
Remote management
Condition monitoring
Remote operation and maintenance
Safety Control
EDGE AI PC APQ TER30X-B3 is an APQ edge AI industrial PC built for industrial automation, machine control, HMI, edge computing, and intelligent equipment projects. The system is based on nvidia ai computing, giving engineers a reliable hardware platform for factories, production lines, inspection systems, embedded control cabinets, and smart manufacturing deployments while keeping the exact product model EDGE AI PC APQ TER30X-B3 clear for product search and procurement. Key features include Intel® 12/13th Gen Core i3/i5/i7 -U/P/H, Support max 45W; 1*GbE,2*10GbE RJ45; 4*USB 5Gbps Type-A,3*USB 2.0 wafer; 4*RS232/RS485,8*GPIO; Wi-Fi、BT、4G/5G; Active Heat Dissipation. These capabilities help EDGE AI PC APQ TER30X-B3 support continuous operation in demanding environments where durable construction, efficient integration, stable I/O, and lifecycle consistency matter. It is suitable for OEM equipment builders, system integrators, automation solution providers, machine vision projects, data acquisition terminals, robotic control systems, and industrial edge computing nodes. Specifications summary: processor/platform: nvidia ai computing; memory: 1 * Non-ECC SO-DIMM Slot, Up to DDR5 5200 MT/s; networking: 1 * Intel® i219-V (10/100/1000 Mbps); display: Intel® Iris® Xe Graphics; I/O and expansion: 1 * M.2 Key-B Slot (USB 5Gbps + USB 2.0, 3052, with 1 * Nano SIM Card Slot). For buyers searching for apq ter30x-b3, edge ai industrial pc, apq, nvidia ai computing, intel 12th/13th gen cpu, dual gigabit lan, EDGE AI PC APQ TER30X-B3 offers a practical balance of performance, expandability, rugged design, and deployment flexibility for modern industrial computing applications.
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Model |
TER30X-B3 |
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Core Modules |
CPU | Support Intel® 12/13th Gen Core i3/i5/i7 -U/P/H, Support max 45W |
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Memory |
Socket | 1 * Non-ECC SO-DIMM Slot, Up to DDR5 5200 MT/s |
| Max Capacity | Max. 32GB | |
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Graphics |
Controller | Intel® Iris® Xe Graphics |
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Ethernet |
Wired Module | 1 * Intel® i219-V (10/100/1000 Mbps) |
| 1 * Intel® i226-V (10/100/1000/2500 Mbps) | ||
| 1 * Intel® X710-AT2 (100/1000/2500/10000 Mbps) | ||
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Storage |
M.2 | 1 * M.2 Key-M Slot (NVMe SSD, 2280) |
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Expansion Slots |
M.2 | 1 * M.2 Key-B Slot (USB 5Gbps + USB 2.0, 3052, with 1 * Nano SIM Card Slot) |
| 1 * M.2 Key-E Slot (PCIe x1 + USB 2.0) | ||
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Front I/O |
Ethernet | 2 * 10GbE (RJ45) |
| 1 * GbE (RJ45) | ||
| USB | 4 * USB 5Gbps (Type-A) | |
| Display | 1 * HDMI: Resolution up to 4096*2304@30Hz (Type-A) | |
| Button | 1 * Power Button + Power LED | |
| 1 * System Reset button | ||
| 1 * System Recover button | ||
| Power Input | 1 * Power Input (2P, P=5.00/5.08, Terminal Block) | |
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Side I/O |
SIM | 1 * Nano SIM Card Slots |
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Internal I/O |
Front Panel | 1 * Front Panel (Power + Reset + Recovery, wafer) |
| Ethernet | 1 * GbE (wafer) | |
| FAN | 1 * System Fan (wafer) | |
| GPIO | 8bit GPIO (OS Configurable DI/DO and H/L, wafer) | |
| Serial | 4 * RS232/485 (Jumper Switch, wafer) | |
| Audio | 1 * Audio (Line_Out + Mic) (wafer) | |
| USB | 3 * USB 2.0 (wafer) | |
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Power Supply |
Type | AT/ATX |
| Power Input Voltage | 12 ~ 28V DC | |
| Connector | 1 * Power Input Connector (2P, P=5.08mm, Terminal Block) | |
| RTC Battery | CR2032 Coin Cell | |
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OS Support |
Linux | Ubuntu22.04 |
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Mechanical |
Enclosure Material | Aluminum alloy |
| Dimensions | 118.2mm(L) * 130mm(W) * 57.6mm(H) | |
| Mounting | Bracket Mounting | |
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Environment |
Heat Dissipation System | Active Fan Cooling |
| Operating Temperature | -20~50℃ (Industrial SSD) | |
| Storage Temperature | -40~80℃ (Industrial SSD) | |
| Relative Humidity | 10 to 95% RH (non-condensing) | |
| Vibration During Operation | 3Grms@5~500Hz, random, 1hr/axis | |
| Shock During Operation | 15G, half sine, 11ms, ±X/Y/Z, 3 shocks/axis | |
Product Size
Product I/O
Effective, safe and reliable. Our equipment guarantees the right solution for any requirement. Benefit from our industry expertise and generate added value - every day.
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