EDGE AI PC APQ TER30X-B3
Remote management
Condition monitoring
Remote operation and maintenance
Safety Control
CONTACT US|
Model |
TER30X-B3 |
|
|
Core Modules |
CPU | Support Intel® 12/13th Gen Core i3/i5/i7 -U/P/H, Support max 45W |
|
Memory |
Socket | 1 * Non-ECC SO-DIMM Slot, Up to DDR5 5200 MT/s |
| Max Capacity | Max. 32GB | |
|
Graphics |
Controller | Intel® Iris® Xe Graphics |
|
Ethernet |
Wired Module | 1 * Intel® i219-V (10/100/1000 Mbps) |
| 1 * Intel® i226-V (10/100/1000/2500 Mbps) | ||
| 1 * Intel® X710-AT2 (100/1000/2500/10000 Mbps) | ||
|
Storage |
M.2 | 1 * M.2 Key-M Slot (NVMe SSD, 2280) |
|
Expansion Slots |
M.2 | 1 * M.2 Key-B Slot (USB 5Gbps + USB 2.0, 3052, with 1 * Nano SIM Card Slot) |
| 1 * M.2 Key-E Slot (PCIe x1 + USB 2.0) | ||
|
Front I/O |
Ethernet | 2 * 10GbE (RJ45) |
| 1 * GbE (RJ45) | ||
| USB | 4 * USB 5Gbps (Type-A) | |
| Display | 1 * HDMI: Resolution up to 4096*2304@30Hz (Type-A) | |
| Button | 1 * Power Button + Power LED | |
| 1 * System Reset button | ||
| 1 * System Recover button | ||
| Power Input | 1 * Power Input (2P, P=5.00/5.08, Terminal Block) | |
|
Side I/O |
SIM | 1 * Nano SIM Card Slots |
|
Internal I/O |
Front Panel | 1 * Front Panel (Power + Reset + Recovery, wafer) |
| Ethernet | 1 * GbE (wafer) | |
| FAN | 1 * System Fan (wafer) | |
| GPIO | 8bit GPIO (OS Configurable DI/DO and H/L, wafer) | |
| Serial | 4 * RS232/485 (Jumper Switch, wafer) | |
| Audio | 1 * Audio (Line_Out + Mic) (wafer) | |
| USB | 3 * USB 2.0 (wafer) | |
|
Power Supply |
Type | AT/ATX |
| Power Input Voltage | 12 ~ 28V DC | |
| Connector | 1 * Power Input Connector (2P, P=5.08mm, Terminal Block) | |
| RTC Battery | CR2032 Coin Cell | |
|
OS Support |
Linux | Ubuntu22.04 |
|
Mechanical |
Enclosure Material | Aluminum alloy |
| Dimensions | 118.2mm(L) * 130mm(W) * 57.6mm(H) | |
| Mounting | Bracket Mounting | |
|
Environment |
Heat Dissipation System | Active Fan Cooling |
| Operating Temperature | -20~50℃ (Industrial SSD) | |
| Storage Temperature | -40~80℃ (Industrial SSD) | |
| Relative Humidity | 10 to 95% RH (non-condensing) | |
| Vibration During Operation | 3Grms@5~500Hz, random, 1hr/axis | |
| Shock During Operation | 15G, half sine, 11ms, ±X/Y/Z, 3 shocks/axis | |
Product Size
Product I/O
OBTAIN SAMPLES
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