
Hoʻokele mamao
Ka nānā ʻana i ke kūlana
Ka hana mamao a me ka mālama ʻana
Ka Mana Palekana
Hoʻohana ka mea hoʻokele hihiʻo TMV i kahi manaʻo modular, e kākoʻo maʻalahi ana i nā kaʻina hana kelepona/papahana Intel Core hanauna 6 a 11. Hoʻolako ʻia me nā awa Gigabit Ethernet a me POE he nui, a me GPIO i hoʻokaʻawale ʻia me nā kahawai he nui, nā awa serial i hoʻokaʻawale ʻia he nui, a me nā modula hoʻomalu kumu kukui he nui, hiki iā ia ke kākoʻo pono i nā hiʻohiʻona noi hihiʻo nui.
I hoʻolako ʻia me ka QDevEyes - kahi kahua hana akamai a me ka mālama ʻana i ka noi IPC i kālele ʻia, hoʻohui ka paepae i ka nui o nā noi hana ma nā ʻano ʻehā: ka nānā ʻana, ka mana, ka mālama ʻana, a me ka hana. Hāʻawi ia iā IPC me ka hoʻokele pūʻulu mamao, ka nānā ʻana i nā hāmeʻa, a me nā hana hana mamao a me ka mālama ʻana, e hoʻokō ana i nā pono hana a me ka mālama ʻana o nā kūlana like ʻole.
| Hoʻohālike | TMV-6000 | |
| CPU | CPU | CPU kelepona ʻo Intel® 6-8/11th Generation Core / Pentium/ Celeron |
| TDP | 35W | |
| Socket | SoC | |
| ʻO ka Chipset | ʻO ka Chipset | ʻO Intel® Q170/C236 |
| BIOS | BIOS | AMI UEFI BIOS (Kākoʻo i ka Manawa Kiaʻi) |
| Hoʻomanaʻo | Socket | 1 * ʻAʻohe ECC SO-DIMM Slot, Dual Channel DDR4 a hiki i ka 2400MHz |
| Ka Mana Loa | 16GB, Hoʻokahi Max. 16GB | |
| Nā Kiʻi | Luna Hoʻokele | Nā Kiʻi Intel® HD |
| ʻEterona | Luna Hoʻokele | 2 * Intel i210-AT/i211-AT;I219-LM LAN Chip (10/100/1000 Mbps, RJ45)4 * Intel i210-AT LAN Chip (10/100/1000 Mbps, RJ45; kākoʻo POE) |
| Ka Waihona | M.2 | 1 * M.2 (Key-M, kākoʻo 2242/2280 SATA a i ʻole PCIe x4/x2 NVME SSD)1 * M.2 (kī-M, kākoʻo 2242/2280 SATA SSD) |
| Nā Slots Expansin | Pahu hoʻonui | ①6 * COM(30pin Spring-loaded Phoenix terminals, RS232/422/485 koho (koho ʻia e BOM), RS422/485 Optoelectronic isolation function koho)+16 * GPIO(36pin Spring-loaded Phoenix terminals,kākoʻo 8* Optoelectronic isolation input,8* Optoelectronic isolation output (koho relay/opto-isolated output)) |
| ②32 * GPIO(2 * 36pin Spring-loaded plug-in Phoenix terminals, kākoʻo 16 * Optoelectronic isolation input, 16 * Optoelectronic isolation output (koho relay/opto-isolated output)) | ||
| ③4 * nā kahawai kumu kukui (RS232 control), Kākoʻo i ka hoʻoulu ʻana o waho, ka mana hoʻopuka holoʻokoʻa 120W; Kākoʻo ke kahawai hoʻokahi i ka nui o 24V 3A (72W) output, 0-255 stepless dimming, a me ka lohi hoʻoulu o waho <10us)1 * Hoʻokomo mana (4pin 5.08 Phoenix terminals me ka laka) | ||
| Nā memo: Hiki ke hoʻonui ʻia ka pahu hoʻonui ①② i kekahi o nā mea ʻelua, hiki ke hoʻonui ʻia ka pahu hoʻonui ③ a hiki i ʻekolu ma hoʻokahi TMV-7000 | ||
| M.2 | 1 * M.2 (Kī-B, kākoʻo i ka module 3042/3052 4G/5G) | |
| Mini PCIe | 1 * Mini PCIe (kākoʻo WIFI/3G/4G) | |
| I/O mua | ʻEterona | 2 * Intel® GbE(10/100/1000Mbps,RJ45)4 * Intel® GbE (10/100/1000Mbps, RJ45, kākoʻo i ka hana POE koho, kākoʻo iā IEEE 802.3af/ IEEE 802.3at, hoʻokahi awa MAX. a i 30W, huina P = MAX. a i 50W) |
| USB | 4 * USB3.0 (ʻAno-A, 5Gbps) | |
| Hōʻike | 1 * HDMI: hoʻonā kiʻekiʻe a hiki i ka 3840 * 2160 @ 60Hz1 * DP++: hoʻonā kiʻekiʻe a hiki i ka 4096*2304 @ 60Hz | |
| Leo | 2 * 3.5mm Jack (Line-Out + MIC) | |
| Moʻohelu | 2 * RS232 (DB9/M) | |
| SIM | 2 * Kaʻa kāleka Nano SIM (SIM1) | |
| I/O hope | ʻAntenna | 4 * puka antenna |
| Lako ikehu | ʻAno | DC, |
| Mana Hoʻokomo Mana | 9 ~ 36VDC, P≤240W | |
| Mea hoʻohui | 1 * 4Pin Connector, P=5.00/5.08 | |
| Pākahi RTC | Kelepona ʻOihana CR2032 | |
| Kākoʻo OS | Nā puka makani | 6/7th:Windows 7/8.1/108/9thWindows 10/11 |
| Linux | Linux | |
| ʻĪlio kiaʻi | Hoʻopuka | Hoʻihoʻi hou ʻana o ka ʻōnaehana |
| Ka wā ma waena | Hiki ke hoʻolālā ʻia ma o ka polokalamu mai 1 a 255 kekona | |
| Mekanika | Mea Hoʻopuni | Radiator: Mea hoʻohuihui alumini, Pahu: SGCC |
| Nā Ana | 235mm(L) * 156mm(W) * 66mm(H) me ka ʻole o ka pahu hoʻonui | |
| Kaumaha | ʻUpena: 2.3 kgPahu hoʻonui ʻupena: 1kg | |
| Ke kau ʻana | ʻO ke alahao DIN / Rack mount / Desktop | |
| Kaiapuni | ʻŌnaehana Hoʻopuehu Wela | Hoʻoluʻolu Passive ʻole Fanless |
| Mahana Hana | -20~60℃ (SSD ʻoihana) | |
| Mahana mālama | -40~80℃ (SSD ʻoihana) | |
| Ka Haumākū Pili | 10 a 90% RH (ʻaʻole condensing) | |
| Haʻalulu i ka wā hana | Me ka SSD: IEC 60068-2-64 (3Grms@5~500Hz, kaulele, 1hr/axis) | |
| Pūʻiwa i ka wā hana | Me ka SSD: IEC 60068-2-27 (30G, hapalua sine, 11ms) | |
| Hoʻohālike | TMV-7000 | |
| CPU | CPU | ʻO ka CPU kamepiula ʻo Intel® 6-9th Generation Core / Pentium/ Celeron |
| TDP | 65W | |
| Socket | LGA1151 | |
| ʻO ka Chipset | ʻO ka Chipset | ʻO Intel® Q170/C236 |
| BIOS | BIOS | AMI UEFI BIOS (Kākoʻo i ka Manawa Kiaʻi) |
| Hoʻomanaʻo | Socket | 2 * ʻAʻohe ECC SO-DIMM Slot, Dual Channel DDR4 a hiki i ka 2400MHz |
| Ka Mana Loa | 32GB, Hoʻokahi Max. 16GB | |
| ʻEterona | Luna Hoʻokele | 2 * Intel i210-AT/i211-AT;I219-LM LAN Chip (10/100/1000 Mbps, RJ45)4 * Intel i210-AT LAN Chip (10/100/1000 Mbps, RJ45; kākoʻo POE) |
| Ka Waihona | M.2 | 1 * M.2 (Key-M, kākoʻo 2242/2280 SATA a i ʻole PCIe x4/x2 NVME SSD)1 * M.2 (kī-M, kākoʻo 2242/2280 SATA SSD) |
| Nā Slots Expansin | Pahu hoʻonui | ①6 * COM(30pin Spring-loaded Phoenix terminals, RS232/422/485 koho (koho ʻia e BOM), RS422/485 Optoelectronic isolation function koho)+16 * GPIO(36pin Spring-loaded Phoenix terminals,kākoʻo 8* Optoelectronic isolation input,8* Optoelectronic isolation output (koho relay/opto-isolated output)) |
| ②32 * GPIO(2 * 36pin Spring-loaded plug-in Phoenix terminals, kākoʻo 16 * Optoelectronic isolation input, 16 * Optoelectronic isolation output (koho relay/opto-isolated output)) | ||
| ③4 * nā kahawai kumu kukui (RS232 control), Kākoʻo i ka hoʻoulu ʻana o waho, ka mana hoʻopuka holoʻokoʻa 120W; Kākoʻo ke kahawai hoʻokahi i ka nui o 24V 3A (72W) output, 0-255 stepless dimming, a me ka lohi hoʻoulu o waho <10us)1 * Hoʻokomo mana (4pin 5.08 Phoenix terminals me ka laka) | ||
| Nā memo: Hiki ke hoʻonui ʻia ka pahu hoʻonui ①② i kekahi o nā mea ʻelua, hiki ke hoʻonui ʻia ka pahu hoʻonui ③ a hiki i ʻekolu ma hoʻokahi TMV-7000 | ||
| M.2 | 1 * M.2 (Kī-B, kākoʻo i ka module 3042/3052 4G/5G) | |
| Mini PCIe | 1 * Mini PCIe (kākoʻo WIFI/3G/4G) | |
| I/O mua | ʻEterona | 2 * Intel® GbE(10/100/1000Mbps,RJ45)4 * Intel® GbE (10/100/1000Mbps, RJ45, kākoʻo i ka hana POE koho, kākoʻo iā IEEE 802.3af/ IEEE 802.3at, hoʻokahi awa MAX. a i 30W, huina P = MAX. a i 50W) |
| USB | 4 * USB3.0 (ʻAno-A, 5Gbps) | |
| Hōʻike | 1 * HDMI: hoʻonā kiʻekiʻe a hiki i ka 3840 * 2160 @ 60Hz1 * DP++: hoʻonā kiʻekiʻe a hiki i ka 4096*2304 @ 60Hz | |
| Leo | 2 * 3.5mm Jack (Line-Out + MIC) | |
| Moʻohelu | 2 * RS232 (DB9/M) | |
| SIM | 2 * Kaʻa kāleka Nano SIM (SIM1) | |
| Lako ikehu | Mana Hoʻokomo Mana | 9 ~ 36VDC, P≤240W |
| Kākoʻo OS | Nā puka makani | 6/7th:Windows 7/8.1/108/9thWindows 10/11 |
| Linux | Linux | |
| Mekanika | Nā Ana | 235mm(L) * 156mm(W) * 66mm(H) me ka ʻole o ka pahu hoʻonui |
| Kaiapuni | Mahana Hana | -20~60℃ (SSD ʻoihana) |
| Mahana mālama | -40~80℃ (SSD ʻoihana) | |
| Ka Haumākū Pili | 10 a 90% RH (ʻaʻole condensing) | |
| Haʻalulu i ka wā hana | Me ka SSD: IEC 60068-2-64 (3Grms@5~500Hz, kaulele, 1hr/axis) | |
| Pūʻiwa i ka wā hana | Me ka SSD: IEC 60068-2-27 (30G, hapalua sine, 11ms) | |


Kūpono, palekana a hilinaʻi hoʻi. Hōʻoia kā mākou lako i ka hopena kūpono no kekahi koi. E pōmaikaʻi mai kā mākou ʻike loea i ka ʻoihana a hoʻoulu i ka waiwai i hoʻohui ʻia - i kēlā me kēia lā.
Kaomi No ka Nīnau