Imikhiqizo

Isilawuli Sokubona Komshini se-TMV-6000/7000

Isilawuli Sokubona Komshini se-TMV-6000/7000

Izici:

  • Sekela i-Intel® 6th kuya ku-9th Core ™ I7/i5/i3 Desktop CPU
  • Kubhangqwe ne-chipset yezinga lezimboni ye-Q170/C236
  • Isibonisi esikabili se-DP+HDMI 4K, esisekela isibonisi esikabili esivumelanisiwe/esingavumelanisiwe
  • Izixhumi ze-USB 3.0 ezingu-4
  • Amachweba amabili e-DB9 serial
  • Izixhumi zenethiwekhi ze-Gigabit eziyi-6, kufaka phakathi ama-POE angu-4 ongawakhetha
  • Ukusekela okokufaka kwamandla kagesi okubanzi okungu-9V ~ 36V
  • Izindlela zokuzikhethela zokususa ukushisa okusebenzayo/okungenzi lutho

  • Ukuphathwa okukude

    Ukuphathwa okukude

  • Ukuqapha isimo

    Ukuqapha isimo

  • Ukusebenza nokugcinwa kude

    Ukusebenza nokugcinwa kude

  • Ukulawula Ukuphepha

    Ukulawula Ukuphepha

Incazelo Yomkhiqizo

Isilawuli sokubona sechungechunge lwe-TMV sisebenzisa umqondo we-modular, sisekela kalula i-Intel Core kusukela esizukulwaneni sesi-6 kuya kwese-11 seziprosesa zeselula/zedeskithophu. Sihlome ngamachweba amaningi e-Gigabit Ethernet kanye ne-POE, kanye ne-GPIO ehlukanisiwe eneziteshi eziningi, amachweba amaningi ahlukanisiwe, kanye namamojula amaningi okulawula umthombo wokukhanya, singasekela ngokuphelele izimo zohlelo lokusebenza lombono olujwayelekile.

Ifakwe i-QDevEyes – ipulatifomu yokusebenza nokulungisa ehlakaniphile yesimo sesicelo se-IPC, ipulatifomu ihlanganisa inqwaba yezinhlelo zokusebenza ezisebenzayo ngezindlela ezine: ukuqapha, ukulawula, ukunakekela, kanye nokusebenza. Ihlinzeka i-IPC ngokuphathwa kweqembu elikude, ukuqapha idivayisi, kanye nemisebenzi yokusebenza nokulungisa ekude, ihlangabezana nezidingo zokusebenza nokulungisa zezimo ezahlukene.

ISINGENISO

Umdwebo Wobunjiniyela

Ukulanda Ifayela

I-TMV-6000
I-TMV-7000
I-TMV-6000
Imodeli I-TMV-6000
I-CPU I-CPU I-Intel® 6-8/11th Generation Core / Pentium/ Celeron mobile CPU
I-TDP 35W
Isokhethi I-SoC
I-Chipset I-Chipset I-Intel® Q170/C236
I-BIOS I-BIOS I-AMI UEFI BIOS (Isibali-sikhathi Sokusekela I-Watchdog)
Inkumbulo Isokhethi Isikhala esingu-1 * esingeyona i-ECC SO-DIMM, i-Dual Channel DDR4 kufika ku-2400MHz
Umthamo Omkhulu 16GB, i-Single Max. 16GB
Ihluzo Isilawuli Ihluzo ze-Intel® HD
I-Ethernet Isilawuli 2 * I-Intel i210-AT/i211-AT;I219-LM LAN Chip (10/100/1000 Mbps, RJ45)I-Intel i210-AT LAN Chip engu-4 * (10/100/1000 Mbps, RJ45; ukwesekwa kwe-POE)
Isitoreji M.2 1 * M.2(Key-M, isekela i-2242/2280 SATA noma i-PCIe x4/x2 NVME SSD)1 * M.2(key-M, ukwesekwa kwe-2242/2280 SATA SSD)
Ama-Slots e-Expansin Ibhokisi lokunweba ①6 * COM(Ama-terminal e-Phoenix afakwe i-spring-loaded angu-30pin, i-RS232/422/485 ongayikhetha (khetha nge-BOM),i-RS422/485 Optoelectronic isolation function ongayikhetha)+16 * I-GPIO(Ama-terminal e-Phoenix afakwe i-spring-loaded angu-36pin, asekela okokufaka okungu-8* kwe-Optoelectronic isolation,8* Okukhiphayo kokuhlukaniswa kwe-Optoelectronic (Okukhiphayo okukhethwayo kokudlulisela/okukhiphayo okukhethwayo okukhethwayo))
②32 * GPIO (2*36pin) Ama-terminal e-Phoenix afakwe i-spring-loaded plug-in, asekela okokufaka okungu-16* kwe-Optoelectronic isolation, 16* okokukhipha okungu-Optoelectronic isolation (Okukhethwa kukho kokukhipha okudluliselwe/okukhipha okuhlukaniswe yi-opto))
③4 * iziteshi zomthombo wokukhanya (ukulawula kwe-RS232, Ukusekela ukuqalisa kwangaphandle, amandla okukhipha aphelele angu-120W; Isiteshi esisodwa sisekela ukukhishwa okuphezulu okungu-24V 3A (72W), ukufiphala okungenazinyathelo okungu-0-255, kanye nokubambezeleka kwesiqalo sangaphandle <10us)1 * Okokufaka amandla (4pin 5.08 Phoenix terminals ekhiyiwe)
Amanothi: Ibhokisi lokunweba ①② linganwetshwa libe linye lalawa amabili, ibhokisi lokunweba ③ linganwetshwa libe mathathu kwelinye i-TMV-7000
M.2 1 * M.2 (Ukhiye-B, ukwesekwa kwemojuli engu-3042/3052 4G/5G)
I-Mini PCIe I-1 * Mini PCIe (isekela i-WIFI/3G/4G)
I-I/O yangaphambili I-Ethernet 2 * Intel® GbE(10/100/1000Mbps,RJ45)4 * Intel® GbE(10/100/1000Mbps,RJ45, ukusekela umsebenzi we-POE ongakukhetha, ukusekela i-IEEE 802.3af/ IEEE 802.3at, imbobo eyodwa MAX. kuya ku-30W, inani eliphelele P=MAX. kuya ku-50W)
I-USB 4 * USB3.0 (Uhlobo-A, 5Gbps)
Isibonisi 1 *HDMI: ukulungiswa okuphezulu kufika ku-3840*2160 @ 60Hz1 * DP++: isinqumo esiphezulu sifinyelela ku-4096*2304 @ 60Hz
Umsindo I-Jack engu-2 * 3.5mm (Umugqa Wokuphuma + I-MIC)
Uchungechunge 2 * RS232 (DB9/M)
I-SIM Isikhala sekhadi le-Nano SIM esingu-2 * (SIM1)
I-I/O yangemuva I-Antenna 4 * Umgodi we-antenna
Ukunikezwa kwamandla kagesi Uhlobo i-DC,
Amandla Okufaka I-Voltage 9 ~ 36VDC, P≤240W
Isixhumi Isixhumi esingu-1 * 4Pin, P=5.00/5.08
Ibhethri le-RTC Iseli Yezinhlamvu Ze-CR2032
Usekelo lwe-OS Amafasitela 6/7th:I-Windows 7/8.1/108/9th: I-Windows 10/11
I-Linux I-Linux
Inja eqaphayo Umphumela Ukusetha kabusha uhlelo
Isikhawu Kungahlelwa ngeSoftware kusukela ku-1 kuya ku-255 sec
Okwemishini Izinto Zokufaka Irediyetha: Ingxubevange ye-aluminium, Ibhokisi: SGCC
Ubukhulu 235mm(L) * 156mm(W) * 66mm(H) ngaphandle kwebhokisi lokunweba
Isisindo Inethi: 2.3 kgIbhokisi Lokukhulisa Inethi: 1kg
Ukufaka Isitimela se-DIN/Ukufaka i-Rack / Ideskithophu
Indawo ezungezile Uhlelo Lokushabalalisa Ukushisa Ukupholisa Okungenamoya Okungenafeni
Izinga Lokushisa Lokusebenza -20~60℃ (i-SSD Yezimboni)
Izinga Lokushisa Lesitoreji -40~80℃ (i-SSD Yezimboni)
Umswakama Olinganiselwe 10 kuya ku-90% RH (ayinciphisi)
Ukudlidliza Ngesikhathi Sokusebenza Nge-SSD: IEC 60068-2-64 (3Grms@5~500Hz, okungahleliwe, ihora eli-1/eksisi)
Ukushaqeka Ngesikhathi Sokusebenza Nge-SSD: IEC 60068-2-27 (30G, i-half sine, 11ms)
I-TMV-7000
Imodeli I-TMV-7000
I-CPU I-CPU I-Intel® 6-9th Generation Core / Pentium/ Celeron Desktop CPU
I-TDP 65W
Isokhethi I-LGA1151
I-Chipset I-Chipset I-Intel® Q170/C236
I-BIOS I-BIOS I-AMI UEFI BIOS (Isibali-sikhathi Sokusekela I-Watchdog)
Inkumbulo Isokhethi Isikhala se-2 * esingeyona i-ECC SO-DIMM, i-Dual Channel DDR4 kufika ku-2400MHz
Umthamo Omkhulu 32GB, i-Single Max. 16GB
I-Ethernet Isilawuli 2 * I-Intel i210-AT/i211-AT;I219-LM LAN Chip (10/100/1000 Mbps, RJ45)I-Intel i210-AT LAN Chip engu-4 * (10/100/1000 Mbps, RJ45; ukwesekwa kwe-POE)
Isitoreji M.2 1 * M.2(Key-M, isekela i-2242/2280 SATA noma i-PCIe x4/x2 NVME SSD)1 * M.2(key-M, ukwesekwa kwe-2242/2280 SATA SSD)
Ama-Slots e-Expansin Ibhokisi lokunweba ①6 * COM(Ama-terminal e-Phoenix afakwe i-spring-loaded angu-30pin, i-RS232/422/485 ongayikhetha (khetha nge-BOM),i-RS422/485 Optoelectronic isolation function ongayikhetha)+16 * I-GPIO(Ama-terminal e-Phoenix afakwe i-spring-loaded angu-36pin, asekela okokufaka okungu-8* kwe-Optoelectronic isolation,8* Okukhiphayo kokuhlukaniswa kwe-Optoelectronic (Okukhiphayo okukhethwayo kokudlulisela/okukhiphayo okukhethwayo okukhethwayo))
②32 * GPIO (2*36pin) Ama-terminal e-Phoenix afakwe i-spring-loaded plug-in, asekela okokufaka okungu-16* kwe-Optoelectronic isolation, 16* okokukhipha okungu-Optoelectronic isolation (Okukhethwa kukho kokukhipha okudluliselwe/okukhipha okuhlukaniswe yi-opto))
③4 * iziteshi zomthombo wokukhanya (ukulawula kwe-RS232, Ukusekela ukuqalisa kwangaphandle, amandla okukhipha aphelele angu-120W; Isiteshi esisodwa sisekela ukukhishwa okuphezulu okungu-24V 3A (72W), ukufiphala okungenazinyathelo okungu-0-255, kanye nokubambezeleka kwesiqalo sangaphandle <10us)1 * Okokufaka amandla (4pin 5.08 Phoenix terminals ekhiyiwe)
Amanothi: Ibhokisi lokunweba ①② linganwetshwa libe linye lalawa amabili, ibhokisi lokunweba ③ linganwetshwa libe mathathu kwelinye i-TMV-7000
M.2 1 * M.2 (Ukhiye-B, ukwesekwa kwemojuli engu-3042/3052 4G/5G)
I-Mini PCIe I-1 * Mini PCIe (isekela i-WIFI/3G/4G)
I-I/O yangaphambili I-Ethernet 2 * Intel® GbE(10/100/1000Mbps,RJ45)4 * Intel® GbE(10/100/1000Mbps,RJ45, ukusekela umsebenzi we-POE ongakukhetha, ukusekela i-IEEE 802.3af/ IEEE 802.3at, imbobo eyodwa MAX. kuya ku-30W, inani eliphelele P=MAX. kuya ku-50W)
I-USB 4 * USB3.0 (Uhlobo-A, 5Gbps)
Isibonisi 1 *HDMI: ukulungiswa okuphezulu kufika ku-3840*2160 @ 60Hz1 * DP++: isinqumo esiphezulu sifinyelela ku-4096*2304 @ 60Hz
Umsindo I-Jack engu-2 * 3.5mm (Umugqa Wokuphuma + I-MIC)
Uchungechunge 2 * RS232 (DB9/M)
I-SIM Isikhala sekhadi le-Nano SIM esingu-2 * (SIM1)
Ukunikezwa kwamandla kagesi Amandla Okufaka I-Voltage 9 ~ 36VDC, P≤240W
Usekelo lwe-OS Amafasitela 6/7th:I-Windows 7/8.1/108/9th: I-Windows 10/11
I-Linux I-Linux
Okwemishini Ubukhulu 235mm(L) * 156mm(W) * 66mm(H) ngaphandle kwebhokisi lokunweba
Indawo ezungezile Izinga Lokushisa Lokusebenza -20~60℃ (i-SSD Yezimboni)
Izinga Lokushisa Lesitoreji -40~80℃ (i-SSD Yezimboni)
Umswakama Olinganiselwe 10 kuya ku-90% RH (ayinciphisi)
Ukudlidliza Ngesikhathi Sokusebenza Nge-SSD: IEC 60068-2-64 (3Grms@5~500Hz, okungahleliwe, ihora eli-1/eksisi)
Ukushaqeka Ngesikhathi Sokusebenza Nge-SSD: IEC 60068-2-27 (30G, i-half sine, 11ms)

I-ATT-H31C

I-TMV-6000_20231226_00

I-TMV-7000

I-TMV-7000_20231226_00

  • I-TMV-6000_SpecSheet_APQ
    I-TMV-6000_SpecSheet_APQ
    LANDA
  • I-TMV-7000_SpecSheet_APQ
    I-TMV-7000_SpecSheet_APQ
    LANDA
  • THOLA AMASAMPULA

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