Pahu PC | TMV-6000/ 7000
Hoʻokele mamao
Ka nānā ʻana i ke kūlana
Ka hana mamao a me ka mālama ʻana
Ka Mana Palekana
KĀHEA IĀ MĀ˚OUʻO BOX PC APQ TMV-6000/7000 kahi hōʻikeʻike ʻoihana APQ i kūkulu ʻia no ka automation ʻoihana, ka mana mīkini, HMI, ka helu ʻana ma ka lihi, a me nā papahana lako akamai. Hoʻokumu ʻia ka ʻōnaehana ma ka intel core cpu, e hāʻawi ana i nā ʻenekinia i kahi kahua lako pono no nā hale hana, nā laina hana, nā ʻōnaehana nānā, nā keʻena hoʻomalu i hoʻokomo ʻia, a me nā hoʻolaha hana akamai ʻoiai e mālama ana i ke kumu hoʻohālike huahana pololei BOX PC APQ TMV-6000/7000 no ka ʻimi huahana a me ke kūʻai ʻana. ʻO nā hiʻohiʻona koʻikoʻi e pili ana i ke kākoʻo ʻana iā Intel ® 6th a 9th Core ™ I7/i5/i3 Desktop CPU; Hoʻohui ʻia me ka chipset papa ʻoihana Q170/C236; DP+HDMI dual 4K display interface, e kākoʻo ana i ka synchronous/asynchronous dual display; 4 USB 3.0 interfaces; ʻElua DB9 serial ports; 6 Gigabit network interfaces, me 4 POEs koho. Kōkua kēia mau hiki iā BOX PC APQ TMV-6000/7000 e kākoʻo i ka hana mau i nā wahi koi kahi e pono ai ke kūkulu paʻa, ka hoʻohui pono ʻana, ka I/O paʻa, a me ke kūlike o ke ola. He kūpono ia no nā mea kūkulu lako OEM, nā mea hoʻohui ʻōnaehana, nā mea hoʻolako hoʻonā automation, nā papahana ʻike mīkini, nā kikowaena loaʻa ʻikepili, nā ʻōnaehana hoʻomalu robotic, a me nā kikowaena helu ʻoi aku ka ʻoihana. Hōʻuluʻulu manaʻo kikoʻī: mea hana/kahua: intel core cpu; hoʻomanaʻo: SoC; pūnaewele: 2 * Intel i210-AT/i211-AT; I219-LM LAN Chip (10/100/1000 Mbps, RJ45)4 * Intel i210-AT LAN Chip (10/100/1000 Mbps, RJ45; kākoʻo POE); hōʻike: Intel® HD Graphics; I/O a me ka hoʻonui ʻana: ①6 * COM（30pin Spring-loaded plug-in Phoenix terminals， RS232/422/485 koho (koho ʻia e BOM）， RS422/485 Optoelectronic isolation function koho）+16 * GPIO（3. No nā mea kūʻai e ʻimi nei iā apq tmv-6000/7000, industrial box pc, apq, intel core cpu, wide-voltage dc input, dual gigabit lan, BOX PC APQ TMV-6000/7000 hāʻawi i kahi kaulike kūpono o ka hana, ka hiki ke hoʻonui, ka hoʻolālā paʻa, a me ka maʻalahi o ka hoʻolaha ʻana no nā noi kamepiula ʻoihana hou.
TMV-6000
TMV-7000
TMV-6000
| Hoʻohālike | TMV-6000 | |
| CPU | CPU | CPU kelepona ʻo Intel® 6-8/11th Generation Core / Pentium/ Celeron |
| TDP | 35W | |
| Socket | SoC | |
| ʻO ka Chipset | ʻO ka Chipset | ʻIntel® Q170/C236 |
| BIOS | BIOS | AMI UEFI BIOS (Kākoʻo i ka Manawa Kiaʻi) |
| Hoʻomanaʻo | Socket | 1 * ʻAʻohe ECC SO-DIMM Slot, Dual Channel DDR4 a hiki i ka 2400MHz |
| Ka Mana Loa | 16GB, Hoʻokahi Max. 16GB | |
| Nā Kiʻi | Luna Hoʻokele | Nā Kiʻi Intel® HD |
| ʻEterona | Luna Hoʻokele | 2 * Intel i210-AT/i211-AT;I219-LM LAN Chip (10/100/1000 Mbps, RJ45)4 * Intel i210-AT LAN Chip (10/100/1000 Mbps, RJ45; kākoʻo POE) |
| Ka Waihona | M.2 | 1 * M.2 (Key-M, kākoʻo 2242/2280 SATA a i ʻole PCIe x4/x2 NVME SSD)1 * M.2 (kī-M, kākoʻo 2242/2280 SATA SSD) |
| Nā Slots Expansin | Pahu hoʻonui | ①6 * COM（30pin Spring-loaded Phoenix terminals， RS232/422/485 koho (koho ʻia e BOM）， RS422/485 Optoelectronic isolation function koho）+16 * GPIO（36pin Spring-loaded Phoenix terminals，kākoʻo 8* Optoelectronic isolation input，8* Optoelectronic isolation output (koho relay/opto-isolated output)） |
| ②32 * GPIO（2 * 36pin Spring-loaded plug-in Phoenix terminals, kākoʻo 16 * Optoelectronic isolation input, 16 * Optoelectronic isolation output (koho relay/opto-isolated output)） | ||
| ③4 * nā kahawai kumu kukui (RS232 control), Kākoʻo i ka hoʻoulu ʻana o waho, ka mana hoʻopuka holoʻokoʻa 120W; Kākoʻo ke kahawai hoʻokahi i ka nui o 24V 3A (72W) output, 0-255 stepless dimming, a me ka lohi hoʻoulu o waho <10us)1 * Hoʻokomo mana (4pin 5.08 Phoenix terminals me ka laka) | ||
| Nā memo: Hiki ke hoʻonui ʻia ka pahu hoʻonui ①② i kekahi o nā mea ʻelua, hiki ke hoʻonui ʻia ka pahu hoʻonui ③ a hiki i ʻekolu ma hoʻokahi TMV-7000 | ||
| M.2 | 1 * M.2 (Kī-B, kākoʻo i ka module 3042/3052 4G/5G) | |
| Mini PCIe | 1 * Mini PCIe (kākoʻo WIFI/3G/4G) | |
| I/O mua | ʻEterona | 2 * Intel® GbE(10/100/1000Mbps,RJ45)4 * Intel® GbE (10/100/1000Mbps, RJ45, kākoʻo i ka hana POE koho, kākoʻo iā IEEE 802.3af/ IEEE 802.3at, hoʻokahi awa MAX. a i 30W, huina P = MAX. a i 50W) |
| USB | 4 * USB3.0 (ʻAno-A, 5Gbps) | |
| Hōʻike | 1 * HDMI: hoʻonā kiʻekiʻe a hiki i ka 3840 * 2160 @ 60Hz1 * DP++: hoʻonā kiʻekiʻe a hiki i ka 4096*2304 @ 60Hz | |
| Leo | 2 * 3.5mm Jack (Line-Out + MIC) | |
| Moʻohelu | 2 * RS232 (DB9/M) | |
| SIM | 2 * Kaʻa kāleka Nano SIM (SIM1) | |
| I/O hope | ʻAntenna | 4 * puka antenna |
| Lako ikehu | ʻAno | DC, |
| Mana Hoʻokomo Mana | 9 ~ 36VDC, P≤240W | |
| Mea hoʻohui | 1 * 4Pin Connector, P=5.00/5.08 | |
| Pākahi RTC | Kelepona ʻOihana CR2032 | |
| Kākoʻo OS | Nā puka makani | 6/7th：Windows 7/8.1/108/9thWindows 10/11 |
| Linux | Linux | |
| ʻĪlio kiaʻi | Hoʻopuka | Hoʻihoʻi hou ʻana o ka ʻōnaehana |
| Ka wā ma waena | Hiki ke hoʻolālā ʻia ma o ka polokalamu mai 1 a 255 kekona | |
| Mīkini | Mea Hoʻopuni | Radiator: Mea hoʻohuihui alumini, Pahu: SGCC |
| Nā Ana | 235mm(L) * 156mm(W) * 66mm(H) me ka ʻole o ka pahu hoʻonui | |
| Kaumaha | ʻUpena: 2.3 kgPahu hoʻonui ʻupena: 1kg | |
| Ke kau ʻana | ʻO ke alahao DIN / Rack mount / Desktop | |
| Kaiapuni | ʻŌnaehana Hoʻopuehu Wela | Hoʻoluʻolu Passive ʻole Fanless |
| Mahana Hana | -20~60℃ (SSD ʻoihana) | |
| Mahana mālama | -40~80℃ (SSD ʻoihana) | |
| Ka Haumākū Pili | 10 a 90% RH (ʻaʻole condensing) | |
| Haʻalulu i ka wā hana | Me ka SSD: IEC 60068-2-64 (3Grms@5~500Hz, kaulele, 1hr/axis) | |
| Pūʻiwa i ka wā hana | Me ka SSD: IEC 60068-2-27 (30G, hapalua sine, 11ms) | |
TMV-7000
| Hoʻohālike | TMV-7000 | |
| CPU | CPU | ʻO ka CPU kamepiula ʻo Intel® 6-9th Generation Core / Pentium/ Celeron |
| TDP | 65W | |
| Socket | LGA1151 | |
| ʻO ka Chipset | ʻO ka Chipset | ʻIntel® Q170/C236 |
| BIOS | BIOS | AMI UEFI BIOS (Kākoʻo i ka Manawa Kiaʻi) |
| Hoʻomanaʻo | Socket | 2 * ʻAʻohe ECC SO-DIMM Slot, Dual Channel DDR4 a hiki i ka 2400MHz |
| Ka Mana Loa | 32GB, Hoʻokahi Max. 16GB | |
| ʻEterona | Luna Hoʻokele | 2 * Intel i210-AT/i211-AT;I219-LM LAN Chip (10/100/1000 Mbps, RJ45)4 * Intel i210-AT LAN Chip (10/100/1000 Mbps, RJ45; kākoʻo POE) |
| Ka Waihona | M.2 | 1 * M.2 (Key-M, kākoʻo 2242/2280 SATA a i ʻole PCIe x4/x2 NVME SSD)1 * M.2 (kī-M, kākoʻo 2242/2280 SATA SSD) |
| Nā Slots Expansin | Pahu hoʻonui | ①6 * COM（30pin Spring-loaded Phoenix terminals， RS232/422/485 koho (koho ʻia e BOM）， RS422/485 Optoelectronic isolation function koho）+16 * GPIO（36pin Spring-loaded Phoenix terminals，kākoʻo 8* Optoelectronic isolation input，8* Optoelectronic isolation output (koho relay/opto-isolated output)） |
| ②32 * GPIO（2 * 36pin Spring-loaded plug-in Phoenix terminals, kākoʻo 16 * Optoelectronic isolation input, 16 * Optoelectronic isolation output (koho relay/opto-isolated output)） | ||
| ③4 * nā kahawai kumu kukui (RS232 control), Kākoʻo i ka hoʻoulu ʻana o waho, ka mana hoʻopuka holoʻokoʻa 120W; Kākoʻo ke kahawai hoʻokahi i ka nui o 24V 3A (72W) output, 0-255 stepless dimming, a me ka lohi hoʻoulu o waho <10us)1 * Hoʻokomo mana (4pin 5.08 Phoenix terminals me ka laka) | ||
| Nā memo: Hiki ke hoʻonui ʻia ka pahu hoʻonui ①② i kekahi o nā mea ʻelua, hiki ke hoʻonui ʻia ka pahu hoʻonui ③ a hiki i ʻekolu ma hoʻokahi TMV-7000 | ||
| M.2 | 1 * M.2 (Kī-B, kākoʻo i ka module 3042/3052 4G/5G) | |
| Mini PCIe | 1 * Mini PCIe (kākoʻo WIFI/3G/4G) | |
| I/O mua | ʻEterona | 2 * Intel® GbE(10/100/1000Mbps,RJ45)4 * Intel® GbE (10/100/1000Mbps, RJ45, kākoʻo i ka hana POE koho, kākoʻo iā IEEE 802.3af/ IEEE 802.3at, hoʻokahi awa MAX. a i 30W, huina P = MAX. a i 50W) |
| USB | 4 * USB3.0 (ʻAno-A, 5Gbps) | |
| Hōʻike | 1 * HDMI: hoʻonā kiʻekiʻe a hiki i ka 3840 * 2160 @ 60Hz1 * DP++: hoʻonā kiʻekiʻe a hiki i ka 4096*2304 @ 60Hz | |
| Leo | 2 * 3.5mm Jack (Line-Out + MIC) | |
| Moʻohelu | 2 * RS232 (DB9/M) | |
| SIM | 2 * Kaʻa kāleka Nano SIM (SIM1) | |
| Lako ikehu | Mana Hoʻokomo Mana | 9 ~ 36VDC, P≤240W |
| Kākoʻo OS | Nā puka makani | 6/7th：Windows 7/8.1/108/9thWindows 10/11 |
| Linux | Linux | |
| Mīkini | Nā Ana | 235mm(L) * 156mm(W) * 66mm(H) me ka ʻole o ka pahu hoʻonui |
| Kaiapuni | Mahana Hana | -20~60℃ (SSD ʻoihana) |
| Mahana mālama | -40~80℃ (SSD ʻoihana) | |
| Ka Haumākū Pili | 10 a 90% RH (ʻaʻole condensing) | |
| Haʻalulu i ka wā hana | Me ka SSD: IEC 60068-2-64 (3Grms@5~500Hz, kaulele, 1hr/axis) | |
| Pūʻiwa i ka wā hana | Me ka SSD: IEC 60068-2-27 (30G, hapalua sine, 11ms) | |
ATT-H31C
TMV-7000
E kiʻi i nā hāpana
Kūpono, palekana a hilinaʻi hoʻi. Hōʻoia kā mākou lako i ka hopena kūpono no kekahi koi. E pōmaikaʻi mai kā mākou ʻike loea i ka ʻoihana a hoʻoulu i ka waiwai i hoʻohui ʻia - i kēlā me kēia lā.
Kaomi No ka Nīnau
