Products

EDGE AI PC APQ TER30J-B3

EDGE AI PC APQ TER30J-B3

Features:

  • NVIDIA® Jetson AGX Orin, up to 275TOPS

  • 2*GbE,1*10GbE RJ45
  • 3*USB 10Gbps,5*USB 5Gbps Type-A
  • 2*RS232/RS485,2*CAN FD,8*GPIO
  • Wi-Fi、BT、4G/5G
  • Active Heat Dissipation
  • 12~28V DC


  • Remote management

    Remote management

  • Condition monitoring

    Condition monitoring

  • Remote operation and maintenance

    Remote operation and maintenance

  • Safety Control

    Safety Control

INTRODUCTION

Engineering Drawing

File Download

Model

TER30J-B3

Core Modules

Jetson AGX Orin 32GB, 200 TOPS Jetson AGX Orin 64GB, 275 TOPS

Ethernet

Controller 1 * Marvell® AQR113C,10/100/1000/2500/5000/10000 Mbps
1 * Marvell® 88E1512,10/100/1000 Mbps
2 * Intel® i226-V/LM,10/100/1000/2500 Mbps

Storage

M.2 1 * M.2 Key-M Slot (NVMe SSD, 2280)
TF 1 * TF Card Slot

Expansion Slots

M.2 1 * M.2 Key-B Slot (USB 5Gbps + USB 2.0, 3052, with 1 * Nano SIM Card Slot)
1 * M.2 Key-E Slot (PCIe x1 + USB 2.0)

Front I/O

Ethernet 1 * 10GbE (RJ45)
2 * GbE (RJ45)
USB 3 * USB 10Gbps (Type-A)
5 * USB 5Gbps (Type-A)
Display 1 * HDMI: Resolution up to 4096*2304@30Hz (Type-A)
LED 1 * System Status LED
Button 1 * Power Button + Power LED
1 * System Reset button
1 * System Recovery button
Power Input 1 * Power Input (2P, P=5.00/5.08, Terminal Block)

Side I/O

OTG 1 * USB 2.0 (Type-C, Flashing port)
Debug 1 * USB 2.0 (Type-C, Debug port)
TF 1 * TF Card Slot
SIM 1 * Nano SIM Card Slots

Internal I/O

Front Panel 1 * Front Panel (Power + Reset + Recovery, wafer)
Docking Ethernet (88E1512) + Debug (Uart) + OTG (USB 2.0) + GPIO
FAN 1 * System Fan (wafer)
GPIO 8bit GPIO (OS Configurable DI/DO and H/L, wafer)
Serial 2 * RS232/485 (Jumper Switch, wafer)
1 * TTL (wafer)
Audio 1 * Audio (Line_Out + Mic) (wafer)

Power Supply

Type AT/ATX
Power Input Voltage 12 ~ 28V DC
Connector 1 * Power Input Connector (2P, P=5.08mm, Terminal Block)
RTC Battery CR2032 Coin Cell

OS Support

Linux Jetpack6.2 (Ubuntu22.04)

Mechanical

Enclosure Material Aluminum alloy
Dimensions 118.2mm(L) * 130mm(W) * 57.6mm(H)
Mounting Bracket Mounting

Environment

Heat Dissipation System Active Fan Cooling
Operating Temperature -20~50℃ (Industrial SSD)
Storage Temperature -40~80℃ (Industrial SSD)
Relative Humidity 10 to 95% RH (non-condensing)
Vibration During Operation 3Grms@5~500Hz, random, 1hr/axis
Shock During Operation 15G, half sine, 11ms, ±X/Y/Z, 3 shocks/axis

 

Product Size

1

Product I/O

2

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