertabiles 30-pin verno onusti, RS232/422/485 ad libitum (per BOM selectum), functio isolationis optoelectronicae RS422/485 ad libitum) +16 * GPIO (terminales Phoenix insertabiles 36-pin verno onusti, 8* ingressus isolationis optoelectronicae, 8* egressus isolationis optoelectronicae (egressus relais/opto-isolatus ad libitum) sustinent).
②32 * GPIO (2 terminales Phoenix insertabiles 36-pin verrilis onusti), sustinent 16 * input isolationis optoelectronicae, 16 * output isolationis optoelectronicae (exitus relais/opto-isolatus optionalis))
③4 canales lucis (moderatio RS232), impulsum externum sustinent, potentia totalis emissa 120W; canalis singularis maximum impulsum 24V 3A (72W) sustinet, obscurationem continuam 0-255, et moram impulsus externi <10us)1 * Ingressus potentiae (terminales Phoenix 5.08 4pin cum clauso)
Notae: Arca expansionis ①② una ex duabus amplificari potest, arca expansionis ③ usque ad tres in uno TMV-7000 amplificari potest.
M.2 1 * M.2 (Clavis-B, modulos 3042/3052 4G/5G sustinet)
Mini PCIe 1 * Mini PCIe (WIFI/3G/4G sustinet)
I/O anterior Ethernet 2 * Intel® GbE(10/100/1000Mbps,RJ45)4 * Intel® GbE (10/100/1000Mbps, RJ45, functionem POE sustinet (facultativam), IEEE 802.3af/IEEE 802.3at sustinet, portus singularis MAX. ad 30W, P = MAX. summa ad 50W)
USB 4 * USB 3.0 (Typus-A, 5Gbps)
Ostendere 1 *HDMI: resolutio maxima usque ad 3840*2160 @ 60Hz1 * DP++: resolutio maxima usque ad 4096*2304 @ 60Hz
Audio 2 * Jack 3.5mm (Exitus Linearis + Microphonum)
Serialis Duo RS232 (DB9/M)
SIM 2 * foramina pro scheda Nano SIM (SIM1)
I/O posterior Antenna 4 * Foramen antennae
Fons Potentiae Typus DC,
Tensio Potentiae Ingressae 9 ~ 36VDC, P≤240W
Coniunctor 1 * Coniunctor quattuor aciculorum, P=5.00/5.08
Accumulator RTC Cellula Nummaria CR2032
Auxilium Systematis Operativi Fenestrae VI/VIIth:Fenestrae 7/8.1/10VIII/IXthFenestrae 10/11
Linux Linux
Custos Exitus Restitutio Systematis
Intervallum Programmabile per programmatum ab 1 ad 255 secundas
Mechanica Materia clausurae Radiator: Mixtura aluminii, Arca: SGCC
Dimensiones 235mm (L) * 156mm (L) * 66mm (A) sine arca expansionis
Pondus Pondus netum: 2.3 kgArca expansionis (Netto): 1kg
Montatio Ferrivia DIN / In armario / In mensa
Ambitus Systema Dissiptionis Caloris Refrigeratio Passiva Sine Ventilatore
Temperatura Operativa -20~60℃ (SSD Industrialis)
Temperatura Reponendi -40~80℃ (SSD Industrialis)
Humiditas Relativa 10 ad 90% RH (non condensans)
Vibratio Inter Operationem Cum SSD: IEC 60068-2-64 (3Grms@5~500Hz, fortuitum, 1hr/axe)
Impetus Inter Operationem Cum SSD: IEC 60068-2-27 (30G, dimidia sinus, 11ms)
TMV-7000
Modellum TMV-7000
CPU CPU CPU Intel® sextae generationis nonae Core / Pentium / Celeron pro computatris personalibus
TDP 65W
Socket LGA1151
Microprocessus Microprocessus Intel® Q170/C236
BIOS BIOS AMI UEFI BIOS (Sustentatio Temporis Custodis)
Memoria Socket Duo fissurae SO-DIMM non-ECC, DDR4 canalis duplicis usque ad 2400MHz
Capacitas Maxima 32GB, Singulum Maximum 16GB
Ethernet Moderator Duo microprocessores Intel i210-AT/i211-AT; I219-LM LAN (10/100/1000 Mbps, RJ45)4 * Intel i210-AT LAN Microprocessores (10/100/1000 Mbps, RJ45; POE sustinent)
Repositorium M.2 1 * M.2 (Key-M, sustinet 2242/2280 SATA vel PCIe x4/x2 NVME SSD)1 * M.2 (clavis-M, sustinet 2242/2280 SATA SSD)
Expansin Slots Arca expansionis ①6 * COM (terminales Phoenix insertabiles 30-pin verno onusti, RS232/422/485 ad libitum (per BOM selectum), functio isolationis optoelectronicae RS422/485 ad libitum) +16 * GPIO (terminales Phoenix insertabiles 36-pin verno onusti, 8* ingressus isolationis optoelectronicae, 8* egressus isolationis optoelectronicae (egressus relais/opto-isolatus ad libitum) sustinent).
②32 * GPIO (2 terminales Phoenix insertabiles 36-pin verrilis onusti), sustinent 16 * input isolationis optoelectronicae, 16 * output isolationis optoelectronicae (exitus relais/opto-isolatus optionalis))
③4 canales lucis (moderatio RS232), impulsum externum sustinent, potentia totalis emissa 120W; canalis singularis maximum impulsum 24V 3A (72W) sustinet, obscurationem continuam 0-255, et moram impulsus externi <10us)1 * Ingressus potentiae (terminales Phoenix 5.08 4pin cum clauso)
Notae: Arca expansionis ①② una ex duabus amplificari potest, arca expansionis ③ usque ad tres in uno TMV-7000 amplificari potest.
M.2 1 * M.2 (Clavis-B, modulos 3042/3052 4G/5G sustinet)
Mini PCIe 1 * Mini PCIe (WIFI/3G/4G sustinet)
I/O anterior Ethernet 2 * Intel® GbE(10/100/1000Mbps,RJ45)4 * Intel® GbE (10/100/1000Mbps, RJ45, functionem POE sustinet (facultativam), IEEE 802.3af/IEEE 802.3at sustinet, portus singularis MAX. ad 30W, P = MAX. summa ad 50W)
USB 4 * USB 3.0 (Typus-A, 5Gbps)
Ostendere 1 *HDMI: resolutio maxima usque ad 3840*2160 @ 60Hz1 * DP++: resolutio maxima usque ad 4096*2304 @ 60Hz
Audio 2 * Jack 3.5mm (Exitus Linearis + Microphonum)
Serialis Duo RS232 (DB9/M)
SIM 2 * foramina pro scheda Nano SIM (SIM1)
Fons Potentiae Tensio Potentiae Ingressae 9 ~ 36VDC, P≤240W
Auxilium Systematis Operativi Fenestrae VI/VIIth:Fenestrae 7/8.1/10VIII/IXthFenestrae 10/11
Linux Linux
Mechanica Dimensiones 235mm (L) * 156mm (L) * 66mm (A) sine arca expansionis
Ambitus Temperatura Operativa -20~60℃ (SSD Industrialis)
Temperatura Reponendi -40~80℃ (SSD Industrialis)
Humiditas Relativa 10 ad 90% RH (non condensans)
Vibratio Inter Operationem Cum SSD: IEC 60068-2-64 (3Grms@5~500Hz, fortuitum, 1hr/axe)
Impetus Inter Operationem Cum SSD: IEC 60068-2-27 (30G, dimidia sinus, 11ms)

ATT-H31C

TMV-6000_20231226_00

TMV-7000

TMV-7000_20231226_00

  • TMV-6000_SpecificationSheet_APQ
    TMV-6000_SpecificationSheet_APQ
    DEPRIME
  • TMV-7000_SpecificationSheet_APQ
    TMV-7000_SpecificationSheet_APQ
    DEPRIME
  • EXEMPLA ACQUIRE

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