Nā huahana

Mea Hoʻokele ʻIke Mīkini TMV-6000/7000

Mea Hoʻokele ʻIke Mīkini TMV-6000/7000

Nā Hiʻohiʻona:

  • Kākoʻo i ka Intel ® 6th a i 9th Core ™ I7/i5/i3 Desktop CPU
  • Hoʻohui ʻia me ka chipset papa ʻoihana Q170/C236
  • ʻO ka pilina hōʻike pālua 4K DP+HDMI, e kākoʻo ana i ka hōʻike pālua synchronous/asynchronous
  • 4 mau pilina USB 3.0
  • ʻElua mau awa serial DB9
  • 6 mau pilina pūnaewele Gigabit, me 4 mau POE koho
  • Ke kākoʻo nei i ka hoʻokomo mana uila ākea 9V ~ 36V
  • Nā ʻano hoʻoheheʻe wela hana/passive koho

  • Hoʻokele mamao

    Hoʻokele mamao

  • Ka nānā ʻana i ke kūlana

    Ka nānā ʻana i ke kūlana

  • Ka hana mamao a me ka mālama ʻana

    Ka hana mamao a me ka mālama ʻana

  • Ka Mana Palekana

    Ka Mana Palekana

Wehewehe Huahana

Hoʻohana ka mea hoʻokele hihiʻo TMV i kahi manaʻo modular, e kākoʻo maʻalahi ana i nā kaʻina hana kelepona/papahana Intel Core hanauna 6 a 11. Hoʻolako ʻia me nā awa Gigabit Ethernet a me POE he nui, a me GPIO i hoʻokaʻawale ʻia me nā kahawai he nui, nā awa serial i hoʻokaʻawale ʻia he nui, a me nā modula hoʻomalu kumu kukui he nui, hiki iā ia ke kākoʻo pono i nā hiʻohiʻona noi hihiʻo nui.

I hoʻolako ʻia me ka QDevEyes - kahi kahua hana akamai a me ka mālama ʻana i ka noi IPC i kālele ʻia, hoʻohui ka paepae i ka nui o nā noi hana ma nā ʻano ʻehā: ka nānā ʻana, ka mana, ka mālama ʻana, a me ka hana. Hāʻawi ia iā IPC me ka hoʻokele pūʻulu mamao, ka nānā ʻana i nā hāmeʻa, a me nā hana hana mamao a me ka mālama ʻana, e hoʻokō ana i nā pono hana a me ka mālama ʻana o nā kūlana like ʻole.

HOʻOLAUNA

Kaha Kiʻi ʻenekinia

Hoʻoiho Waihona

TMV-6000
TMV-7000
TMV-6000
Hoʻohālike TMV-6000
CPU CPU CPU kelepona ʻo Intel® 6-8/11th Generation Core / Pentium/ Celeron
TDP 35W
Socket SoC
ʻO ka Chipset ʻO ka Chipset ʻO Intel® Q170/C236
BIOS BIOS AMI UEFI BIOS (Kākoʻo i ka Manawa Kiaʻi)
Hoʻomanaʻo Socket 1 * ʻAʻohe ECC SO-DIMM Slot, Dual Channel DDR4 a hiki i ka 2400MHz
Ka Mana Loa 16GB, Hoʻokahi Max. 16GB
Nā Kiʻi Luna Hoʻokele Nā Kiʻi Intel® HD
ʻEterona Luna Hoʻokele 2 * Intel i210-AT/i211-AT;I219-LM LAN Chip (10/100/1000 Mbps, RJ45)4 * Intel i210-AT LAN Chip (10/100/1000 Mbps, RJ45; kākoʻo POE)
Ka Waihona M.2 1 * M.2 (Key-M, kākoʻo 2242/2280 SATA a i ʻole PCIe x4/x2 NVME SSD)1 * M.2 (kī-M, kākoʻo 2242/2280 SATA SSD)
Nā Slots Expansin Pahu hoʻonui ①6 * COM(30pin Spring-loaded Phoenix terminals, RS232/422/485 koho (koho ʻia e BOM), RS422/485 Optoelectronic isolation function koho)+16 * GPIO(36pin Spring-loaded Phoenix terminals,kākoʻo 8* Optoelectronic isolation input,8* Optoelectronic isolation output (koho relay/opto-isolated output))
②32 * GPIO(2 * 36pin Spring-loaded plug-in Phoenix terminals, kākoʻo 16 * Optoelectronic isolation input, 16 * Optoelectronic isolation output (koho relay/opto-isolated output))
③4 * nā kahawai kumu kukui (RS232 control), Kākoʻo i ka hoʻoulu ʻana o waho, ka mana hoʻopuka holoʻokoʻa 120W; Kākoʻo ke kahawai hoʻokahi i ka nui o 24V 3A (72W) output, 0-255 stepless dimming, a me ka lohi hoʻoulu o waho <10us)1 * Hoʻokomo mana (4pin 5.08 Phoenix terminals me ka laka)
Nā memo: Hiki ke hoʻonui ʻia ka pahu hoʻonui ①② i kekahi o nā mea ʻelua, hiki ke hoʻonui ʻia ka pahu hoʻonui ③ a hiki i ʻekolu ma hoʻokahi TMV-7000
M.2 1 * M.2 (Kī-B, kākoʻo i ka module 3042/3052 4G/5G)
Mini PCIe 1 * Mini PCIe (kākoʻo WIFI/3G/4G)
I/O mua ʻEterona 2 * Intel® GbE(10/100/1000Mbps,RJ45)4 * Intel® GbE (10/100/1000Mbps, RJ45, kākoʻo i ka hana POE koho, kākoʻo iā IEEE 802.3af/ IEEE 802.3at, hoʻokahi awa MAX. a i 30W, huina P = MAX. a i 50W)
USB 4 * USB3.0 (ʻAno-A, 5Gbps)
Hōʻike 1 * HDMI: hoʻonā kiʻekiʻe a hiki i ka 3840 * 2160 @ 60Hz1 * DP++: hoʻonā kiʻekiʻe a hiki i ka 4096*2304 @ 60Hz
Leo 2 * 3.5mm Jack (Line-Out + MIC)
Moʻohelu 2 * RS232 (DB9/M)
SIM 2 * Kaʻa kāleka Nano SIM (SIM1)
I/O hope ʻAntenna 4 * puka antenna
Lako ikehu ʻAno DC,
Mana Hoʻokomo Mana 9 ~ 36VDC, P≤240W
Mea hoʻohui 1 * 4Pin Connector, P=5.00/5.08
Pākahi RTC Kelepona ʻOihana CR2032
Kākoʻo OS Nā puka makani 6/7th:Windows 7/8.1/108/9thWindows 10/11
Linux Linux
ʻĪlio kiaʻi Hoʻopuka Hoʻihoʻi hou ʻana o ka ʻōnaehana
Ka wā ma waena Hiki ke hoʻolālā ʻia ma o ka polokalamu mai 1 a 255 kekona
Mekanika Mea Hoʻopuni Radiator: Mea hoʻohuihui alumini, Pahu: SGCC
Nā Ana 235mm(L) * 156mm(W) * 66mm(H) me ka ʻole o ka pahu hoʻonui
Kaumaha ʻUpena: 2.3 kgPahu hoʻonui ʻupena: 1kg
Ke kau ʻana ʻO ke alahao DIN / Rack mount / Desktop
Kaiapuni ʻŌnaehana Hoʻopuehu Wela Hoʻoluʻolu Passive ʻole Fanless
Mahana Hana -20~60℃ (SSD ʻoihana)
Mahana mālama -40~80℃ (SSD ʻoihana)
Ka Haumākū Pili 10 a 90% RH (ʻaʻole condensing)
Haʻalulu i ka wā hana Me ka SSD: IEC 60068-2-64 (3Grms@5~500Hz, kaulele, 1hr/axis)
Pūʻiwa i ka wā hana Me ka SSD: IEC 60068-2-27 (30G, hapalua sine, 11ms)
TMV-7000
Hoʻohālike TMV-7000
CPU CPU ʻO ka CPU kamepiula ʻo Intel® 6-9th Generation Core / Pentium/ Celeron
TDP 65W
Socket LGA1151
ʻO ka Chipset ʻO ka Chipset ʻO Intel® Q170/C236
BIOS BIOS AMI UEFI BIOS (Kākoʻo i ka Manawa Kiaʻi)
Hoʻomanaʻo Socket 2 * ʻAʻohe ECC SO-DIMM Slot, Dual Channel DDR4 a hiki i ka 2400MHz
Ka Mana Loa 32GB, Hoʻokahi Max. 16GB
ʻEterona Luna Hoʻokele 2 * Intel i210-AT/i211-AT;I219-LM LAN Chip (10/100/1000 Mbps, RJ45)4 * Intel i210-AT LAN Chip (10/100/1000 Mbps, RJ45; kākoʻo POE)
Ka Waihona M.2 1 * M.2 (Key-M, kākoʻo 2242/2280 SATA a i ʻole PCIe x4/x2 NVME SSD)1 * M.2 (kī-M, kākoʻo 2242/2280 SATA SSD)
Nā Slots Expansin Pahu hoʻonui ①6 * COM(30pin Spring-loaded Phoenix terminals, RS232/422/485 koho (koho ʻia e BOM), RS422/485 Optoelectronic isolation function koho)+16 * GPIO(36pin Spring-loaded Phoenix terminals,kākoʻo 8* Optoelectronic isolation input,8* Optoelectronic isolation output (koho relay/opto-isolated output))
②32 * GPIO(2 * 36pin Spring-loaded plug-in Phoenix terminals, kākoʻo 16 * Optoelectronic isolation input, 16 * Optoelectronic isolation output (koho relay/opto-isolated output))
③4 * nā kahawai kumu kukui (RS232 control), Kākoʻo i ka hoʻoulu ʻana o waho, ka mana hoʻopuka holoʻokoʻa 120W; Kākoʻo ke kahawai hoʻokahi i ka nui o 24V 3A (72W) output, 0-255 stepless dimming, a me ka lohi hoʻoulu o waho <10us)1 * Hoʻokomo mana (4pin 5.08 Phoenix terminals me ka laka)
Nā memo: Hiki ke hoʻonui ʻia ka pahu hoʻonui ①② i kekahi o nā mea ʻelua, hiki ke hoʻonui ʻia ka pahu hoʻonui ③ a hiki i ʻekolu ma hoʻokahi TMV-7000
M.2 1 * M.2 (Kī-B, kākoʻo i ka module 3042/3052 4G/5G)
Mini PCIe 1 * Mini PCIe (kākoʻo WIFI/3G/4G)
I/O mua ʻEterona 2 * Intel® GbE(10/100/1000Mbps,RJ45)4 * Intel® GbE (10/100/1000Mbps, RJ45, kākoʻo i ka hana POE koho, kākoʻo iā IEEE 802.3af/ IEEE 802.3at, hoʻokahi awa MAX. a i 30W, huina P = MAX. a i 50W)
USB 4 * USB3.0 (ʻAno-A, 5Gbps)
Hōʻike 1 * HDMI: hoʻonā kiʻekiʻe a hiki i ka 3840 * 2160 @ 60Hz1 * DP++: hoʻonā kiʻekiʻe a hiki i ka 4096*2304 @ 60Hz
Leo 2 * 3.5mm Jack (Line-Out + MIC)
Moʻohelu 2 * RS232 (DB9/M)
SIM 2 * Kaʻa kāleka Nano SIM (SIM1)
Lako ikehu Mana Hoʻokomo Mana 9 ~ 36VDC, P≤240W
Kākoʻo OS Nā puka makani 6/7th:Windows 7/8.1/108/9thWindows 10/11
Linux Linux
Mekanika Nā Ana 235mm(L) * 156mm(W) * 66mm(H) me ka ʻole o ka pahu hoʻonui
Kaiapuni Mahana Hana -20~60℃ (SSD ʻoihana)
Mahana mālama -40~80℃ (SSD ʻoihana)
Ka Haumākū Pili 10 a 90% RH (ʻaʻole condensing)
Haʻalulu i ka wā hana Me ka SSD: IEC 60068-2-64 (3Grms@5~500Hz, kaulele, 1hr/axis)
Pūʻiwa i ka wā hana Me ka SSD: IEC 60068-2-27 (30G, hapalua sine, 11ms)

ATT-H31C

TMV-6000_20231226_00

TMV-7000

TMV-7000_20231226_00

  • E kiʻi i nā hāpana

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