Nekuburitswa kukuru kwe "Tao (τ) Law" neHuawei musi wa25 Chivabvu gore rino, ichitsiva "geometric scaling" yechinyakare ne "time scaling", indasitiri iyi iri kuramba ichideredza latency yekupararira kwemasaini uye kuwedzera zvakanyanya huwandu hwe transistor. Izvi zvinovhura zviri pamutemo nguva itsva umo indasitiri ye semiconductor yeChina inochinja kubva "pakutevera mitemo" kuenda ku "paradigms dzinotungamira." Panguva imwe chete, madhipatimendi mashanu anosanganisira National Development and Reform Commission akaramba achiwedzera rutsigiro rwemitero yegore ra2026, uye michina yekuongorora semiconductor yave pachena kuti iri mu "15th Five-Year Plan" strategic emergency industry breakthrough list. Kukura katatu kwe "kudiwa kuri kuwedzera + rutsigiro rwakasimba rwemitemo + kukurumidza kutsiva kwemukati" kwakagadzira hwindo rakakosha rekubudirira nekukurumidza kwemidziyo yekuedza semiconductor yakagadzirwa yakazvimiririra muChina.
Zvichitungamirirwa nekushanduka kwemaindasitiri uye mutemo wenyika, michina yekuongorora mawafer e semiconductor, sezvo zvivakwa zvinodzora goho zvichisanganisira dhizaini yemachip, kugadzira mawafer, kurongedza, uye kuyedza, zviri kupinda munguva ye "kudzoreredzwa kwenyika yese + kukurumidza kutsiva kwemuno." Sezvo maitiro e semiconductor achifambira mberi akananga ku nanometer uye kunyange atomic scale, zvikanganiso zvidiki pazvigadziko zvewafer, zvakaita sekukwenya, zvidimbu, makomba, uye tsvina, zvine mhedzisiro yakanyanya pagoho remachip. Mukuongorora mawafer, michina ye automated optical inspection (AOI) inofanirwa kugadzirisa huwandu hwakawanda hwedata remifananidzo re high-resolution munguva chaiyo, ichiisa zvinodiwa zvakasimba pasimba rekombuta, kuwedzera, kugadzikana, uye kuchinjika kwenharaunda kwechikamu chikuru chekombuta.
Mupi wezvigadziriso zvemumba anonyanya kugadzira michina yekuongorora semiconductor aida michina yake yekuongorora zvikanganiso zvewafer kuti isangane nezvinodiwa zvekuchenesa zvakanyanya uku achigonesa kutenga nekukurumidza kubva kumakamera akawanda, kushanda kweAI defect recognition algorithms panguva chaiyo, uye kugadzirwa kwe24/7 pasina kukanganiswa. Saka, mutengi akatsanangura zvinodiwa zvakajeka zvekombuta huru yeindasitiri.
Dambudziko reVatengi
Muchirongwa chekuvandudza michina yekuongorora wafer yemutengi, matambudziko makuru anotevera akaonekwa:
1. Zvinodiwa zvekuongorora zvakanyatsonaka panguva chaiyo:Sisitimu iyi yaifanira kugadzirisa mifananidzo yewafer surface yakatorwa nemakamera akawanda eindasitiri ane resolution yepamusoro uye kuona zvikanganiso zve micron zvakaita sekukwenya, zvidimbu, uye mavara panguva chaiyo.
2. Kusakwanisa kuwedzera zvakakwana:Midziyo inodiwa kubatanidza makamera akawanda eindasitiri, makadhi ekudzora kufamba, makadhi ekutora data, vanodzora chiedza, nezvimwe zvishandiso zvePCIe/PCI panguva imwe chete.
3. Kugadzikana uye kuvimbika:Mitsetse yekugadzira semiconductor inoda kushanda nguva dzose maawa makumi maviri nemana pazuva, mazuva manomwe pasvondo, uye chero nguva isingatarisirwi yekumira inogona kukonzera kurasikirwa kukuru. Midziyo iyi inofanirwawo kugadziriswa kuti ienderane nenzvimbo dzekuchenesa dzewafer-fab dzinoenderana neISO 14644-1 uye dziviriro yakasimba yeESD.
4. Zvinodiwa zvekuchengetedzwa kwedata:Data rekuongorora raida kuchengetwa kwenguva refu, nerutsigiro rweRAID array kudzivirira kurasikirwa kwedata kunokonzerwa nekukundikana kwedhiraivha imwe chete.
Mhinduro yeAPQ
Zvichibva pane zvinodiwa izvi, APQ yakapa mutengi mhinduro yekuongorora defect wafer ichishandisa IPC350-Q670SA2 wafer-mounted wafer inspection industrial computer sechikamu chikuru che computing. Mhinduro iyi inopa mabhenefiti anotevera:
01 Kushanda nesimba kwekombiyuta pakuongorora panguva chaiyo
IPC350-Q670SA2 ine Intel® 12th/13th/14th Gen Core/Pentium/Celeron desktop CPUs uye 4 × DDR5 memory slots, zvichitsigira kusvika 192 GB. Inogona kubata nyore nyore kugadziriswa kwedata guru remifananidzo panguva chaiyo uye parallel inference ye complex vision algorithms mu wafer inspection scenarios. Ingave ichiona mavanga madiki kana kuongorora nanoscale crystal defects, inopa rutsigiro rwekombiyuta runodiwa kuti mhinduro ishande panguva chaiyo.
02 Kuwedzera kukuru kwezvirongwa zvekuongorora zvakawanda
Nzvimbo 7 dzekuwedzera dzakareba: dzinosanganisira 2 × PCIe x16, 3 × PCIe x4, uye 2 × PCI, zvichizadzisa kudiwa kwekubatanidza makamera akawanda anomhanya zvakanyanya, makadhi ekudzora kufamba, uye makadhi ekukurumidzira eGPU panguva imwe chete mumidziyo yekuongorora wafer.
1 × M.2 Key-E inotsigira mamodule eWi-Fi/Bluetooth kuti zvive nyore kuwedzera waya.
Chinochengetedza makadhi ePCIe chisina zvishandiso chine dhizaini inodzivirira kudedera yakakodzera nzvimbo yekudedera kudiki yemaworkshops ewafer-fab.
03 Nzvimbo dzeI/O dzakapfuma kuti zvive nyore kubatanidzwa kwesystem
Kumashure: 2 × RJ45 Gigabit Ethernet ports, 6 × USB 5 Gbps, 1 × RS232, uye inobuda ne triple-display kuburikidza ne HDMI/VGA/DVI-D, zvichitsigira kubatana panguva imwe chete kwe light source controllers, makamera, ma monitor, uye ma PLC.
Mberi: 2 × USB, switch yemagetsi, uye zviratidzo zvemamiriro ezvinhu kuti zvive nyore kugadzirisa nekugadzirisa zviri nyore panzvimbo.
Zvemukati: 5 × USB, 5 × COM ports dzine sarudzo yeRS232/485/422, uye 8-channel GPIO, zvichibvumira kubatana kune masensa akasiyana-siyana nema actuator pasina kuwedzera kuwedzera uye zvichideredza zvakanyanya kuoma kwekubatanidzwa kwesisitimu.
04 Kuvimbika kwemaindasitiri munzvimbo dzakaoma
Chassis yesimbi yakazara negalvanized inodzivirira kukanganiswa kwemagetsi uye inoshanda nekugadzira pasi kuti ipe dziviriro yekutanga yeESD.
Dhizaini yemhepo yakazvimirira: kutonhora kwakangwara neCPU fan nesystem fan, zvichitsigira tembiricha yekushanda ye0-50°C uye kuchengetedza kugadzikana kwekupisa kunyangwe kana paine kuongororwa kwenguva refu uye mutoro wakawanda.
Madhiraivha maviri anodzivirira kuvhunduka ane 3.5-inch anotsigira kuiswa kwemaSSD anomhanya zvakanyanya uye maHDD ane simba guru, zvichizadzisa zvinodiwa zvekuchengetedza data rekuongorora kwenguva refu uye kuchengetedza data rakachengeteka, neRAID arrays inogadziriswa.
Chassis diki ye4U, ine hurefu hwe330 × 351 × 180 mm, inotsigira kuiswa pamadziro uye pakombiyuta, ichichinjika nyore nyore kurongeka kwakasiyana kwemidziyo yekuongorora.
Kukosha Kwekubudirira:
Nekuunza APQ IPC350-Q670SA2, mupi wemhinduro dzemichina yekuongorora semiconductor akabudirira kuita zvinotevera:
Kubudirira kwekuongorora kwakawedzera zvakanyanya:
Kubatanidzwa kweCPU inoshanda zvakanyanya uye ndangariro ine simba guru kunovandudza mashandiro ealgorithms ekuziva defects dzeAI, zvichiita kuti wafer inspection throughput isangane nezvinodiwa pamutsetse wekugadzira.
Kuderera kwekuoma kwekubatanidzwa kwehurongwa:Nzvimbo nomwe dzekuwedzera dzakareba uye nzvimbo dzakapfuma dzeI/O dzinogonesa kubatanidzwa kwemakamera, makadhi ekutenga, makadhi ekufambisa, maPLC, nezvimwe zvishandiso nemuchina mumwe chete, zvichiita kuti magadzirirwo ehurongwa ave nyore uye kuvandudza kuvimbika kwemuchina wese.
Kugadzirwa kunoramba kuripo kwakavimbiswa:Kuvimbika kwemaindasitiri, kutonhora kwakangwara, uye nzira dzekuchengetedza data dzakavakirwa paRAID dzinoita kuti mashandiro aro agare akasimba maawa makumi maviri nemana pazuva, mazuva manomwe pasvondo, zvichiita kuti mwero wekukundikana pamwedzi uve wakaderera zvikuru.
Kushandiswa kwakachinjika uye kuchengetedza nzvimbo:Chassis diki ye4U inotsigira kuiswa pamadziro uye inogona kubatanidzwa mumakabati emidziyo yekuongorora diki, zvichipa vatengi rusununguko rwakakura mukurongeka kwemitsara yekugadzira.
Nguva yekutumira: Chikumi-04-2026
